JPS6311281A - Manufacture for electrocast sharp-edged grindstone - Google Patents
Manufacture for electrocast sharp-edged grindstoneInfo
- Publication number
- JPS6311281A JPS6311281A JP15705386A JP15705386A JPS6311281A JP S6311281 A JPS6311281 A JP S6311281A JP 15705386 A JP15705386 A JP 15705386A JP 15705386 A JP15705386 A JP 15705386A JP S6311281 A JPS6311281 A JP S6311281A
- Authority
- JP
- Japan
- Prior art keywords
- abrasive grain
- grain layer
- forming
- abrasive
- metal plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 239000006061 abrasive grain Substances 0.000 claims abstract description 61
- 239000000758 substrate Substances 0.000 claims abstract description 43
- 238000007747 plating Methods 0.000 claims abstract description 42
- 239000002184 metal Substances 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims description 13
- 238000005520 cutting process Methods 0.000 abstract description 13
- 239000004575 stone Substances 0.000 abstract 1
- 229910003460 diamond Inorganic materials 0.000 description 5
- 239000010432 diamond Substances 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-M sulfamate Chemical compound NS([O-])(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-M 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
【発明の詳細な説明】
「産業上の利用分野」
本発明は、特にシリコンやフェライト等の被削材におけ
る高精度の切断加工や溝入れ加工に用いられろ電鋳薄刃
砥石の製造方法に関するものである。[Detailed Description of the Invention] "Industrial Application Field" The present invention relates to a method for manufacturing an electroformed thin-blade grindstone used for high-precision cutting and grooving of work materials such as silicon and ferrite. It is.
「従来の技術」
第4図は、この種の電鋳薄刃砥石lの使用態様を示す図
である。"Prior Art" FIG. 4 is a diagram showing how this type of electroformed thin-blade grindstone 1 is used.
この電鋳薄刃砥石lは、NlやCoあるいはそれらの合
金からなる金属メッキ相中に、ダイヤモンドやCBS等
の超砥粒を分散して形成された、厚さ数十μ次〜数百μ
肩の輪環薄板状のものである。This electroformed thin-blade grindstone is made by dispersing superabrasive grains such as diamond or CBS in a metal plating phase made of Nl, Co, or their alloys, and has a thickness of several tens of microns to several hundred microns.
It is a lamina-like ring on the shoulder.
そして、この電鋳薄刃砥石1は、両側面に配設された一
対の取付用フランジ2,2間に挾まれたうえ、軸線まわ
りに回転される砥石軸4にナツト3によって締め付は固
定され、使用に供5れろ。This electroformed thin-blade grindstone 1 is sandwiched between a pair of mounting flanges 2 provided on both sides, and is fixed by a nut 3 to a grindstone shaft 4 that rotates around its axis. Please make it available for use.
従来、このような電鋳薄刃砥石の製造は、次のように行
なわれている。Conventionally, such electroformed thin-blade grindstones have been manufactured as follows.
先ず、メッキ浴内において、ステンレス鋼製の平面基板
の表面にNi、Co等の金属メッキ相を析出させつつ、
この金属メッキ相内にダイヤモンド等の超砥粒を分散さ
せて砥粒層を形成する。First, in a plating bath, a metal plating phase such as Ni or Co is precipitated on the surface of a stainless steel flat substrate, while
Superabrasive grains such as diamond are dispersed in this metal plating phase to form an abrasive grain layer.
次いで、この砥粒層を平面基板から剥離し、所定の砥石
形状に整形することにより、電鋳薄刃砥石を得る。Next, this abrasive layer is peeled off from the flat substrate and shaped into a predetermined shape of the abrasive, thereby obtaining an electroformed thin-blade abrasive.
