JPH0649275B2 - Method of manufacturing electroformed thin blade grindstone - Google Patents

Description

The present invention relates to a method for manufacturing an electroformed thin blade grindstone used for highly accurate cutting and grooving of a work material such as silicon or ferrite. is there.

"Prior Art" Fig. 4 is a diagram showing a usage mode of this type of electroformed thin blade grindstone 1.

The electroformed thin blade grindstone 1 is formed by dispersing superabrasive grains such as diamond and CBN in a metal plating phase made of Ni, Co or their alloys, and has a thickness of several tens μm to several hundreds μm.
It is a ring-shaped thin plate. The electroformed thin blade grindstone 1 includes a pair of mounting flanges 2 and 2 arranged on both side surfaces.
In addition to being sandwiched in between, it is fastened and fixed by a nut 3 to a grindstone shaft 4 which is rotated around its axis, and is used.

Conventionally, such electroformed thin blade grindstones are manufactured as follows.

First, in the plating bath, while depositing a metal plating phase such as Ni, Co on the surface of a stainless steel flat substrate, superabrasive particles such as diamond are dispersed in the metal plating phase to form an abrasive grain layer. To do.

Then, the abrasive grain layer is peeled from the flat substrate and shaped into a predetermined grindstone shape to obtain an electroformed thin blade grindstone.

"Problems to be solved by the invention" By the way, the electroformed thin blade grindstone produced by the above method is obtained by first plating the surface of the flat substrate and then peeling it from the flat substrate. As shown in FIG. 5, superabrasive grains 6 ... Do not project from the metal plating phase 5 at all on the surface 1A that was in contact with the flat substrate. Therefore, there is a problem that the surface 1A has poor sharpness during cutting, and chipping or so-called shavings is likely to occur in the work material particularly in the initial stage of cutting.

Further, in the method for manufacturing the electroformed thin blade grindstone, stress is accumulated in the plating phase 5 during the process of depositing the metal plating phase 5 on the flat substrate, and the electroformed thin blade grindstone is not warped. It had the drawback of being prone to occur.

[Object of the Invention] The present invention has been made in view of the above circumstances, and has excellent sharpness from the beginning of cutting, does not cause chipping or shavings in a work material, and is highly resistant to warping, thus providing high processing accuracy. An object of the present invention is to provide a method for manufacturing an electroformed thin blade grindstone capable of manufacturing the electroformed thin blade grindstone.

"Means for Solving Problems" The method for producing an electroformed thin blade grindstone of the present invention is, on a flat substrate, after forming an abrasive grain layer in which a part of superabrasive grains are projected from the surface, the abrasive grain layer Is separated from the flat substrate, and while forming a metal plating phase again on the surface of the abrasive grain layer that was in contact with the flat substrate, disperse the superabrasive grains in the metal plating phase to partially remove the superabrasive grains from the surface. Is formed to form a protruding abrasive grain layer.

[Example] Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

FIG. 1 and FIG. 2 each show an apparatus for carrying out an example of the method for manufacturing an electroformed thin blade grindstone of the present invention.

In the figure, reference numeral 10 is a plating bath, and the plating bath 10 is filled with a plating solution M containing metal ions such as Ni and Co. In addition, a stirrer such as an ultrasonic stirrer (not shown) is arranged in the plating tank 10 to stir the plating solution M.

A non-conductive pedestal 11 is horizontally arranged in the plating tank 10, and a flat substrate 12 made of stainless steel is placed on the pedestal 11. Masking is performed on the upper surface of the flat substrate 12 while leaving a portion of the prototype shape of the grindstone to be manufactured. An anode plate 13 is arranged above the plane substrate 12 in parallel with the plane substrate 12 and connected to an anode of a power source (not shown).

When manufacturing an electroformed thin blade grindstone, as shown in FIG. 1, first, a predetermined amount of superabrasive grains are added to the plating solution M in the plating tank 10 and the plating solution M is uniformly mixed with an ultrasonic stirrer. Disperse into Then, the flat substrate 12 is connected to a cathode of a power source and an electric current is applied between the flat substrate 12 and the anode plate 13 to deposit a metal plating phase on the flat substrate 12 and uniformly disperse the superabrasive grains in the metal plating phase. To form the abrasive grain layer 14.

