JPS62219479A - Gold plated contact material - Google Patents
Gold plated contact materialInfo
- Publication number
- JPS62219479A JPS62219479A JP6298786A JP6298786A JPS62219479A JP S62219479 A JPS62219479 A JP S62219479A JP 6298786 A JP6298786 A JP 6298786A JP 6298786 A JP6298786 A JP 6298786A JP S62219479 A JPS62219479 A JP S62219479A
- Authority
- JP
- Japan
- Prior art keywords
- gold
- plating
- plated
- stainless steel
- based alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims description 75
- 229910052737 gold Inorganic materials 0.000 title claims description 58
- 239000010931 gold Substances 0.000 title claims description 58
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims description 57
- 238000007747 plating Methods 0.000 claims description 66
- 239000010935 stainless steel Substances 0.000 claims description 32
- 229910001220 stainless steel Inorganic materials 0.000 claims description 31
- 239000000956 alloy Substances 0.000 claims description 30
- 229910045601 alloy Inorganic materials 0.000 claims description 29
- 229910052802 copper Inorganic materials 0.000 claims description 23
- 239000010949 copper Substances 0.000 claims description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 238000005253 cladding Methods 0.000 claims description 17
- 239000011162 core material Substances 0.000 claims description 12
- 229910001020 Au alloy Inorganic materials 0.000 claims description 8
- 239000003353 gold alloy Substances 0.000 claims description 8
- 238000005260 corrosion Methods 0.000 description 15
- 230000007797 corrosion Effects 0.000 description 15
- 239000010410 layer Substances 0.000 description 14
- 229910000881 Cu alloy Inorganic materials 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 229910000906 Bronze Inorganic materials 0.000 description 5
- 229910000531 Co alloy Inorganic materials 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 5
- 239000010974 bronze Substances 0.000 description 5
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- RAHZWNYVWXNFOC-UHFFFAOYSA-N Sulphur dioxide Chemical compound O=S=O RAHZWNYVWXNFOC-UHFFFAOYSA-N 0.000 description 4
- SFOSJWNBROHOFJ-UHFFFAOYSA-N cobalt gold Chemical compound [Co].[Au] SFOSJWNBROHOFJ-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 2
- 239000010956 nickel silver Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- ZTXONRUJVYXVTJ-UHFFFAOYSA-N chromium copper Chemical compound [Cr][Cu][Cr] ZTXONRUJVYXVTJ-UHFFFAOYSA-N 0.000 description 1
- QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Landscapes
- Other Surface Treatments For Metallic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、コネクター、スイッチ等に用いる金めつき接
点材に関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a gold-plated contact material used for connectors, switches, etc.
〈従来の技術〉
従来、コネクターやスイッチ等の電気接点材料としては
、ベリリウム銅、りん青銅、洋白等の銅合金の単板を素
材として、その表面に銅の拡散バリヤーとしてのニッケ
ル下地めっきを施しさらにその上に電気特性、耐食性に
優れた金表面めっきを施したものが多く用いられていた
。<Conventional technology> Conventionally, electrical contact materials such as connectors and switches have been made of single sheets of copper alloys such as beryllium copper, phosphor bronze, and nickel silver, with a nickel underplating on the surface as a copper diffusion barrier. In addition, gold surface plating with excellent electrical properties and corrosion resistance was often used.
ここで、金は電気特性、耐食性に優れているため、電気
接点材料の表面にめっきする金属としては最適であるが
、その反面、金は非常に高価であるため、経済性の点か
らめっき厚を薄くし、金の消費量を極力抑えることが要
求される。Gold has excellent electrical properties and corrosion resistance, so it is ideal as a metal to be plated on the surface of electrical contact materials. However, on the other hand, gold is very expensive, so the thickness of the plating must be determined from an economic point of view. It is necessary to make the metal thinner and to reduce the amount of gold consumed as much as possible.