「発明が解決しようとする問題点」
ところで、上記の方法によって製造された電鋳薄刃砥石
は、先ず平面基板の表面にメッキを施して形成したのち
、この平面基板から剥がして得られるものなので、第5
図に示すように平面基板に接していた表面IAにおいて
は、金属メッキ相5から超砥粒6・・・が全く突出して
いない。このため、切削に際して、この表面IAは切れ
味が悪く、特に切削初期において被削材にチッピングや
いわゆるムシリを発生しやすいという問題点があった。"Problems to be Solved by the Invention" By the way, the electroformed thin-blade grindstone manufactured by the above method is obtained by first plating the surface of a flat substrate and then peeling it off from the flat substrate. Fifth
As shown in the figure, on the surface IA that was in contact with the flat substrate, the superabrasive grains 6 do not protrude from the metal plating phase 5 at all. Therefore, during cutting, this surface IA has poor sharpness, and there is a problem in that chipping or so-called sluggishness is likely to occur in the workpiece, especially in the initial stage of cutting.
また、前記電鋳薄刃砥石の製造方法では、金属メッキ相
5を平面基板上に析出させていく過程において、メッキ
相5内に応力が累積されていき、製・造後の電鋳薄刃砥
石に反りが生じやすいという欠点があった。In addition, in the method for manufacturing the electroformed thin-blade grindstone, stress is accumulated in the plating phase 5 during the process of depositing the metal plating phase 5 on the flat substrate, and the electroformed thin-blade grindstone after manufacturing There was a drawback that warpage was likely to occur.
「発明の目的」
本発明は上記事情に鑑みてなされたもので、切削開始当
初から切れ味に優れ、被削材にチッピングやムンリを生
じることがなく、しかも反りが生じにくく高い加工精度
が得られる電鋳薄刃砥石を製造することができる電鋳薄
刃砥石の製造方法を提供することを目的とする。``Purpose of the Invention'' The present invention was made in view of the above circumstances, and provides excellent cutting performance from the beginning of cutting, does not cause chipping or dullness in the workpiece, and is less likely to warp and achieves high machining accuracy. An object of the present invention is to provide a method for manufacturing an electroformed thin-blade grindstone that can produce an electroformed thin-blade grindstone.
「問題点を解決するための手段」
本発明の電鋳薄刃砥石の製造方法は、平面基板上に、表
面から超砥粒の一部が突出した砥粒層を形成した後、こ
の砥粒層を平面基板から剥離し、この砥粒層の平面基板
に接していた面に再び金属メッキ相を形成しつつ、この
金属メッキ相内に超砥粒を分散させて表面から超砥粒の
一部が突出した砥粒層を形成することを特徴とする。"Means for Solving the Problems" The method for manufacturing an electroformed thin-edged grindstone of the present invention involves forming an abrasive grain layer on a flat substrate in which a portion of the superabrasive grains protrudes from the surface, and then forming the abrasive grain layer. is peeled off from the flat substrate, and while a metal plating phase is formed again on the surface of this abrasive grain layer that was in contact with the flat substrate, superabrasive grains are dispersed within this metal plating phase, and some of the superabrasive grains are removed from the surface. It is characterized by forming a layer of abrasive grains with protrusions.
「実施例」
以下、本発明の一実施例を図面を用いて詳細に説明する
。"Example" Hereinafter, an example of the present invention will be described in detail using the drawings.
第1図および第2図は、それぞれ本発明の電鋳薄刃砥石
の製造方法の一例を実施するための装置を示すものであ
る。FIG. 1 and FIG. 2 each show an apparatus for carrying out an example of the method for manufacturing an electroformed thin-blade grindstone of the present invention.
図中符号IOはメッキ槽であり、このメッキ槽10内に
は、Ni、Cc等の金属イオンを含むメッキ液Mが満た
されている。また、このメッキ槽lOには、図示しない
超音波撹拌機等の撹拌機が配設されており、メッキ液M
の撹拌がなされるようになっている。Reference numeral IO in the figure indicates a plating tank, and the plating tank 10 is filled with a plating solution M containing metal ions such as Ni and Cc. In addition, a stirrer such as an ultrasonic stirrer (not shown) is installed in this plating tank IO, and the plating solution M
Stirring is performed.
メッキ槽10内には、非導電性の台座11が水平に配置
されており、この台座li上には、ステンレス製の平面
基板12が載置されている。この平面基板12の上面に
は、製造すべき砥石の原型形状をなす部分を残してマス
キングが施されている。また、平面基板12の上方には
、平面基板12と平行に陽極板13が配置され、図示し
ない電源の陽極に接続されている。A non-conductive pedestal 11 is arranged horizontally in the plating tank 10, and a stainless steel flat substrate 12 is placed on the pedestal li. The upper surface of this flat substrate 12 is masked, leaving a portion forming the prototype shape of the grindstone to be manufactured. Further, above the flat substrate 12, an anode plate 13 is arranged parallel to the flat substrate 12, and is connected to an anode of a power source (not shown).