When the abrasive grain layer 14 is as close as possible to 1/2 of the wall thickness of the electroformed thin blade grindstone to be finally formed, and has a thickness that is sufficiently strong to be peeled off from the flat substrate 11, the electricity is supplied. To stop the abrasive grain layer 14 from the flat substrate 12
Peel off. If the thickness of the electroformed thin blade grindstone to be finally manufactured is thin and it is difficult to peel the abrasive grain layer having a thickness of about 1/2 of the grindstone layer from the flat substrate without damage, do not damage it. It is enough after the wall thickness can be peeled off. The abrasive grain layer 14 thus obtained has superabrasive grains protruding only from one surface 14A thereof.

Next, an abrasive grain layer in which the superabrasive grains are dispersed is formed again on the surface 14B of the peeled abrasive grain layer 14 on which the superabrasive grains do not protrude.

First, as shown in FIG. 2, in the plating tank 10 described above,
A flat substrate 17 having a female screw hole in the center is arranged. Then, the surface 14 on which the superabrasive grains are projected is formed on the flat substrate 17.
The abrasive grain layer 14 is placed so that A contacts the flat substrate 17.

Then, through a mounting hole formed in the center of the abrasive grain layer 14, a fixing screw 16 made of stainless steel is attached to a flat substrate 17
Screw into. The fixing screw 16 has a flange portion 16A for pressing the abrasive grain layer 14, and only the portion of the flange portion 16A exposed in the plating solution M is masked. When the abrasive grain layer 14 is fixed in this manner, the abrasive grain layer 14 is electrically connected to the flat substrate 17 via the fixing screw 16.

After setting the abrasive grain layer 14, the agitator is operated to disperse the superabrasive grains in the plating solution and
7 is connected to the cathode of the power source, and electricity is applied to the anode plate 13. Then, a metal plating phase is deposited on the surface 14B of the abrasive grain layer 14, and superabrasive particles are dispersed in the metal plating phase to form the abrasive grain layer 18 on the abrasive grain layer 14. Eventually, when the abrasive grain layer 18 reaches a predetermined thickness, the energization is stopped, the abrasive grain layers (14 + 18) bonded to each other are removed from the flat substrate 17, and this is shaped into a grindstone shape, As shown in FIG. 3, an electroformed thin blade grindstone having superabrasive grains 6 ...

According to the method for manufacturing an electroformed thin blade grindstone having such a configuration, after forming the abrasive grain layer 14 in which a part of the superabrasive grains 6 ... Grain 6 ...
Since the abrasive grain layer 18 in which the superabrasive grains 6 ... Protrude is formed on the back surface 14B in which the superabrasive grains are not projected, it is possible to manufacture an electroformed thin blade grindstone in which the superabrasive grains are projected from both sides, which is excellent from the beginning of cutting. It is possible to obtain an electroformed thin blade grindstone having sharpness, high processing accuracy, and less pitching.

In the electroformed thin blade grindstone manufactured by the method for manufacturing the electroformed thin blade grindstone, the stress in the abrasive grain layer 14 generated when the abrasive grain layer 14 is formed and the stress generated when the abrasive grain layer 18 is formed. The stress in the abrasive grain layer 18 acts to warp the grindstone in opposite directions. Moreover, by forming the two abrasive grain layers 14 and 18 to have substantially the same thickness,
Since the stresses in 18 are made substantially equal in magnitude, both stresses cancel each other out and warp of the grindstone does not occur. Therefore, according to the present method, it is possible to easily manufacture an electroformed thin blade grindstone that is unlikely to cause warpage, which has been difficult in the past.

In the above example, when forming the abrasive grain layer 18,
Although the abrasive grain layer 14 is fixed on the flat substrate 17 by the fixing screw 16, in practice, the flat substrate 17 can be simply placed by bringing the surface 14A on which the superabrasive grains protrude into contact with the flat substrate 17. And the abrasive grain layer 14 can be electrically connected. This is because the surface of the superabrasive grains 6 ... Protruding from the metal plating phase is also formed so as to partially cover the metal plating phase.

[Examples] Next, the effects of the present invention will be clarified by giving experimental examples.

First, the surface of a planar substrate made of stainless steel on which a passivation film was formed was masked while leaving a portion forming a prototype of a grindstone, and then a cleaning treatment such as degreasing was performed. Next, Ni sulfamate in which diamond abrasive grains are dispersed
Electroplating the surface of the substrate using a plating solution,
The diamond abrasive grains were dispersed in the Ni plating phase to form the first grindstone layer. The conditions of the electroplating in this case are shown below.

