JPS62224491A - Cream solder - Google Patents
Cream solderInfo
- Publication number
- JPS62224491A JPS62224491A JP6482786A JP6482786A JPS62224491A JP S62224491 A JPS62224491 A JP S62224491A JP 6482786 A JP6482786 A JP 6482786A JP 6482786 A JP6482786 A JP 6482786A JP S62224491 A JPS62224491 A JP S62224491A
- Authority
- JP
- Japan
- Prior art keywords
- rosin
- solder
- cream solder
- flux
- oxide group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 70
- 239000006071 cream Substances 0.000 title claims abstract description 38
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 23
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 23
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 23
- 230000004907 flux Effects 0.000 claims abstract description 22
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000007788 liquid Substances 0.000 claims abstract description 5
- 239000002023 wood Substances 0.000 claims abstract description 3
- 229920001515 polyalkylene glycol Polymers 0.000 claims abstract 2
- 239000003784 tall oil Substances 0.000 claims abstract 2
- 239000000203 mixture Substances 0.000 claims 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims 1
- 239000000843 powder Substances 0.000 abstract description 8
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical group CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 abstract description 4
- 239000002245 particle Substances 0.000 abstract description 4
- 238000001035 drying Methods 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 238000013329 compounding Methods 0.000 abstract 1
- 235000011837 pasties Nutrition 0.000 abstract 1
- 238000005476 soldering Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000008240 homogeneous mixture Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子機器のはんだ付けに用いるクリームはんだ
に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to cream solder used for soldering electronic devices.
クリームはんだは、粉末はんだと液状またはペースト状
のフラックス（以下、フラックスという〉とを均質に混
和したクリーム状のはんだである。Cream solder is a cream-like solder that is a homogeneous mixture of powdered solder and liquid or paste-like flux (hereinafter referred to as flux).
これは主として、基板上のはんだ接合部分に、スクリー
ン印刷やディスペンサー吐出により塗布し、電子部品等
の接合物を搭載し、外部からの加熱により、はんだを融
解させはんだ付けするためのはんだ材料である。This is a solder material that is mainly applied to the solder joints on a board by screen printing or dispenser discharge, and is used to mount electronic components and other joints, and then melt the solder using external heating for soldering. .
クリームはんだは、フラックスの粘度並びに粉末はんだ
との混合割合等で粘度が調整され、使用する条件によっ
て選択されており、フラックスは樹脂、チキソ剤、活性
剤および溶剤等から構成されている。The viscosity of cream solder is adjusted depending on the viscosity of the flux and the mixing ratio with powdered solder, etc., and is selected depending on the conditions of use, and the flux is composed of a resin, a thixotropic agent, an activator, a solvent, etc.
近年電子機器の小型化、高密度化、高集積化に伴い部品
間距離や導体間隔の狭小化、部品点数並びに部品の種類
の増加などにより、１基板当たりの実装時間が増加する
傾向がみられる。クリームはんだによるはんだ付は工程
は一般に、クリームはんだの塗布→部品搭載→はんだリ
フロー、というような工程ではんだ付けされる。従来の
クリームはんだは、クリームはんだ塗布後、少なくとも
１日以内に、部品搭載→はんだリフロー、を行わないと
クリームはんだの表面が乾燥し、部品搭載時の保持作用
の著しい欠如やりフロ一時のはんだボールの極端な増加
による信頼性の低下が生じてくる。従って、クリームは
んだ塗布後は、その日のうちにはんだリフローまで終了
しなければならず、翌日への作業の持越や休日をはさん
での作業の継続ができなかった。そのため、部品搭載時
間、リフロ一時間を見越してクリームはんだの塗布作業
をきりあげなければならず、生産性の面から大きなマイ
ナスとなっていた。In recent years, with the miniaturization, higher density, and higher integration of electronic devices, the distance between components and conductor spacing has become narrower, and the number and types of components have increased, resulting in an increase in the mounting time per board. . The process of soldering using cream solder is generally as follows: application of cream solder → component mounting → solder reflow. With conventional cream solder, if the component mounting → solder reflow is not performed within at least one day after applying the cream solder, the surface of the cream solder dries, resulting in a significant lack of holding action when mounting the component, and temporary solder balls. Reliability will decrease due to the extreme increase in Therefore, after applying the cream solder, the solder reflow must be completed on the same day, making it impossible to carry over the work to the next day or continue the work over holidays. As a result, the cream solder application work had to be completed in anticipation of the component mounting time and the one-hour reflow process, which was a big drawback in terms of productivity.