電鋳薄刃砥石を製造する際には、まず第1図に示すよう
に、メッキ槽IO内のメッキ液Mに、所定量の超砥粒を
添加し、超音波撹拌機によってメッキ液M中に均一に分
散させる。次いで、平面基板12を電源の陰極に接続し
て陽極板13との間に通電し、平面基板12上に金属メ
ッキ相を析出させつつ、この金属メッキ相内に超砥粒を
均一に分散させて砥粒層14を形成する。When manufacturing an electroformed thin-blade grindstone, first, as shown in Fig. 1, a predetermined amount of superabrasive grains is added to the plating solution M in the plating tank IO, and then added to the plating solution M using an ultrasonic stirrer. Distribute evenly. Next, the flat substrate 12 is connected to the cathode of a power source and electricity is applied between it and the anode plate 13 to precipitate a metal plating phase on the flat substrate 12 while uniformly dispersing the superabrasive grains within this metal plating phase. Then, an abrasive layer 14 is formed.
そして、この砥粒層14が、最終的に成形すべき電鋳薄
刃砥石肉厚の1/2にできるだけ近く、しかも平面基板
11からの引き剥がしに十分耐えうる強度を有する肉厚
になったら通電を停止し、平面基板12から砥粒層14
を引き剥がす。なお、最終的に製造すべき電鋳薄刃砥石
の肉厚が薄く、その略1/2の肉厚の砥粒層を平面基板
から損傷な(剥離させることが困難な場合には、損傷す
ることなく剥離できる肉厚になってからでよい。こうし
て得られた砥粒層14は、その一方の表面14Aからの
み超砥粒が突出している。Then, when this abrasive grain layer 14 has a thickness as close as possible to 1/2 of the thickness of the electroformed thin-blade grindstone to be finally formed, and has enough strength to withstand peeling off from the flat substrate 11, energization is applied. is stopped, and the abrasive grain layer 14 is removed from the flat substrate 12.
tear it off. Note that the electroformed thin-blade grindstone to be finally manufactured has a thin wall thickness, and the abrasive grain layer of approximately 1/2 of that thickness may be damaged (or damaged if it is difficult to peel off) from the flat substrate. This may be done after the abrasive grain layer 14 has a thickness that allows it to be peeled off without any problem.The abrasive grain layer 14 thus obtained has superabrasive grains protruding only from one surface 14A thereof.
次に、剥離させた砥粒層14の、超砥粒が突出していな
い表面14B上に、再度、超砥粒を分散させた砥粒層を
形成する。Next, an abrasive layer in which superabrasive grains are dispersed is again formed on the surface 14B of the peeled abrasive grain layer 14 from which the superabrasive grains do not protrude.
まず、第2図に示すように、先程のメッキ槽IO内に、
中央に雌ネジ孔を有する平面基板17を配置する。そし
て、この平面基板17上に、超砥粒が突出した表面14
Aが平面基板17に接するように砥粒層14を載置する
。First, as shown in Figure 2, in the plating tank IO,
A flat substrate 17 having a female screw hole in the center is arranged. Then, on this flat substrate 17, a surface 14 on which superabrasive grains protrude
The abrasive grain layer 14 is placed so that A is in contact with the flat substrate 17.
次いで、この砥粒層14の中央に形成されている取付孔
を通して、ステンレス製の固定ネジ16を平面基板17
にねじ込む。この固定ネジ16は、砥粒層14を押さえ
付けるためのフランジ部16Aを有し、−二のフランジ
部16Aのメッキ液M中に露出する部分のみにはマスキ
ングが施されている。こうして砥粒層14を固定した状
態においては、砥粒層14が固定ネジ16を介して平面
基板17と導通されるようになっている。Next, a stainless steel fixing screw 16 is inserted into the flat substrate 17 through the mounting hole formed in the center of the abrasive layer 14.
