JPS62219993A - Flexible printed circuit laminate - Google Patents
Flexible printed circuit laminateInfo
- Publication number
- JPS62219993A JPS62219993A JP6269386A JP6269386A JPS62219993A JP S62219993 A JPS62219993 A JP S62219993A JP 6269386 A JP6269386 A JP 6269386A JP 6269386 A JP6269386 A JP 6269386A JP S62219993 A JPS62219993 A JP S62219993A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- flexible printed
- holes
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012790 adhesive layer Substances 0.000 claims description 15
- 229920001187 thermosetting polymer Polymers 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 description 27
- 230000001070 adhesive effect Effects 0.000 description 27
- 239000004020 conductor Substances 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、取り付け部品のリードを挿入するための貫通
孔が形成されたフレキシブルプリント回路基板に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a flexible printed circuit board in which a through hole is formed for inserting a lead of a mounting component.
従来のフレキシブルプリント回路基板２１としては、第
５図に示すように、硬質板２５上に、上面に回路パター
ンを成す導体Ｗ１２２の形成されたベースフィルム２３
を、接着剤Ｎ２４により貼着し、上記導体層２２、ベー
スフィルム２３、接着剤層２４、及び硬質板２５からな
る重層部に貫通孔２７を形成した構造のものが知られて
いる。このような構造のフレキシブルプリント回路基板
２１は、以下に説明する工程にて製造される。先ず、第
６図に示すように、離形フィルム２８と熱硬化性の接着
剤層２４とが重層された接着シート２９と、硬質板２５
とを貼着し、次に第７図に示すように、取り付け部品の
リードを挿入するための貫通孔２７ａ・２７ａを穿設す
る。その後、第５図に示すように、上記離形フィルム２
８を剥離して露出した接着剤Ｊ！１２４上に、導体層２
２とベースフィルム２３とが重層され、かつ前記貫通孔
２７ａ・２７ａに対応した貫通孔２７ｂ・２７ｂの穿設
された可撓性のプリント回路基板３０を、このプリント
回路基板３０と硬質板２５の各貫通孔２７ｂ・２７ｂ及
び２７・２７がそれぞれ連通ずるように重層して、これ
らを熱圧着することにより製造される。As shown in FIG. 5, a conventional flexible printed circuit board 21 includes a base film 23 on which a conductor W122 forming a circuit pattern is formed on the upper surface of a hard plate 25.
A structure is known in which the conductor layer 22, the base film 23, the adhesive layer 24, and the hard plate 25 are bonded together using an adhesive N24, and a through hole 27 is formed in the layered portion consisting of the conductor layer 22, the base film 23, the adhesive layer 24, and the hard plate 25. The flexible printed circuit board 21 having such a structure is manufactured through the steps described below. First, as shown in FIG. 6, an adhesive sheet 29 in which a release film 28 and a thermosetting adhesive layer 24 are layered, and a hard plate 25
Then, as shown in FIG. 7, through holes 27a and 27a for inserting the leads of the attachment parts are bored. Thereafter, as shown in FIG.
Adhesive J exposed by peeling off 8! 124, conductor layer 2
2 and a base film 23, and a flexible printed circuit board 30 in which through holes 27b and 27b corresponding to the through holes 27a and 27a are formed, the printed circuit board 30 and the rigid board 25 are It is manufactured by stacking the through holes 27b, 27b and 27, 27 so that they communicate with each other, and bonding them by thermocompression.
ところが、上記従来の構造では、第５図に示すように、
熱圧着する際に、接着剤７１２４を形成する接着剤が貫
通孔２７・２７内に流れ込み、この流れ込んだ接着剤に
より貫通孔２７・２７の孔径が縮小され、その結果、取
り付け部品のリードの挿入が妨げられる虞れがあった。However, in the above conventional structure, as shown in FIG.
During thermocompression bonding, the adhesive forming the adhesive 7124 flows into the through holes 27, 27, and the flowed adhesive reduces the hole diameter of the through holes 27, 27, and as a result, the lead of the attached component can be inserted. There was a risk that this would be hindered.
かかる問題点を解消するためには、上記のフレキシブル
プリント回路基板２１の製造工程において、熱圧着条件
を厳しく高精度に制御することが要求される。In order to solve this problem, it is required to strictly control thermocompression bonding conditions with high precision in the manufacturing process of the flexible printed circuit board 21 described above.
