JPH01148488A - Cream solder - Google Patents
Cream solderInfo
- Publication number
- JPH01148488A JPH01148488A JP62303357A JP30335787A JPH01148488A JP H01148488 A JPH01148488 A JP H01148488A JP 62303357 A JP62303357 A JP 62303357A JP 30335787 A JP30335787 A JP 30335787A JP H01148488 A JPH01148488 A JP H01148488A
- Authority
- JP
- Japan
- Prior art keywords
- cream solder
- solder
- flux
- liq
- cream
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 52
- 239000006071 cream Substances 0.000 title claims abstract description 35
- 230000004907 flux Effects 0.000 claims abstract description 17
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000000203 mixture Substances 0.000 claims abstract 2
- 239000007788 liquid Substances 0.000 claims description 5
- 150000007524 organic acids Chemical class 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 abstract description 10
- 239000002253 acid Substances 0.000 abstract 2
- 235000011837 pasties Nutrition 0.000 abstract 1
- 239000002904 solvent Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- -1 phthalate ester Chemical class 0.000 description 3
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 125000001142 dicarboxylic acid group Chemical group 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000005923 long-lasting effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000013008 thixotropic agent Substances 0.000 description 2
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 description 1
- 229940088601 alpha-terpineol Drugs 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229940051250 hexylene glycol Drugs 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000003784 tall oil Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子機器のはんだ付けに用いるクリームはんだ
に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to cream solder used for soldering electronic devices.
クリームはんだは主としてプリント基板と電子部品の接
続に使用されるもので、そのはんだ付けは、先ずクリー
ムはんだをプリント基板上に印刷やデイスペンサー等で
適ｆ１塗布し、該クリームはんだに電子部品を粘着保持
させてから、リフロー炉、ホットプレート、熱風、赤外
線、レーザー光線、高温蒸気等で加熱することにより行
われる。Cream solder is mainly used to connect printed circuit boards and electronic components.Soldering involves first applying an appropriate amount of cream solder onto the printed circuit board using a printer or dispenser, and then adhering the electronic components to the cream solder. After being held, heating is performed using a reflow oven, hot plate, hot air, infrared rays, laser beam, high-temperature steam, or the like.
ところで、近時の電子機器は小型化されてきていること
から、これに使用する電子部品も小型化されるとともに
プリント基板に実装する電子部品の数は相当多くなって
きている。By the way, as recent electronic devices have become smaller, the electronic components used therein have also become smaller and the number of electronic components mounted on printed circuit boards has increased considerably.
従って、作業の効率化をはかるために、クリームはんだ
の塗布作業と該クリームはんだ塗布部に電子部品を搭載
する作業は全く分業されるようになり、クリームはんだ
塗布後、電子部品の搭載は直ぐ行われないことが多い。Therefore, in order to improve work efficiency, the work of applying cream solder and the work of mounting electronic components on the area to which the cream solder is applied have been completely separated, and mounting of electronic components is carried out immediately after applying cream solder. Often not.
この場合、クリームはんだの塗布されたプリント基板に
電子部品を搭載する作業は翌日になることもあるし、こ
れが週末である場合には更に長くなることもある。In this case, the work of mounting electronic components onto the printed circuit board coated with cream solder may take up to the next day, or may take even longer if it is a weekend.
従って、プリント基板のはんだ付けに用いるクリームは
んだは塗布後、電子部品を粘着させる機能を長時間持続
できるものでなければならないものである。Therefore, the cream solder used for soldering printed circuit boards must be able to maintain its ability to adhere electronic components for a long time after being applied.
従来の樹脂、溶剤、活性剤、チキソ剤等から成るフラッ
クスを用いたクリームはんだでは、粘着性がせいぜい数
時間しかもたずクリームはんだ塗布と電子部品搭載とを
分業で行う作業には適しないものであフた。Conventional cream solder, which uses flux made of resin, solvent, activator, thixotropic agent, etc., remains sticky for only a few hours at most, making it unsuitable for work in which cream solder application and electronic component mounting are divided. After.
クリームはんだの粘着性がなくなる原因はクリームはん
だが乾燥するためであり、この乾燥を防ぐ目的でクリー
ムはんだのフラックスにフタル酸エステルのような高沸
点の溶剤を添加することも提案されている。The reason why cream solder loses its stickiness is that it dries, and it has also been proposed to add a high boiling point solvent such as phthalate ester to the flux of cream solder to prevent this drying.