Screw into. This fixing screw 16 has a flange portion 16A for pressing the abrasive grain layer 14, and only the portion of the second flange portion 16A exposed in the plating solution M is masked. With the abrasive layer 14 fixed in this manner, the abrasive layer 14 is electrically connected to the flat substrate 17 via the fixing screw 16.
砥粒層14をセットし終えたら、前記撹拌機を作動させ
、メッキ液中に超砥粒を分散させながら、平面基板17
を電源の陰極に接続して陽極板13との間に通電する。After setting the abrasive grain layer 14, the agitator is operated to disperse the superabrasive grains in the plating solution, and the flat substrate 17 is
is connected to the cathode of a power source to apply electricity between it and the anode plate 13.
そして、砥粒層14の前記表面14Bに金属メッキ相を
析出させるとともに、この金属メッキ相内に超砥粒を分
散させ、砥粒層14上に砥粒層18を形成する。やがて
、この砥粒層18が所定の肉厚に達したら、通電を停止
し、平面基板17から、互いに接合された砥粒層(14
+18)を取り外して、これを砥石形状に整形し、第3
図に示すように、両面から超砥粒6・・・が突出した電
鋳薄刃砥石を得る。Then, a metal plating phase is precipitated on the surface 14B of the abrasive grain layer 14, and superabrasive grains are dispersed in the metal plating phase to form an abrasive grain layer 18 on the abrasive grain layer 14. Eventually, when this abrasive grain layer 18 reaches a predetermined thickness, the current supply is stopped and the abrasive grain layers (14
+18) is removed, shaped into a whetstone shape, and the third
As shown in the figure, an electroformed thin-blade grindstone with superabrasive grains 6 protruding from both surfaces is obtained.
このような構成からなる電鋳薄刃砥石の製造方法によれ
ば、一方の表面14Aから超砥粒6・・・の一部が突出
した砥粒層14を形成した後、この砥粒層1.tの超砥
粒6・・・が突出していない裏面14Bに、超砥粒6・
・・が突出した砥粒層18を形成するので、両面から超
砥粒が突出した電鋳薄刃砥石を製造することができ、切
削開始当初から良好な切れ味と高い加工精度を有し、し
かもピッチングの少ない電鋳薄刃砥石を得ることかでき
る。According to the method for manufacturing an electroformed thin-blade grindstone having such a configuration, after forming the abrasive layer 14 in which some of the superabrasive grains 6 protrude from one surface 14A, the abrasive layer 1. The super abrasive grains 6... of t are placed on the back surface 14B from which they do not protrude
... forms a protruding abrasive grain layer 18, so it is possible to manufacture an electroformed thin-blade whetstone in which superabrasive grains protrude from both sides, and it has good sharpness and high machining accuracy from the beginning of cutting, and is free from pitting. It is possible to obtain an electroformed thin-edged whetstone with less.
また、この電鋳薄刃砥石の製造方法によって製造された
電鋳薄刃砥石では、砥粒層14を形成する際に生じた砥
粒層14内の応力と、砥粒層18を形成する際に生じた
砥粒層18内の応力とが、互いに相反する方向に砥石を
反らせようと作用する。しかも、両砥粒層14.18の
肉厚を略等しく形成することによって、両砥粒層14.
18内の応力を略等しい大きさとするので、両応力は互
いに相殺しあい、砥石に反りが生じることがない。In addition, in the electroformed thin-blade grindstone manufactured by this electroformed thin-blade grindstone manufacturing method, the stress within the abrasive grain layer 14 generated when forming the abrasive grain layer 14 and the stress generated when forming the abrasive grain layer 18 are The stress in the abrasive grain layer 18 acts to warp the grindstone in opposite directions. Moreover, by forming both abrasive grain layers 14.18 to have substantially equal thicknesses, both abrasive grain layers 14.18.
Since the stress within the grinding wheel 18 is approximately equal in magnitude, both stresses cancel each other out, and the grinding wheel does not warp.
したがって、本方法によれば、従来では困難であった反
りが生じにくい電鋳薄刃砥石を容易に製造することがで
きる。Therefore, according to this method, it is possible to easily manufacture an electroformed thin-blade grindstone that is less likely to warp, which has been difficult in the past.