また、上記の問題点を解消することを目的として、第８
図に示すフレキシブルプリント回路基板が提案されてい
る。この基板は、熱圧着工程の際に、ｒｉ通孔２７・２
７内に接着剤が流れ込んで取り付け部品のリードによる
貫通孔２７・２７への挿入に支障を来すことのないよう
に、接着シート２９に形成される貫通孔３１・３１は予
め拡大して形成された構造をなしている。しかし、かか
る構造では、硬質ｖｉ、２５と接着シート２９とが貫通
孔２７と３１の同心位置からずれて接着されると、熱圧
着の際にやはり接着剤が貫通孔２７・２７内に流れ込む
ことになるため、硬質板２５に対する接着シート２９の
接着位置を高精度に設定することが要求されるといった
問題を有している。In addition, with the aim of solving the above problems, the 8th
A flexible printed circuit board shown in the figure has been proposed. During the thermocompression bonding process, this substrate is
The through-holes 31 and 31 formed in the adhesive sheet 29 are enlarged in advance so that the adhesive does not flow into the adhesive sheet 7 and interfere with the insertion of the lead of the attached component into the through-holes 27 and 27. It has a solid structure. However, in such a structure, if the hard vi, 25 and the adhesive sheet 29 are adhered out of the concentric position of the through holes 27 and 31, the adhesive may still flow into the through holes 27 and 27 during thermocompression bonding. Therefore, there is a problem in that the bonding position of the adhesive sheet 29 to the hard plate 25 must be set with high precision.
本発明は、上記従来の問題点を考慮してなされたもので
あって、フレキシブルプリント回路基板の製造工程中に
おける熱圧着工程においで、取り付け部品リード挿入用
としてのフレキシブルプリント回路基板の貫通孔に接着
剤が流れ込んでも、上記取り付け部品のリードの挿入に
支障を来すことのないフレキシブルプリント回路基板の
提供を目的とするものである。The present invention has been made in consideration of the above-mentioned conventional problems.The present invention has been made in consideration of the above-mentioned conventional problems. It is an object of the present invention to provide a flexible printed circuit board that does not interfere with the insertion of leads of the above-mentioned attachment parts even if adhesive flows into the board.
本発明に係るフレキシブルプリント回路基板は、上記の
目的を達成するために、硬質板上に熱硬化性の接着剤層
を介して、可撓性を有するプリント回路基板が設けられ
、この重層部に、取り付け部品のリードを挿入するため
の貫通孔が形成されたフレキシブルプリント回路基板に
おいて、上記硬質板に形成された貫通孔の接着剤層側に
、これと同心状の他部貫通孔より孔径が太き（拡大され
た孔径拡大部を形成することにより、熱圧着工程の際に
上記貫通孔に流れ込んだ接着剤が孔径拡大部に入り込む
ようにし、これにより取り付け部品のリードを挿入する
ための貫通孔の孔径を確保できるように構成したことを
特徴とするものである。In order to achieve the above-mentioned object, the flexible printed circuit board according to the present invention includes a flexible printed circuit board provided on a hard plate via a thermosetting adhesive layer, and a flexible printed circuit board in this multilayer part. In a flexible printed circuit board in which a through hole is formed for inserting a lead of an attached component, the through hole formed in the hard plate has a hole diameter larger than that of the other through hole concentrically with the adhesive layer side. By forming a thick (enlarged) hole diameter enlarged part, the adhesive that has flowed into the through hole during the thermocompression bonding process can enter the hole diameter enlarged part, thereby creating a through hole for inserting the lead of the attached component. It is characterized in that it is constructed so that the hole diameter can be ensured.
本発明の一実施例を第１図乃至第４図に基づいて説明す
れば、以下の通りである。An embodiment of the present invention will be described below based on FIGS. 1 to 4.
第１図に示すように、ベースフィルム４の上面に回路パ
ターンを成す導体層５・５が形成され、これにより可撓
性を有するプリント回路基板６が構成されている。この
プリント回路基板６は、熱硬化性を有する接着剤層３に
より硬質板２上に貼着されている。また、プリント回路
基板６、接着剤Ｎ３、及び硬質板２からなる重層部には
、これらを貫通するように、貫通孔７・７が所定位置に
穿設されている。上記硬質板２に形成される貫通孔７・
７は、前記接着剤層３側の孔径が、これと同心状の他部
の孔径より局部的に大きく拡大して形成された孔径拡大
部１０・１０を有している。As shown in FIG. 1, conductive layers 5 forming a circuit pattern are formed on the upper surface of the base film 4, thereby forming a flexible printed circuit board 6. This printed circuit board 6 is adhered onto the hard board 2 with a thermosetting adhesive layer 3. In addition, through holes 7 are bored at predetermined positions in the multilayer portion consisting of the printed circuit board 6, the adhesive N3, and the hard plate 2 so as to pass through them. Through hole 7 formed in the hard plate 2
7 has enlarged hole diameter portions 10 formed so that the hole diameter on the side of the adhesive layer 3 is locally enlarged to a larger extent than the hole diameter on other parts concentrically therewith.