高沸点の溶剤を添加したクリームはんだは、たしかに粘
着性持続効果はあるが、該溶剤は、はんだ付は性を阻害
するため、はんだ付は部にはんだが十分に濡れなかった
り、はんだ付は部近辺に微小はんだボールを多量に発生
させて短絡やリーク等という電子機器の機能低下の要因
を作ることがあった。Cream solder containing a high boiling point solvent does have a long-lasting adhesive effect, but the solvent inhibits soldering properties, so the solder may not wet the solder parts sufficiently, or the solder may not wet the solder parts properly. A large amount of minute solder balls are generated in the vicinity, which can cause short circuits, leaks, and other factors that degrade the functionality of electronic devices.
本発明は、粘着性の持続があり、かつはんだ付は性が良
好ではんだボールの発生も極めて少ないというクリーム
はんだを提供することにある。An object of the present invention is to provide a cream solder that has long-lasting tackiness, good soldering properties, and extremely little generation of solder balls.
本発明者らはクリームはんだの乾燥を防ぎしかもはんだ
付は性を害することのない物質について探索した結果、
樹脂、溶剤、活性剤、チキソ剤等から成るクリームはん
だ用の液状フラックスにジカルボン酸を主成分とする有
機酸を添加するとその効果が現れることを見い出し、本
発明を完成させた。As a result of our search for a substance that prevents cream solder from drying and does not harm soldering properties, the present inventors found that
The present inventors have discovered that the effect appears when an organic acid containing dicarboxylic acid as a main component is added to a liquid flux for cream solder consisting of a resin, a solvent, an activator, a thixotropic agent, etc., and has completed the present invention.
において、該フラックス中に炭素数１２〜３日のジカル
ボン酸を主成分とする常温で液状の有機酸が５〜４０重
量％添加されているクリームはんだである。This is a cream solder in which 5 to 40% by weight of an organic acid which is liquid at room temperature and whose main component is a dicarboxylic acid having a carbon number of 12 to 3 days is added to the flux.
ジカルボン酸の炭素数が１２より少ないものは粘着性維
持に効果がなく、しかるに３８を越えたものは粘度が高
くなるためクリームはんだには使用できなくなる。本発
明では、該ジカルボン酸の有機酸はクリームはんだのフ
ラックス全量に対して５〜４０重量％添加するが、好ま
しくは１０〜２５重量％の添加が適当である。クリーム
はんだのフラックス中へのジカルボン酸の添加量が６重
量％より少ないと粘着性付与の効果が期待できず、また
４０重量％を越えて添加すると粘着性が強過ぎる所謂「
ベトッキ」が生じて印刷性を悪くする。Dicarboxylic acids with less than 12 carbon atoms are ineffective in maintaining adhesion, while dicarboxylic acids with more than 38 carbon atoms have high viscosity and cannot be used in cream solder. In the present invention, the dicarboxylic acid organic acid is added in an amount of 5 to 40% by weight, preferably 10 to 25% by weight, based on the total amount of flux in the cream solder. If the amount of dicarboxylic acid added to the flux of cream solder is less than 6% by weight, no tackifying effect can be expected, and if it is added in excess of 40% by weight, the tackiness is too strong.
"stickiness" occurs and deteriorates printability.
炭素数１２〜３８のジカルボン酸を主成分とする常温で
液状の有機酸は、トール油脂肪酸の重合によって得られ
、クリームはんだに使用した場合、腐食性がなく、はん
だ付は性やはんだ付は後のフラックス残渣の洗浄に何ら
問題になることはない。The organic acid, which is liquid at room temperature and whose main component is a dicarboxylic acid having 12 to 38 carbon atoms, is obtained by polymerizing tall oil fatty acids, and when used in cream solder, it is non-corrosive and has no soldering properties. There is no problem in cleaning the flux residue afterwards.
また、該有機酸はクリームはんだの溶剤として用いられ
るエチレングリコールモノブチルエーテル、ジエチレン
グリコールモノエチルエーテル、ジエチレングリコール
モノブチルエーテル、α−テレピネオール、１ψ２−プ
ロパンジオール、ヘキシレングリコール等にもよく溶解
するため品質の安定したものとなる。In addition, the organic acid also dissolves well in ethylene glycol monobutyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, α-terpineol, 1ψ2-propanediol, hexylene glycol, etc. used as a solvent for cream solder, so it has stable quality. Become something.