なお、上記の実施例では、砥粒層18を形成する際に、
固定ネジ16によって砥粒層14を平面基板17上に固
定していたが、実際には、平面基板17上に超砥粒が突
出した面14Aを接触させて載置するだけで、平面基板
17と砥粒層14とを導通させることができる。これは
、金属メッキ相から突出している超砥粒6・・・の表面
にも、部分的に金属メッキ相が被さるように形成されて
いるためである。In addition, in the above embodiment, when forming the abrasive grain layer 18,
The abrasive grain layer 14 was fixed onto the flat substrate 17 by the fixing screws 16, but in reality, the surface 14A on which the superabrasive grains protruded is simply placed on the flat substrate 17 in contact with the flat substrate 17. and the abrasive grain layer 14 can be electrically connected to each other. This is because the surfaces of the superabrasive grains 6 protruding from the metal plating phase are also partially covered by the metal plating phase.
「実験例」 次に、実験例を挙げて本発明の効果を明確にする。"Experiment example" Next, the effects of the present invention will be clarified by giving experimental examples.
まず、不働態化皮膜が形成されたステンレス鋼からなる
平面基板の表面に、砥石原型形状をなす部分を残してマ
スキングしたのち、脱脂等の清浄化処理を施した。次ぎ
に、ダイヤモンド砥粒を分散させたスルファミン酸Ni
メッキ液を用いて上記基板の表面に電気メッキを施し、
Niメッキ相内に上記ダイヤモンド砥粒を分散させ、第
1の砥石層を形成した。この場合における上記電気メッ
キの条件を以下に示す。First, the surface of a flat substrate made of stainless steel on which a passivation film was formed was masked leaving a portion forming the shape of the grindstone prototype, and then a cleaning treatment such as degreasing was performed. Next, Ni sulfamate in which diamond abrasive grains were dispersed was prepared.
Electroplating the surface of the substrate using a plating solution,
The diamond abrasive grains were dispersed in the Ni plating phase to form a first abrasive layer. The conditions for the electroplating in this case are shown below.
(イ)電気メツキ液の組成
スルファミン酸Ni: 450g/Q
塩化N i : 109/(1、硼酸:30g/ρ、
ピット防止剤、光沢剤:各少量、 PH:4.0分散超
低粒の種類:ダイヤモンド粒、
分散砥粒の粒度 :20〜30μm、
分散砥粒の濃度 :209/Q
(ロ)電気メツキ条件
浴温度:50℃、 メ・ツキ時間; 140分、陰極電
流密度:3A/dM”。(a) Composition of electroplating solution Ni sulfamic acid: 450 g/Q Ni chloride: 109/(1, boric acid: 30 g/ρ,
Pit prevention agent, brightener: Small amount of each, PH: 4.0 Type of ultra-low dispersion: Diamond grains, Particle size of dispersed abrasive grains: 20 to 30 μm, Concentration of dispersed abrasive grains: 209/Q (b) Electroplating conditions Bath temperature: 50°C, firing time: 140 minutes, cathode current density: 3A/dM.
次に、上記砥粒層を平面基板から剥離させ取り外した後
、平面基板に接して5また面を上1こ向(すて再度平面
基板上にセットし、前記と同じメッキ液、メッキ条件に
おいて、第2の砥粒層を形成した。Next, after peeling and removing the abrasive grain layer from the flat substrate, set it on the flat substrate again with the 5-sided surface in contact with the flat substrate and facing upward, and use the same plating solution and plating conditions as above. , a second abrasive grain layer was formed.
そして、このようにして得られた上記薄肉板状の砥石を
放電加工等により円形の砥石形状1こ成形して、実験例
1の電鋳薄刃砥石を得た。また、同様の方法により、実
験例2の電鋳薄刃砥石を作成した。Then, the thin plate-shaped grindstone thus obtained was formed into a circular grindstone shape by electric discharge machining or the like to obtain the electroformed thin-blade grindstone of Experimental Example 1. In addition, an electroformed thin-blade grindstone of Experimental Example 2 was created using the same method.