上記の構成において、フレキシブルプリント回路基板ｌ
は、以下の工程にて製造される。先ず、第２図に示すよ
うに、離形フィルム８と接着剤層３とが重層された接着
シート９を硬質板２上に貼着し、所定位置に貫通孔７・
７を穿設する。若しくは、第３図に示すように、予め所
定位置に貫通孔７・７の穿設された硬質板２上に接着シ
ート９を貼着しても良い。次に、第４図に示すように、
前記貫通孔７・７の孔径よりも適当に大きな径のドリル
等にて、接着シート９側から、各貫通孔７・７と同心状
に穿設し、硬質板２を所定深さだけ切り込む位置に達す
るまで穿設する。その後、離形フィルム８を剥離し、第
１図に示すように、貫通孔７同士が同心位置となるよう
に硬質板２上に接着剤層３を介してプリント回路基板６
を設定する。しかる後、硬質板２上にプリント回路基板
６を熱圧着することにより、フレキシブルプリント回路
基板１が完成される。In the above configuration, the flexible printed circuit board l
is manufactured by the following steps. First, as shown in FIG. 2, an adhesive sheet 9 in which a release film 8 and an adhesive layer 3 are layered is pasted on a hard plate 2, and through holes 7 and 7 are formed at predetermined positions.
7 is drilled. Alternatively, as shown in FIG. 3, the adhesive sheet 9 may be pasted onto a hard plate 2 in which through holes 7 are previously formed at predetermined positions. Next, as shown in Figure 4,
Using a drill or the like having a diameter suitably larger than the diameter of the through holes 7, 7, drill from the adhesive sheet 9 side concentrically with each of the through holes 7, 7, and cut into the hard plate 2 to a predetermined depth. Drill until reaching . Thereafter, the release film 8 is peeled off, and the printed circuit board 6 is placed on the hard plate 2 via the adhesive layer 3 so that the through holes 7 are concentric with each other, as shown in FIG.
Set. Thereafter, the printed circuit board 6 is thermocompression bonded onto the hard board 2, thereby completing the flexible printed circuit board 1.
このように、上記のフレキシブルプリント回路基板１で
は、硬質板２の貫通孔７・７における接着剤層３側に、
これと同心状の他部の孔径より大きい孔径拡大部１０・
１０が形成されているので、熱圧着工程において接着剤
が貫通孔７・７内部に流れ込んでも、この流れ込んだ接
着剤は孔径拡大部１０−１０に流入する。そして、孔径
拡大部１０・１０に流れ込んだ上記接着剤によって、こ
の孔径拡大部１０・ｌＯの孔径は縮小されるが、本来必
要とされる貫通孔７・７の孔径に達するまでには孔径拡
大部ｌＯ・１０内への接着剤の流れ込みがなくなるので
、取り付け部品のリードの挿入に必要な孔径は、常に貫
通孔７・７に確保されることになる。In this way, in the above flexible printed circuit board 1, on the adhesive layer 3 side in the through holes 7, 7 of the hard plate 2,
The enlarged hole diameter part 10 is larger than the hole diameter of other parts concentric with this part.
10 is formed, even if the adhesive flows into the through holes 7 during the thermocompression bonding process, the adhesive flows into the enlarged hole diameter portion 10-10. The pore diameter of the pore enlarged portions 10.lO is reduced by the adhesive that has flowed into the pore enlarged portions 10.10, but the pore diameter does not expand until it reaches the originally required hole diameter of the through holes 7. Since the adhesive does not flow into the portions 1O and 10, the through holes 7 and 7 always have a hole diameter necessary for inserting the leads of the attached parts.