実施例１
フラックス １２重量％１５重量
％
粉末はんだ（６３Ｓｎ−Ｐｂ、２５０メツシユ） ８
８重量％実施例２
フラックス １２重量％２５重量
％
粉末はんだ（６３Ｓｎ−Ｐｂ、２５０メツシ））
８８ｉ量％実施例３
フラックス １２重量％４０重量
％
粉末はんだ（６３Ｓｎ−Ｐｂ、２５０メツシユ）
８８ｊｔ量％比較例１
フラックス １２皿量％粉末はん
だ（６３ＳｒｒＰｂ、２５０ｉツシ］） ８１３１
ｉ量％比較例２
フラックス １２重量％実施例、
比較例における粘着性、はんだボール発生量の試験結果
を第１表に示す。Example 1 Flux 12% by weight 15% by weight Powdered solder (63Sn-Pb, 250 mesh) 8
8% by weight Example 2 Flux 12% by weight 25% by weight Powdered solder (63Sn-Pb, 250 mesh))
88i amount% Example 3 Flux 12% by weight 40% by weight Powdered solder (63Sn-Pb, 250 mesh)
88jt amount % Comparative example 1 Flux 12 plate amount % powder solder (63SrrPb, 250i thickness) 8131
i amount% comparative example 2 flux 12% by weight example,
Table 1 shows the test results of the adhesiveness and amount of solder balls generated in the comparative example.
本発明によれば、クリームはんだの粘着性を長時間持続
できるため、プリント基板にクリームはんだを塗布した
後、電子部品搭載までに休日を挟んだ待ち時間があって
も、電子部品を塗布したクリームはんだに十分粘着させ
ることができ、しかもクリームはんだ自体は、はんだボ
ールの発生が少く信頼性あるはんだ付けができるという
従来にない優れた効果を有している。According to the present invention, since the adhesiveness of the cream solder can be maintained for a long time, even if there is a waiting time including a holiday before mounting the electronic components after applying the cream solder to the printed circuit board, the adhesiveness of the cream solder can be maintained for a long time. The cream solder itself can be sufficiently adhered to the solder, and the cream solder itself has an excellent effect never seen before in that it generates fewer solder balls and can perform reliable soldering.
Claims (1)
たクリームはんだにおいて、該フラックス中に炭素数１
２〜３８のジカルボン酸を主成分とする常温で液状の有
機酸が５〜４０重量％添加されていることを特徴とする
クリームはんだ。In cream solder that is a mixture of powdered solder and liquid or paste flux, the flux contains 1 carbon number.
A cream solder characterized in that 5 to 40% by weight of an organic acid which is liquid at room temperature and whose main component is a 2 to 38 dicarboxylic acid is added.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62303357A JPH01148488A (en) | 1987-12-02 | 1987-12-02 | Cream solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62303357A JPH01148488A (en) | 1987-12-02 | 1987-12-02 | Cream solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01148488A true JPH01148488A (en) | 1989-06-09 |
Family
ID=17920007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62303357A Pending JPH01148488A (en) | 1987-12-02 | 1987-12-02 | Cream solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01148488A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5674326A (en) * | 1994-09-21 | 1997-10-07 | Motorola, Inc. | Solder paste |
| US6984254B2 (en) * | 1994-09-29 | 2006-01-10 | Fujitsu Limited | Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy |
| WO2016104458A1 (en) * | 2014-12-26 | 2016-06-30 | 千住金属工業株式会社 | Flux for fast-heating method, and solder paste for fast-heating method |
-
1987
- 1987-12-02 JP JP62303357A patent/JPH01148488A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5674326A (en) * | 1994-09-21 | 1997-10-07 | Motorola, Inc. | Solder paste |
| CN1044985C (en) * | 1994-09-21 | 1999-09-08 | 摩托罗拉公司 | Solder paste and method for producing |
| US6984254B2 (en) * | 1994-09-29 | 2006-01-10 | Fujitsu Limited | Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy |
| WO2016104458A1 (en) * | 2014-12-26 | 2016-06-30 | 千住金属工業株式会社 | Flux for fast-heating method, and solder paste for fast-heating method |
| JP2016123999A (en) * | 2014-12-26 | 2016-07-11 | 千住金属工業株式会社 | Flux for rapid heating method and solder paste for rapid heating method |
| CN107107277A (en) * | 2014-12-26 | 2017-08-29 | 千住金属工业株式会社 | Anxious heating means are with scaling powder and anxious heating means soldering paste |
| CN107107277B (en) * | 2014-12-26 | 2018-11-02 | 千住金属工业株式会社 | Anxious heating means scaling powder and anxious heating means soldering paste |
| TWI661890B (en) * | 2014-12-26 | 2019-06-11 | 日商千住金屬工業股份有限公司 | Flux for rapid heating method and soft soldering paste for rapid heating method |
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