また、比較例として、上記と同様のメ・ツキ液、メッキ
条件(メッキ時間を除く)下にお−で、超砥拉の突出処
理が施されていない2種の電鋳薄刃砥石を作成した。In addition, as a comparative example, two types of electroformed thin-blade whetstones that were not subjected to the protrusion treatment of the super-abrasive were created using the same polishing solution and plating conditions (excluding the plating time) as above. .
次いで、上記4枚の電鋳薄刃砥石により、以下の切削条
件(湿式)において切削を行なった。Next, cutting was performed using the four electroformed thin-blade grindstones under the following cutting conditions (wet type).
切削条件 被削材:フェライト(HIP材)、砥石周
速 : 1500 R/min、、刃先突出し量:3
mm、
送り速度: 20 xx/min。Cutting conditions Work material: Ferrite (HIP material), Grinding wheel peripheral speed: 1500 R/min, Cutting edge protrusion: 3
mm, feed rate: 20 xx/min.
切込み量・2.5xx。Depth of cut: 2.5xx.
次表は、上記4種類の電鋳薄刃砥石の各寸法および各々
の切削結果を示すものである。The following table shows the dimensions and cutting results of the four types of electroformed thin-blade grindstones.
(以下、余白)
※砥粒突出ff1AおよびBは、実験例では第1砥粒層
および第2砥粒層におけるものを示し、比較例において
は、平面基板側の而およびメッキ成長側の面におけるも
のを示す。(Hereinafter, blank space) show something
※割れの大きさは、実験例においては第2砥粒層側、比
較例においては超砥粒が突出していない側での、被切削
材の表面に生じた割れの大きさを示すものである。*The size of the crack indicates the size of the crack that occurred on the surface of the cut material on the second abrasive layer side in the experimental example and on the side where the superabrasive grains do not protrude in the comparative example. .
※チッピング幅も、実験例においては第2砥粒層側、比
較例においては超砥粒が突出していない側での値である
。*The chipping width is also the value on the second abrasive layer side in the experimental example, and on the side where the superabrasive grains do not protrude in the comparative example.
「発明の効果」
本発明の電鋳薄刃砥石の製造方法によれば、次のような
効果が得られる。"Effects of the Invention" According to the method for manufacturing an electroformed thin-blade grindstone of the present invention, the following effects can be obtained.
■一方の表面から超砥粒の一部が突出した砥粒層を形成
した後、この砥粒層の超砥粒が突出していない裏面に、
超砥粒が突出した砥粒層を再度形成するので、両面から
超砥粒が突出した電鋳薄刃砥石を製造することができ、
切削開始当初から良好な切れ味と高い加工精度の電鋳薄
刃砥石を製造することができる。■After forming an abrasive grain layer with some of the superabrasive grains protruding from one surface, on the back side where the superabrasive grains of this abrasive grain layer do not protrude,
Since the abrasive grain layer with protruding superabrasive grains is formed again, it is possible to manufacture an electroformed thin-blade grindstone with superabrasive grains protruding from both sides.
It is possible to manufacture an electroformed thin-blade grindstone with good sharpness and high processing accuracy from the beginning of cutting.
■この電鋳薄刃砥石の製造方法によって製造された電鋳
薄刃砥石では、一方の砥粒層を形成する際に生じた応力
と、他方の砥粒層を形成する際に生じた応力とが、互い
に相反する方向に砥石を反らせようと作用する。しかも
、両砥粒層の肉厚を略等しく形成した場合には、両紙粒
層内の応力が略等しい大きさとなるので、両力力は互い
に相殺し合い、砥石に反りが生じることがない。したが
って、本方法によれば、従来では困難であった反りが生
じにくい電鋳薄刃砥石を容易に製造することができる。■In the electroformed thin-blade grindstone manufactured by this electroformed thin-blade grindstone manufacturing method, the stress generated when forming one abrasive grain layer and the stress generated when forming the other abrasive grain layer are They act to warp the whetstone in opposite directions. Moreover, when both abrasive grain layers are formed to have substantially the same thickness, the stress within both paper grain layers becomes approximately equal in magnitude, so that both forces cancel each other out, and the grindstone does not warp. Therefore, according to this method, it is possible to easily manufacture an electroformed thin-blade grindstone that is less likely to warp, which has been difficult in the past.