しかるに、金めつきの厚さを薄くすると、めっきの本質
的欠点であるピンホールの数が増加して、素地金属が腐
食される危険性が高くなり、電気接点材料にとって好ま
しくない。即ち、素地金属の腐食によりコネクターやス
イッチの接点部分の電気抵抗が増大したり、金めつきの
剥離、欠落等により、コネクターやスイッチの性能や信
頼性が低下するからである。However, reducing the thickness of gold plating increases the number of pinholes, which is an essential drawback of plating, and increases the risk of corrosion of the base metal, which is not desirable for electrical contact materials. That is, the electrical resistance of the contact portion of the connector or switch increases due to corrosion of the base metal, or the performance and reliability of the connector or switch decreases due to peeling or chipping of the gold plating.
そこで、金めつきの目付量が少なくても耐食性に優れる
金めつき接点材の開発が望まれていた。Therefore, it has been desired to develop a gold-plated contact material that has excellent corrosion resistance even with a small amount of gold plating.
〈発明が解決しようとする問題点〉
本発明の目的は、上述した従来技術の欠点を解消し、十
分な耐食性と、経済性を兼ね備えた高性能な金めつき接
点材を提供することにある。<Problems to be Solved by the Invention> The purpose of the present invention is to eliminate the above-mentioned drawbacks of the prior art and to provide a high-performance gold-plated contact material that has both sufficient corrosion resistance and economical efficiency. .
〈問題点を解決するための手段〉 このような目的は、以下の本発明によって達成される。〈Means for solving problems〉 Such objects are achieved by the present invention as described below.
即ち、本発明は、銅または銅系合金からなる芯材の片面
または両面にステンレス鋼をクラッドしたクラッド材に
、前記ステンレス銅の表面の全面または部分的に金めつ
きおよび／または金系合金めっきを施してなることを特
徴する金めつき接点材を提供するものである。That is, the present invention provides a cladding material in which stainless steel is clad on one or both sides of a core material made of copper or a copper-based alloy, and the surface of the stainless copper is entirely or partially plated with gold and/or gold-based alloy. A gold-plated contact material is provided.
また、前記ステンレス鋼の表面の全面または部分的に金
ストライクめっきを施し、その上に金系合金めっきを施
したものがよい。Further, it is preferable that the entire or partial surface of the stainless steel is plated with gold strike, and then plated with a gold alloy.
さらに、前記金系合金めっきは、硬質金合金めっきであ
るのがよい。Furthermore, the gold-based alloy plating is preferably a hard gold alloy plating.
そして、前記金めっきおよび／または金系合金めっきの
総目付量は、厚さ０．１−〜０．５−であるのが好まし
い。The total basis weight of the gold plating and/or gold-based alloy plating is preferably 0.1- to 0.5-thick.
以下、本発明の金めつき接点材を添付図面に示す好適実
施例について詳細に説明する。Hereinafter, preferred embodiments of the gold-plated contact material of the present invention shown in the accompanying drawings will be described in detail.
第１図〜第３図は、各々本発明の金めつき接点材１の拡
大断面図である。これらの図に示すように、金めつき接
点材１の素材は、銅または銅系合金の芯材（板材）２１
の両面にステンレス鋼板゛２２をクラッド（接着）した
クラッド材２で構成される。1 to 3 are enlarged cross-sectional views of a gold-plated contact material 1 of the present invention. As shown in these figures, the material of the gold-plated contact material 1 is a core material (plate material) 21 of copper or copper-based alloy.
It is composed of a clad material 2 with stainless steel plates 22 clad (adhered) on both sides.
コネクター等の接点材は、機械的特性（強度、弾性等）
と、電気的特性（導電性）を兼ね備えていることが必要
であり、従来、これに最適な材料として、ベリリウム銅
合金が使用されていたが、ベリリウム銅合金は高価であ
るため、これに代り、安価で高性能なＣｕ合金／ステン
レス鋼／Ｃｕ合金で構成されるクラッド材が提案されて
いる。ここで外層のＣｕ合金は、主に高導電性を担い、
中間層のステンレス鋼は、主に機械的特性を担うもので
ある。Contact materials such as connectors have mechanical properties (strength, elasticity, etc.)