本発明は、従来のクリームはんだにおけるかかる問題点
を解消し、クリームはんだ塗布後３日以上の長時間放置
しても、クリームはんだの粘着性が失われず、かつはん
だリフロ一時のはんだボールがきわめて少ないクリーム
はんだを提供することにある。The present invention solves these problems with conventional cream solder, and the cream solder does not lose its stickiness even if it is left for a long time of 3 days or more after applying the cream solder, and the number of solder balls during solder reflow is extremely small. Our goal is to provide cream solder.
クリームはんだ塗布後、時間の経過に伴う粘着性の消失
やりフロ一時のはんだボールの増加はクリームはんだ中
の溶剤が気化するため、はんだ粒子面のフラックス保護
が低下し、はんだ粒子が酸化されること、並びに吸湿に
よるフラックスの劣化により生しると考えられている。After cream solder is applied, the tackiness disappears over time and the number of solder balls increases during a temporary flow.The solvent in the cream solder evaporates, reducing the flux protection on the solder particle surface and oxidizing the solder particles. It is thought that this is caused by the deterioration of the flux due to moisture absorption.
従ってクリームはんだの粘着性を増加させる一つの方法
としてクリームはんだ中のフラックス含有量を多くする
方法がある。しかし、一般にフラックス量を多くすると
クリームはんだの印刷性の低下やりフロ一時のダレによ
る導体間のブリッジ、はんだ粉とフラックスの分離、は
んだボールの増加、所定のはんだ量を得るために従来以
上のクリームはんだの塗布量が必要等の問題が生じてく
る。Therefore, one method for increasing the tackiness of cream solder is to increase the flux content in the cream solder. However, in general, when increasing the amount of flux, the printability of cream solder decreases, bridges between conductors due to temporary sagging of the flow, separation of solder powder and flux, and an increase in solder balls occur. Problems such as the need for a large amount of solder to be applied arise.
本発明者らは、クリームはんだを使用するはんだ付は実
装における信頼性並びに生産性の向上を目的とし、従来
のクリームはんだの印刷性やはんだ付は性を損なわずに
、長時間の粘着性を有し、かつはんだボールを減少させ
るクリームはんだの開発を行った結果、ロジン式骨核に
エチレンオキシド類、またはプロピレンオキシド類を有
するロジンをクリームはんだのフラックス中に配合する
ことにより当日的を達成することを見出し本発明を完成
した。本発明に用いるロジンとしては、ガムロジン、ウ
ッドロジン、１・−ル油ロジン、水添ロジン等である。The present inventors believe that the purpose of soldering using cream solder is to improve reliability and productivity during mounting, and that conventional cream solder has long-term adhesiveness without impairing printability or soldering properties. As a result of developing a cream solder that has the same properties and reduces the number of solder balls, it is possible to achieve same-day results by incorporating rosin containing ethylene oxide or propylene oxide into the flux of the cream solder. They found this and completed the present invention. Examples of the rosin used in the present invention include gum rosin, wood rosin, 1-l oil rosin, and hydrogenated rosin.
ロジン式骨核にエチレンオキシド類、またはプロピレン
オキシド類を有するロジンがクリームはんだのフラック
ス中に配合されると、粉末はんだの粒子とフラックスの
界面を改質してクリームはんだ表面の乾燥を防止するた
め、クリームはんだ塗布後クリームはんだは長時間粘着
性を有するようになる。When a rosin containing ethylene oxide or propylene oxide in the rosin type bone core is blended into the flux of cream solder, it modifies the interface between the powder solder particles and the flux and prevents the surface of the cream solder from drying. After applying the cream solder, the cream solder becomes sticky for a long time.
実施例１
フラックス・・・・・・１ｌｆｆｉｆｆｉ％粉末はんだ
・・・・・・８９重１％
６３Ｓｎ−Ｐｂ（２５０メツシユ）
実施例２
フラックス・・・・・・１１重量％
粉末はんだ・・・・・・８９重量％
６３Ｓｎ−Ｐｂ（２５０メツシユ）
実施例３
フラックス・・・・・・１ｌｆｆｉ量％粉末はんだ・・
・・・・８９重量％
Ｇ３５ｎ−Ｐｂ（２５０メツシユ）
比較例１
フラックス・・・・・・１ｌｆｆｉｆｆｉ％粉末はんだ
・・・・・・８９重量％
６３Ｓｎ−１’ｂ（２５０メヴシユ）
以上の実施例、比較例の特性試験結果を第１表示す。Example 1 Flux: 1lffiffi% Powder solder: 89wt 1% 63Sn-Pb (250 mesh) Example 2 Flux: 11wt% Powder solder: ...89% by weight 63Sn-Pb (250 mesh) Example 3 Flux...1lffi amount% powder solder...