本発明のフレキシブルプリント回路基板は、以上のよう
に、硬質板上に熱硬化性の接着剤層を介して、可撓性を
有するプリント回路基板が設けられ、この重層部に、取
り付け部品のリードを挿入するための貫通孔が形成され
たフレキシブルプリント回路基板において、上記硬質板
に形成された貫通孔の接着剤層側に、これと同心状の他
部貫通孔より孔径を大きく拡大して形成された孔径拡大
部を有する構成である。これにより、上記フレキシブル
プリント回路基板の製造工程中の熱圧着工程において、
接着剤が貫通孔の内部に流れ込んでも、この流れ込んだ
接着剤は孔径拡大部に入り込むことになる。その結果、
他の貫通孔内への接着剤の流れ込みが回避され、また上
記孔径拡大部の孔径が接着剤によって縮小されても、取
り付け部品のリードを挿入するための孔径は確実に確保
される。したがって、上記フレキシブルプリント回路基
板を製造する際、高精度の熱圧着条件や、接着シートの
ラミネート技術等が要求されない等の効果を奏する。As described above, in the flexible printed circuit board of the present invention, a flexible printed circuit board is provided on a hard plate with a thermosetting adhesive layer interposed therebetween, and the leads of the attached parts are provided on this multilayered part. In a flexible printed circuit board in which a through hole is formed for inserting the through hole, the through hole formed in the hard plate is formed on the adhesive layer side with a hole diameter larger than that of other through holes that are concentric with the through hole. This structure has a hole diameter enlarged portion. As a result, in the thermocompression bonding process during the manufacturing process of the flexible printed circuit board,
Even if the adhesive flows into the inside of the through hole, this flowed adhesive will enter the hole diameter enlarged portion. the result,
Adhesive is prevented from flowing into other through holes, and even if the hole diameter of the enlarged hole portion is reduced by the adhesive, the hole diameter for inserting the lead of the attachment component is reliably secured. Therefore, when manufacturing the above-mentioned flexible printed circuit board, there is an advantage that highly accurate thermocompression bonding conditions, adhesive sheet lamination technology, etc. are not required.
第１図は本発明の一実施例を示すフレキシブルプリント
回路基板の断面図、第２図乃至第４図は第１図に示した
フレキシブルプリント回路基板の製造過程を示す断面説
明図、第５図は従来例を示すフレキシブルプリント回路
基板の断面図、第６図乃至第８図は第５図に示したフレ
キシブルプリント回路基板の製造過程を示す断面説明図
である。
１はフレキシブルプリント回路基板、２は硬質板、３は
接着剤層、４はベースフィルム、５は導体層、６はプリ
ント回路基板、７は貫通孔、１゜は孔径拡大部である。
特許出願人 シャープ株式会社
第１図
第２図
第３図
第４図
第５図
第６図FIG. 1 is a cross-sectional view of a flexible printed circuit board showing an embodiment of the present invention, FIGS. 2 to 4 are cross-sectional explanatory views showing the manufacturing process of the flexible printed circuit board shown in FIG. 1, and FIG. 1 is a cross-sectional view of a conventional flexible printed circuit board, and FIGS. 6 to 8 are cross-sectional explanatory views showing the manufacturing process of the flexible printed circuit board shown in FIG. 5. 1 is a flexible printed circuit board, 2 is a hard board, 3 is an adhesive layer, 4 is a base film, 5 is a conductor layer, 6 is a printed circuit board, 7 is a through hole, and 1° is a hole diameter enlarged portion. Patent applicant Sharp Corporation Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6
Claims (1)
有するプリント回路基板が設けられ、この重層部に、取
り付け部品のリードを挿入するための貫通孔が形成され
たフレキシブルプリント回路基板において、上記硬質板
に形成された貫通孔の接着剤層側に、これと同心状の他
部貫通孔より孔径を大きく拡大して形成された孔径拡大
部を有することを特徴とするフレキシブルプリント回路
基板。1. A flexible printed circuit board in which a flexible printed circuit board is provided on a hard board via a thermosetting adhesive layer, and through-holes are formed in this multilayered part for inserting leads of attached parts. The printed circuit board is characterized in that the through hole formed in the hard plate has an enlarged hole diameter portion formed on the adhesive layer side, the hole diameter of which is larger than that of other through holes that are concentric with the through hole. Flexible printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6269386A JPS62219993A (en) | 1986-03-20 | 1986-03-20 | Flexible printed circuit laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6269386A JPS62219993A (en) | 1986-03-20 | 1986-03-20 | Flexible printed circuit laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62219993A true JPS62219993A (en) | 1987-09-28 |
Family
ID=13207626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6269386A Pending JPS62219993A (en) | 1986-03-20 | 1986-03-20 | Flexible printed circuit laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62219993A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018131189A1 (en) * | 2017-01-16 | 2018-07-19 | シャープ株式会社 | Wiring board and solid-state image pickup device using same |
-
1986
- 1986-03-20 JP JP6269386A patent/JPS62219993A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018131189A1 (en) * | 2017-01-16 | 2018-07-19 | シャープ株式会社 | Wiring board and solid-state image pickup device using same |
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