JPS6311281A - Manufacture for electrocast sharp-edged grindstone - Google Patents

Abstract

PURPOSE:To make good sharpness and high accuracy of finishing securable from the outset of a cutting start, by forming an abrasive grain layer where a part of super abrasive grains is projected out of one side of the surfaces and then again forming the abrasive grain layer, where these super abrasive grains are projected, in the backside. CONSTITUTION:As forming a metal plating phase in a plane substrate, an abrasive grain layer 14, where a part of super abrasive grains 6 is projected from a surface 14A is formed in this plane substrate after dispersing these super abrasive grains 6 in the metal plating phase. Next, this abrasive grain layer 14 is separated from plane substrate, while forming the metal plating phase on a surface (backside) 14B so far adjoined to the plane substrate of this abrasive grain layer 14, these super abrasive grains 6 are dispersed in this metal plating phase, forming an abrasive grain layer 18 where a part of these super abrasive grains 6 is projected from the surface, thus an electrocast sharp-edged grindstone, where these super abrasive grains 6 are projected out of both surfaces 14A and 14B, is manufactured. Sharpness of this stone becomes excelled from the outset and, what is more, accuracy of finishing is also improved.

Description

[Detailed Description of the Invention] "Industrial Application Field" The present invention relates to a method for manufacturing an electroformed thin-blade grindstone used for high-precision cutting and grooving of work materials such as silicon and ferrite. It is.

"Prior Art" FIG. 4 is a diagram showing how this type of electroformed thin-blade grindstone 1 is used.

This electroformed thin-blade grindstone is made by dispersing superabrasive grains such as diamond or CBS in a metal plating phase made of Nl, Co, or their alloys, and has a thickness of several tens of microns to several hundred microns.
It is a lamina-like ring on the shoulder.

This electroformed thin-blade grindstone 1 is sandwiched between a pair of mounting flanges 2 provided on both sides, and is fixed by a nut 3 to a grindstone shaft 4 that rotates around its axis. Please make it available for use.

Conventionally, such electroformed thin-blade grindstones have been manufactured as follows.

First, in a plating bath, a metal plating phase such as Ni or Co is precipitated on the surface of a stainless steel flat substrate, while
Superabrasive grains such as diamond are dispersed in this metal plating phase to form an abrasive grain layer.

Next, this abrasive layer is peeled off from the flat substrate and shaped into a predetermined shape of the abrasive, thereby obtaining an electroformed thin-blade abrasive.

"Problems to be Solved by the Invention" By the way, the electroformed thin-blade grindstone manufactured by the above method is obtained by first plating the surface of a flat substrate and then peeling it off from the flat substrate. Fifth
As shown in the figure, on the surface IA that was in contact with the flat substrate, the superabrasive grains 6 do not protrude from the metal plating phase 5 at all. Therefore, during cutting, this surface IA has poor sharpness, and there is a problem in that chipping or so-called sluggishness is likely to occur in the workpiece, especially in the initial stage of cutting.

In addition, in the method for manufacturing the electroformed thin-blade grindstone, stress is accumulated in the plating phase 5 during the process of depositing the metal plating phase 5 on the flat substrate, and the electroformed thin-blade grindstone after manufacturing There was a drawback that warpage was likely to occur.

``Purpose of the Invention'' The present invention was made in view of the above circumstances, and provides excellent cutting performance from the beginning of cutting, does not cause chipping or dullness in the workpiece, and is less likely to warp and achieves high machining accuracy. An object of the present invention is to provide a method for manufacturing an electroformed thin-blade grindstone that can produce an electroformed thin-blade grindstone.

"Means for Solving the Problems" The method for manufacturing an electroformed thin-edged grindstone of the present invention involves forming an abrasive grain layer on a flat substrate in which a portion of the superabrasive grains protrudes from the surface, and then forming the abrasive grain layer. is peeled off from the flat substrate, and while a metal plating phase is formed again on the surface of this abrasive grain layer that was in contact with the flat substrate, superabrasive grains are dispersed within this metal plating phase, and some of the superabrasive grains are removed from the surface. It is characterized by forming a layer of abrasive grains with protrusions.

"Example" Hereinafter, an example of the present invention will be described in detail using the drawings.

FIG. 1 and FIG. 2 each show an apparatus for carrying out an example of the method for manufacturing an electroformed thin-blade grindstone of the present invention.

Reference numeral IO in the figure indicates a plating tank, and the plating tank 10 is filled with a plating solution M containing metal ions such as Ni and Cc. In addition, a stirrer such as an ultrasonic stirrer (not shown) is installed in this plating tank IO, and the plating solution M
Stirring is performed.

A non-conductive pedestal 11 is arranged horizontally in the plating tank 10, and a stainless steel flat substrate 12 is placed on the pedestal li. The upper surface of this flat substrate 12 is masked, leaving a portion forming the prototype shape of the grindstone to be manufactured. Further, above the flat substrate 12, an anode plate 13 is arranged parallel to the flat substrate 12, and is connected to an anode of a power source (not shown).