第1図および第2図は本発明の電鋳薄刃砥石の製造方法
の一実施例に使用される装置の縦断面図、第3図は同製
造方法によって造られた電鋳薄刃砥石の拡大断面図、第
4図は従来の電鋳薄刃砥石を砥石軸に固定した状態を示
す側断面図、第5図は従来の電鋳薄刃砥石の平面基板側
表面の拡大断面図である。
6 ・超砥粒
■2・・平面基板
14・・・先に形成した砥粒層
!4A・・・超砥粒が突出した砥粒層表面14B・・・
平面基板に接していた砥拉層表面17・・・平面基板
18・・後に形成した砥粒層1 and 2 are longitudinal cross-sectional views of a device used in an embodiment of the method for producing an electroformed thin-blade grindstone of the present invention, and FIG. 3 is an enlarged cross-sectional view of an electroformed thin-blade grindstone manufactured by the same manufacturing method. 4 is a side sectional view showing a conventional electroformed thin-blade grindstone fixed to a grindstone shaft, and FIG. 5 is an enlarged sectional view of the surface of the conventional electroformed thin-blade grindstone on the plane substrate side. 6 ・Super abrasive grain ■2... Planar substrate 14... Abrasive grain layer formed earlier! 4A... Abrasive layer surface 14B with protruding superabrasive grains...
Abrasive layer surface 17 that was in contact with the flat substrate...flat substrate 18...abrasive layer formed later
Claims (1)
相内に超砥粒を分散させて、表面から超砥粒の一部が突
出した砥粒層を形成した後、この砥粒層を平面基板から
剥離し、この砥粒層の平面基板に接していた面に金属メ
ッキ相を形成しつつ、この金属メッキ相内に超砥粒を分
散させて表面から超砥粒の一部が突出した砥粒層を形成
することを特徴とする電鋳薄刃砥石の製造方法。While forming a metal plating phase on a flat substrate, superabrasive grains are dispersed within this metal plating phase to form an abrasive grain layer in which some of the superabrasive grains protrude from the surface, and then this abrasive grain layer is flattened. It peeled off from the substrate, forming a metal plating phase on the surface of this abrasive grain layer that was in contact with the flat substrate, and the superabrasive grains were dispersed within this metal plating phase, causing some of the superabrasive grains to protrude from the surface. A method for manufacturing an electroformed thin-blade whetstone, characterized by forming an abrasive grain layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61157053A JPH0649275B2 (en) | 1986-07-02 | 1986-07-02 | Method of manufacturing electroformed thin blade grindstone |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61157053A JPH0649275B2 (en) | 1986-07-02 | 1986-07-02 | Method of manufacturing electroformed thin blade grindstone |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6311281A true JPS6311281A (en) | 1988-01-18 |
JPH0649275B2 JPH0649275B2 (en) | 1994-06-29 |
Family
ID=15641172
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61157053A Expired - Lifetime JPH0649275B2 (en) | 1986-07-02 | 1986-07-02 | Method of manufacturing electroformed thin blade grindstone |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0649275B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03134131A (en) * | 1989-10-18 | 1991-06-07 | Japan Metals & Chem Co Ltd | Alloy for handling isotope of hydrogen |
JP2009107424A (en) * | 2007-10-29 | 2009-05-21 | Honda Motor Co Ltd | Vehicle body structure |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5518328A (en) * | 1978-07-21 | 1980-02-08 | Toshiba Corp | Method of fabricating cutting grindstone |
-
1986
- 1986-07-02 JP JP61157053A patent/JPH0649275B2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5518328A (en) * | 1978-07-21 | 1980-02-08 | Toshiba Corp | Method of fabricating cutting grindstone |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03134131A (en) * | 1989-10-18 | 1991-06-07 | Japan Metals & Chem Co Ltd | Alloy for handling isotope of hydrogen |
JP2009107424A (en) * | 2007-10-29 | 2009-05-21 | Honda Motor Co Ltd | Vehicle body structure |
Also Published As
Publication number | Publication date |
---|---|
JPH0649275B2 (en) | 1994-06-29 |
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