Conventionally, beryllium copper alloy was used as the most suitable material for this purpose, but since beryllium copper alloy is expensive, it is necessary to have both electrical properties (conductivity). A cladding material composed of an inexpensive and high-performance Cu alloy/stainless steel/Cu alloy has been proposed. Here, the outer layer Cu alloy is mainly responsible for high conductivity,
The intermediate layer of stainless steel is primarily responsible for mechanical properties.
これに対し、本発明の接点材の素材たるクラッド材２は
、金めつき（または金系合金めつき）の下地層が高耐食
性のステンレス鋼となるようにするため、前記従来のク
ラッド材とは逆にステンレス鋼／ＣｕまたはＣｕ系系合
金／ステンレス子る構成となっている。In contrast, the cladding material 2, which is the material of the contact material of the present invention, is different from the conventional cladding material in order to ensure that the base layer for gold plating (or gold-based alloy plating) is highly corrosion-resistant stainless steel. Conversely, it has a structure of stainless steel/Cu or Cu-based alloy/stainless steel.
そして、芯材であるＣｕまたはＣｕ系合金が主に高導電
性を担い、その外層のステンレス鋼が主に機械的特性を
担うものである。The core material, Cu or Cu-based alloy, is primarily responsible for high conductivity, and the stainless steel outer layer is primarily responsible for mechanical properties.
クラッド材２の芯材（中間層）２１は、銅または銅系合
金で構成される。銅は銅系合金に比べ導電率が高くしか
も安価であるという利点がある。The core material (intermediate layer) 21 of the cladding material 2 is made of copper or a copper-based alloy. Copper has the advantage of higher electrical conductivity and lower cost than copper-based alloys.
しかし、クラッド材を調質する際の熱処理温度が高くな
る場合には、純銅を用いることは不適当であるため、銅
系合金、特に耐熱型の銅系合金を用いるのがよい。本発
明におけるクラッド材の芯材２１の構成材料は、上記事
情を考慮して適当に決定すればよい。ここで銅系合金と
しては、りん青銅、ベリリウム銅、銀入り銅、クロム銅
等を挙げることができる。合金元素の含有率は特に限定
されない。However, if the heat treatment temperature when refining the cladding material becomes high, it is inappropriate to use pure copper, so it is better to use a copper-based alloy, especially a heat-resistant copper-based alloy. The constituent material of the core material 21 of the cladding material in the present invention may be appropriately determined in consideration of the above circumstances. Examples of the copper alloy include phosphor bronze, beryllium copper, silver-containing copper, and chromium copper. The content of alloying elements is not particularly limited.
クラッド材２の外のステンレス鋼板２２は、通常ノステ
ンレス鋼（ＳＩＪＳ ３０４ 、１７ｉｒ’１１等）や
特殊ステンレス鋼等、工業上製造可能ないかなるステン
レス鋼で構成してもよい。The stainless steel plate 22 outside the clad material 2 may be made of any industrially manufacturable stainless steel, such as ordinary stainless steel (SIJS 304, 17ir'11, etc.) or special stainless steel.
なお、以上の説明では、クラッド材２として、芯材の両
面にステンレス鋼板をクラッドした３層構造のものにつ
いて説明したが、本発明では、芯材の片面にステンレス
鋼板をクラッドしたものでもよい。この場合においても
、芯材やステンレス鋼板の構成材料は、前記と同様であ
る。In the above description, the cladding material 2 has been described as having a three-layer structure in which stainless steel plates are clad on both sides of the core material, but in the present invention, one in which one side of the core material is clad with a stainless steel plate may also be used. Also in this case, the constituent materials of the core material and the stainless steel plate are the same as described above.
このようなりラッド材の芯材、ステンレス鋼板の厚さ、
構成比率は、接点材の用途、目的に応じて適当に選定す
ればよい。例えば接点材が機械的強度を必要とする場合
には、ステンレス鋼の被覆率を高くしたもの即ち、ステ
ンレス鋼板の厚さの比率が高いものを用い、逆に高導電
性を必要とする場合には、芯材（銅または銅系合金）の
厚さの比率が高いものを用いればよい。The core material of the rad material, the thickness of the stainless steel plate,
The composition ratio may be appropriately selected depending on the use and purpose of the contact material. For example, if the contact material requires mechanical strength, a material with a high coverage of stainless steel, that is, a material with a high thickness ratio of the stainless steel plate, should be used; conversely, if high conductivity is required, For this purpose, a material with a high thickness ratio of the core material (copper or copper-based alloy) may be used.