When manufacturing an electroformed thin-blade grindstone, first, as shown in Fig. 1, a predetermined amount of superabrasive grains is added to the plating solution M in the plating tank IO, and then added to the plating solution M using an ultrasonic stirrer. Distribute evenly. Next, the flat substrate 12 is connected to the cathode of a power source and electricity is applied between it and the anode plate 13 to precipitate a metal plating phase on the flat substrate 12 while uniformly dispersing the superabrasive grains within this metal plating phase. Then, an abrasive layer 14 is formed.

Then, when this abrasive grain layer 14 has a thickness as close as possible to 1/2 of the thickness of the electroformed thin-blade grindstone to be finally formed, and has enough strength to withstand peeling off from the flat substrate 11, energization is applied. is stopped, and the abrasive grain layer 14 is removed from the flat substrate 12.
tear it off. Note that the electroformed thin-blade grindstone to be finally manufactured has a thin wall thickness, and the abrasive grain layer of approximately 1/2 of that thickness may be damaged (or damaged if it is difficult to peel off) from the flat substrate. This may be done after the abrasive grain layer 14 has a thickness that allows it to be peeled off without any problem.The abrasive grain layer 14 thus obtained has superabrasive grains protruding only from one surface 14A thereof.

Next, an abrasive layer in which superabrasive grains are dispersed is again formed on the surface 14B of the peeled abrasive grain layer 14 from which the superabrasive grains do not protrude.

First, as shown in Figure 2, in the plating tank IO,
A flat substrate 17 having a female screw hole in the center is arranged. Then, on this flat substrate 17, a surface 14 on which superabrasive grains protrude
The abrasive grain layer 14 is placed so that A is in contact with the flat substrate 17.

Next, a stainless steel fixing screw 16 is inserted into the flat substrate 17 through the mounting hole formed in the center of the abrasive layer 14.
Screw into. This fixing screw 16 has a flange portion 16A for pressing the abrasive grain layer 14, and only the portion of the second flange portion 16A exposed in the plating solution M is masked. With the abrasive layer 14 fixed in this manner, the abrasive layer 14 is electrically connected to the flat substrate 17 via the fixing screw 16.

After setting the abrasive grain layer 14, the agitator is operated to disperse the superabrasive grains in the plating solution, and the flat substrate 17 is
is connected to the cathode of a power source to apply electricity between it and the anode plate 13.

Then, a metal plating phase is precipitated on the surface 14B of the abrasive grain layer 14, and superabrasive grains are dispersed in the metal plating phase to form an abrasive grain layer 18 on the abrasive grain layer 14. Eventually, when this abrasive grain layer 18 reaches a predetermined thickness, the current supply is stopped and the abrasive grain layers (14
+18) is removed, shaped into a whetstone shape, and the third
As shown in the figure, an electroformed thin-blade grindstone with superabrasive grains 6 protruding from both surfaces is obtained.

According to the method for manufacturing an electroformed thin-blade grindstone having such a configuration, after forming the abrasive layer 14 in which some of the superabrasive grains 6 protrude from one surface 14A, the abrasive layer 1. The super abrasive grains 6... of t are placed on the back surface 14B from which they do not protrude
... forms a protruding abrasive grain layer 18, so it is possible to manufacture an electroformed thin-blade whetstone in which superabrasive grains protrude from both sides, and it has good sharpness and high machining accuracy from the beginning of cutting, and is free from pitting. It is possible to obtain an electroformed thin-edged whetstone with less.

In addition, in the electroformed thin-blade grindstone manufactured by this electroformed thin-blade grindstone manufacturing method, the stress within the abrasive grain layer 14 generated when forming the abrasive grain layer 14 and the stress generated when forming the abrasive grain layer 18 are The stress in the abrasive grain layer 18 acts to warp the grindstone in opposite directions. Moreover, by forming both abrasive grain layers 14.18 to have substantially equal thicknesses, both abrasive grain layers 14.18.
Since the stress within the grinding wheel 18 is approximately equal in magnitude, both stresses cancel each other out, and the grinding wheel does not warp.

Therefore, according to this method, it is possible to easily manufacture an electroformed thin-blade grindstone that is less likely to warp, which has been difficult in the past.

In addition, in the above embodiment, when forming the abrasive grain layer 18,
The abrasive grain layer 14 was fixed onto the flat substrate 17 by the fixing screws 16, but in reality, the surface 14A on which the superabrasive grains protruded is simply placed on the flat substrate 17 in contact with the flat substrate 17. and the abrasive grain layer 14 can be electrically connected to each other. This is because the surfaces of the superabrasive grains 6 protruding from the metal plating phase are also partially covered by the metal plating phase.

"Experiment example" Next, the effects of the present invention will be clarified by giving experimental examples.