(B) Composition of electroplating solution Ni sulfamate: 450 g / Ni chloride: 10 g /, boric acid: 30 g /, anti-pitting agent, brightener: each small amount, PH: 4.0 Dispersion superabrasive grain type: diamond grain, Particle size of dispersed abrasive grains: 20 to 30 μm, concentration of dispersed abrasive grains: 20 g / (b) Electroplating conditions Bath temperature: 50 ° C., plating time: 140 minutes, cathode current density: 3 A / dm ² .

Next, after peeling off the abrasive grain layer from the flat substrate and removing it, the abrasive grain layer was set again on the flat substrate with the surface in contact with the flat substrate facing upward, and the second plating was performed under the same plating solution and plating conditions as described above. An abrasive grain layer was formed.

Then, the thin plate-shaped grindstone thus obtained was molded into a circular grindstone shape by electrical discharge machining or the like, and then, Experimental Example 1
The electroformed thin blade grindstone was obtained. Further, an electroformed thin blade grindstone of Experimental Example 2 was prepared by the same method.

In addition, as a comparative example, two kinds of electroformed thin blade grindstones not subjected to the projection processing of superabrasive grains were prepared under the same plating solution and plating conditions (excluding plating time) as above.

Then, cutting was performed under the following cutting conditions (wet) with the above-mentioned four electroformed thin blade grindstones.

Cutting conditions Work material: Ferrite (HIP material), Grindstone peripheral speed: 1500 m / min., Cutting edge amount: 3 mm, Feed rate: 20 mm / min, Depth of cut: 2.5 mm, the following table shows the above 4 types of electrodes. It shows each dimension of the cast thin blade grindstone and each cutting result.

"Effects of the Invention" According to the method for manufacturing an electroformed thin blade grindstone of the present invention, the following effects can be obtained.

After forming an abrasive grain layer in which a part of the superabrasive grains is projected from one surface, the superabrasive grains of this abrasive grain layer are not projected on the back surface,
Since the abrasive grain layer in which the superabrasive grains are projected is formed again, it is possible to manufacture an electroformed thin blade grindstone in which the superabrasive grains are projected from both sides.
From the beginning of cutting, it is possible to manufacture an electroformed thin blade grindstone with good sharpness and high processing accuracy.

In the electroformed thin blade grindstone manufactured by the method for manufacturing this electroformed thin blade grindstone, the stress generated when forming one abrasive grain layer and the stress generated when forming the other abrasive grain layer are mutually It works to bend the grindstone in opposite directions. Moreover, when the two abrasive grain layers are formed to have substantially the same thickness, the stresses in the two abrasive grain layers are substantially equal to each other, so that the two stresses cancel each other out and the whetstone does not warp. Therefore, according to the present method, it is possible to easily manufacture an electroformed thin blade grindstone that is unlikely to cause warpage, which has been difficult in the past.

[Brief description of drawings]

1 and 2 are longitudinal sectional views of an apparatus used in an embodiment of a method for manufacturing an electroformed thin blade grindstone of the present invention, and FIG. 3 is an enlarged cross section of an electroformed thin blade grindstone manufactured by the manufacturing method. FIG. 4 is a side sectional view showing a state in which a conventional electroformed thin blade grindstone is fixed to a grindstone shaft, and FIG. 5 is an enlarged sectional view of a surface of a conventional electroformed thin blade grindstone on the side of a flat substrate. 6 ... Super-abrasive grain 12 ... Planar substrate 14 ... Abrasive grain layer formed earlier 14A ... Abrasive layer surface with super-abrasive grains protruding 14B ... Abrasive layer surface in contact with flat substrate 17 ... Flat substrate 18 ... Abrasive layer formed later

Claims (1)

[Claims] 1. A metal plating phase is formed on a flat substrate, and superabrasive grains are dispersed in the metal plating phase to form an abrasive grain layer in which a part of the superabrasive grains is projected from the surface. While peeling the abrasive grain layer from the flat substrate and forming a metal plating phase on the surface of the abrasive grain layer that was in contact with the flat substrate, the superabrasive grains are dispersed in the metal plating phase to form a superabrasive grain from the surface. A method for producing an electroformed thin blade grindstone, which comprises forming an abrasive grain layer, a portion of which protrudes.