なお、本発明におけるクラッド材２は、後述する製造方
法との関係で、板材または帯状材あるいは所望の形状に
打ち抜かれたフレーム等いかなる形態のものでもよい。Note that the clad material 2 in the present invention may be in any form such as a plate material, a strip material, or a frame punched into a desired shape, depending on the manufacturing method described later.
本発明の金めつき接点材は、上述したようなりラッド材
２のステンレス鋼板２２上に金および／または金系合金
によるめっき層３を形成したものである。金や金系合金
めっきは、ステンレス鋼に対してめっき密着性が良好で
ある。The gold-plated contact material of the present invention has a plating layer 3 of gold and/or a gold-based alloy formed on the stainless steel plate 22 of the rad material 2 as described above. Gold or gold-based alloy plating has good plating adhesion to stainless steel.
めっき層３の形成パターンは、第１図に示すようにクラ
ッド材２の片面に全面めっきしたもの、第２図に示すよ
うにクラッド材２の片面に部分めっきしたもの、クラッ
ド材の両面に全面めっきをしたもの、全面めっきと片面
めフきを組み合せたもの等、いかなるパターンでもよく
、接点材１の用途等に応じて適当に決定すればよい。The formation pattern of the plating layer 3 is one in which one side of the cladding material 2 is fully plated as shown in Fig. 1, one in which one side of the cladding material 2 is partially plated as shown in Fig. 2, and one in which the entire surface is plated on one side of the cladding material 2 as shown in Fig. 2. Any pattern may be used, such as plated or a combination of full-surface plating and single-sided plating, and may be appropriately determined depending on the application of the contact material 1.
例えば、接点材１からコネクターを製造する場合には、
その接点部４のみに部分めっきを施すようにすることが
できる。For example, when manufacturing a connector from contact material 1,
Partial plating can be applied only to the contact portion 4.
めっき層３を構成するめっき金属としては、金の他、金
−銅合金、金−コバルト合金、金−ニッケル合金等の各
種組成の金系合金が可能である。As the plating metal constituting the plating layer 3, in addition to gold, gold-based alloys of various compositions such as gold-copper alloy, gold-cobalt alloy, gold-nickel alloy, etc. can be used.
特に、接点材ｌをコネクターのような耐摩耗性の要求さ
れる製品に加工する場合には、金−コバルト合金、金−
ニッケル合金等の硬質金合金めっきを施すのが好ましい
。In particular, when processing contact materials into products that require wear resistance such as connectors, gold-cobalt alloys, gold-cobalt alloys,
It is preferable to apply hard gold alloy plating such as nickel alloy.
また、めっき層３は、単層に限らず２以上の層からなる
金および／または金系合金めつきであってもよい。例え
ば、ステンレス鋼板２２上に金ストライクめっきを施し
、その上に上記金系合金めっきを施したものでもよく、
この場合には、金系合金めっきのめっき密着性をより向
上することができる。Further, the plating layer 3 is not limited to a single layer, and may be gold and/or gold-based alloy plating consisting of two or more layers. For example, gold strike plating may be applied on the stainless steel plate 22, and the above-mentioned gold alloy plating may be applied thereon.
In this case, the plating adhesion of the gold-based alloy plating can be further improved.
従来の金めつき接点材は、ベリリウム銅、りん青銅、洋
白等の銅合金の単板にニッケル下地めフきを施し、その
上に金めつきを施したものであつたため、素地金属の腐
食が生じないように金めつきの厚さを１−以上とするこ
とが必要であった。Conventional gold-plated contact materials were made by applying a nickel undercoat to a single plate of copper alloy such as beryllium copper, phosphor bronze, or nickel silver, and then gold plating was applied on top of that. It was necessary that the thickness of the gold plating be 1- or more to prevent corrosion.