First, the surface of a flat substrate made of stainless steel on which a passivation film was formed was masked leaving a portion forming the shape of the grindstone prototype, and then a cleaning treatment such as degreasing was performed. Next, Ni sulfamate in which diamond abrasive grains were dispersed was prepared.
Electroplating the surface of the substrate using a plating solution,
The diamond abrasive grains were dispersed in the Ni plating phase to form a first abrasive layer. The conditions for the electroplating in this case are shown below.

(a) Composition of electroplating solution Ni sulfamic acid: 450 g/Q Ni chloride: 109/(1, boric acid: 30 g/ρ,
Pit prevention agent, brightener: Small amount of each, PH: 4.0 Type of ultra-low dispersion: Diamond grains, Particle size of dispersed abrasive grains: 20 to 30 μm, Concentration of dispersed abrasive grains: 209/Q (b) Electroplating conditions Bath temperature: 50°C, firing time: 140 minutes, cathode current density: 3A/dM.

Next, after peeling and removing the abrasive grain layer from the flat substrate, set it on the flat substrate again with the 5-sided surface in contact with the flat substrate and facing upward, and use the same plating solution and plating conditions as above. , a second abrasive grain layer was formed.

Then, the thin plate-shaped grindstone thus obtained was formed into a circular grindstone shape by electric discharge machining or the like to obtain the electroformed thin-blade grindstone of Experimental Example 1. In addition, an electroformed thin-blade grindstone of Experimental Example 2 was created using the same method.

In addition, as a comparative example, two types of electroformed thin-blade whetstones that were not subjected to the protrusion treatment of the super-abrasive were created using the same polishing solution and plating conditions (excluding the plating time) as above. .

Next, cutting was performed using the four electroformed thin-blade grindstones under the following cutting conditions (wet type).

Cutting conditions Work material: Ferrite (HIP material), Grinding wheel peripheral speed: 1500 R/min, Cutting edge protrusion: 3
mm, feed rate: 20 xx/min.

Depth of cut: 2.5xx.

The following table shows the dimensions and cutting results of the four types of electroformed thin-blade grindstones.

(Hereinafter, blank space) show something

*The size of the crack indicates the size of the crack that occurred on the surface of the cut material on the second abrasive layer side in the experimental example and on the side where the superabrasive grains do not protrude in the comparative example. .

*The chipping width is also the value on the second abrasive layer side in the experimental example, and on the side where the superabrasive grains do not protrude in the comparative example.

"Effects of the Invention" According to the method for manufacturing an electroformed thin-blade grindstone of the present invention, the following effects can be obtained.

■After forming an abrasive grain layer with some of the superabrasive grains protruding from one surface, on the back side where the superabrasive grains of this abrasive grain layer do not protrude,
Since the abrasive grain layer with protruding superabrasive grains is formed again, it is possible to manufacture an electroformed thin-blade grindstone with superabrasive grains protruding from both sides.
It is possible to manufacture an electroformed thin-blade grindstone with good sharpness and high processing accuracy from the beginning of cutting.

■In the electroformed thin-blade grindstone manufactured by this electroformed thin-blade grindstone manufacturing method, the stress generated when forming one abrasive grain layer and the stress generated when forming the other abrasive grain layer are They act to warp the whetstone in opposite directions. Moreover, when both abrasive grain layers are formed to have substantially the same thickness, the stress within both paper grain layers becomes approximately equal in magnitude, so that both forces cancel each other out, and the grindstone does not warp. Therefore, according to this method, it is possible to easily manufacture an electroformed thin-blade grindstone that is less likely to warp, which has been difficult in the past.

[Brief explanation of drawings]

1 and 2 are longitudinal cross-sectional views of a device used in an embodiment of the method for producing an electroformed thin-blade grindstone of the present invention, and FIG. 3 is an enlarged cross-sectional view of an electroformed thin-blade grindstone manufactured by the same manufacturing method. 4 is a side sectional view showing a conventional electroformed thin-blade grindstone fixed to a grindstone shaft, and FIG. 5 is an enlarged sectional view of the surface of the conventional electroformed thin-blade grindstone on the plane substrate side. 6 ・Super abrasive grain ■2... Planar substrate 14... Abrasive grain layer formed earlier! 4A... Abrasive layer surface 14B with protruding superabrasive grains...
Abrasive layer surface 17 that was in contact with the flat substrate...flat substrate 18...abrasive layer formed later

Claims (1)

[Claims] While forming a metal plating phase on a flat substrate, superabrasive grains are dispersed within this metal plating phase to form an abrasive grain layer in which some of the superabrasive grains protrude from the surface, and then this abrasive grain layer is flattened. It peeled off from the substrate, forming a metal plating phase on the surface of this abrasive grain layer that was in contact with the flat substrate, and the superabrasive grains were dispersed within this metal plating phase, causing some of the superabrasive grains to protrude from the surface. A method for manufacturing an electroformed thin-blade whetstone, characterized by forming an abrasive grain layer.