...89 weight% G35n-Pb (250 mesh) Comparative example 1 Flux...1lfiffi% Powder solder...89 weight% 63Sn-1'b (250 mesh) Above examples , the characteristic test results of the comparative example are first displayed.
第１表
１）はんだボール
０．８１ピツチのフラットバック形ｔＣのパターンを有
する５０Ｘ５０ｍｍのセラミック基板にクリームはんだ
を印刷し、室温にて所定の時間放置後、オーブンタイプ
のりフロー炉にて１７０’Ｃ３０ｓｅｃ、 ２３０℃６
０ｓｅｃ加熱しはんだを融解し、冷却後４０倍の実体顕
微鏡にて、パターン周辺部に発生するはんだボールの数
を測定する。Table 1 1) Cream solder was printed on a 50 x 50 mm ceramic substrate with a flat back type tC pattern of 0.81 pitch of solder balls, left at room temperature for a specified period of time, and then heated in an oven type glue flow furnace for 170'C30 sec. , 230℃6
The solder is heated for 0 seconds to melt it, and after cooling, the number of solder balls generated around the pattern is measured using a stereoscopic microscope with a magnification of 40 times.
２）粘着性
チップ用の電極を有する基板に、クリームはんだを印刷
し、常温で放置し、２４ｈｒ、４８ｈｒ、？２ｈｒ後３
２１６タイプのチップコンデンサーをマウンターにて２
５個のせ、基板を反転して、落下数を測定する。2) Print cream solder on a board with electrodes for adhesive chips, leave it at room temperature, and test it for 24 hours, 48 hours, ? 2 hours later 3
216 type chip capacitor with mounter
Place 5 pieces, turn the board over, and measure the number of drops.
上記クリームはんだの特性試験結果からも明らかな如く
、本発明クリームはんだは、プリント基板塗布後置時間
経過しても粘着性が失われないため、時間に制約される
ことなく生産計画がたてられるという管理面の効果があ
るばかりでなく、はんだボールの発生も少ないことから
絶縁不良や短絡のない信頼性あるはんだ付は部が得られ
るものである。As is clear from the characteristics test results of the cream solder described above, the cream solder of the present invention does not lose its adhesion even after the time elapses after being applied to a printed circuit board, so production plans can be made without being constrained by time. Not only is this effective in terms of control, but the generation of solder balls is also small, making it possible to achieve reliable soldering without poor insulation or short circuits.
Claims (1)
たクリームはんだにおいて、該フラックス中にガムロジ
ン、ウッドロジン、トール油ロジン、水添ロジン、また
は不均斉化ロジン等のロジン式骨核に、エチレンオキシ
ド類基、またはプロピレンオキシド類基を有するロジン
のポリアルキレングリコールを少なくとも１種完成分と
して有するような液状粘着付与剤が２〜６０重量％添加
されていることを特徴とするクリームはんだ。In cream solder that is a mixture of powdered solder and liquid or paste flux, the flux contains ethylene oxide groups or propylene in a rosin type core such as gum rosin, wood rosin, tall oil rosin, hydrogenated rosin, or asymmetric rosin. A cream solder characterized in that 2 to 60% by weight of a liquid tackifier having at least one rosin polyalkylene glycol having an oxide group as a final component is added.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6482786A JPS62224491A (en) | 1986-03-25 | 1986-03-25 | Cream solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6482786A JPS62224491A (en) | 1986-03-25 | 1986-03-25 | Cream solder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62224491A true JPS62224491A (en) | 1987-10-02 |
| JPH0454556B2 JPH0454556B2 (en) | 1992-08-31 |
Family
ID=13269464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6482786A Granted JPS62224491A (en) | 1986-03-25 | 1986-03-25 | Cream solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62224491A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63278695A (en) * | 1986-11-04 | 1988-11-16 | Harima Chem Inc | Creamy solder |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5751744A (en) * | 1980-09-12 | 1982-03-26 | Toho Chem Ind Co Ltd | Novel liquid tackifier |
-
1986
- 1986-03-25 JP JP6482786A patent/JPS62224491A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5751744A (en) * | 1980-09-12 | 1982-03-26 | Toho Chem Ind Co Ltd | Novel liquid tackifier |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63278695A (en) * | 1986-11-04 | 1988-11-16 | Harima Chem Inc | Creamy solder |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0454556B2 (en) | 1992-08-31 |
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