これに対し、本発明の金めつき接点材は、金および／ま
たは金系合金めっきの下地が高耐食性のステンレス鋼で
あるため、めっき厚を従来以下とすることが可能となり
、かなりのコストダウンを図ることができる。In contrast, in the gold-plated contact material of the present invention, the base of the gold and/or gold-based alloy plating is highly corrosion-resistant stainless steel, so it is possible to reduce the plating thickness to less than the conventional thickness, resulting in considerable cost reduction. can be achieved.
特に、金めつきおよび／または金系合金めっきの総目付
量は、厚さ０．１ Ｐ〜０．５−であるのが好ましい。In particular, it is preferable that the total basis weight of gold plating and/or gold-based alloy plating is 0.1 P to 0.5 -.
目付量が０．５−を超えると、材料コストの節減を十分
に図ることができず、また０、１−未満であると、摩耗
による接触不良等の信頼性低下の要因となるからである
。If the basis weight exceeds 0.5-, it will not be possible to sufficiently reduce material costs, and if it is less than 0.1-, it will cause a decrease in reliability such as poor contact due to wear. .
なお、本発明の金めつき接点材は、上述したように接点
部４に金および／または金系合金の部分めっきを施した
場合、金めつき等がなされていない他の部分に２半田付
性を付与する等の目的から錫めっきまたは半田めっき５
等を施すなど、必要に応じて他のめっきと組み合せても
よい。In addition, in the gold-plated contact material of the present invention, when the contact portion 4 is partially plated with gold and/or a gold-based alloy as described above, the other portions not plated with gold etc. are soldered. Tin plating or solder plating for the purpose of imparting properties, etc.5
It may be combined with other plating as necessary.
このような本発明の金めつき接点材の製造方法としでは
、以下の２通りの方法が可能である。The following two methods are possible for manufacturing the gold-plated contact material of the present invention.
第１の方法は、銅系合金板（帯）の片面または両面にス
テンレス鋼板（帯）をクラッドし、このクラッド材に対
して、所望の金および／または金系合金めっきを施して
金めつき接点材とする。この板状（帯状）の金めつき接
点材に対し、打ち抜き成型加工を施して、所望の形状の
接点端子（製品）を製造する。The first method is to clad a stainless steel plate (strip) on one or both sides of a copper-based alloy plate (strip), and then apply the desired gold and/or gold alloy plating to this clad material. Use as contact material. This plate-shaped (band-shaped) gold-plated contact material is punched and molded to produce a contact terminal (product) in a desired shape.
第２の方法は、第１の方法と同様のクラッド材を製造し
、このクラッド材を打ち抜き成型加工により所望の形状
に打ち抜きこの打ち抜かれたクラッド材に所望の金およ
び／または金系合金めっきを施して金めつき接点材（製
品）とする。The second method involves manufacturing a cladding material similar to the first method, punching this cladding material into a desired shape by punching and molding, and applying desired gold and/or gold-based alloy plating to the punched cladding material. to produce gold-plated contact materials (products).
〈実施例〉
（本発明例）
ＳＯ５３０４／りん青銅／ＳＯ５３０４、ｉリナルクラ
ッド材（厚さ比率１：４：１、全板厚０．３１１１Ｑ＋
）を作製し、アルカリ電解洗浄及び１：１塩酸浸漬に
より表面を清浄化した後、ステンレス鋼表面を活性化し
めっき密着性を与えるために酸性金ストライりめっき液
により金ストライクめっきを行ない、更に、弱酸性金−
コバルト合金めっき液を用いて全面金−コバルト合金め
っきを施した。このような方法において、めっき時間、
電流密度の制御によりめっき厚が０．１ 、０．２ 、
０．３ 、０．４および０．５−の５種の試料を作製し
た。<Example> (Example of the present invention) SO5304/phosphor bronze/SO5304, ilinal clad material (thickness ratio 1:4:1, total plate thickness 0.3111Q+
), and after cleaning the surface by alkaline electrolytic cleaning and 1:1 hydrochloric acid immersion, gold strike plating was performed using an acidic gold strike plating solution to activate the stainless steel surface and give plating adhesion, and further, Weakly acidic gold
The entire surface was plated with gold-cobalt alloy using a cobalt alloy plating solution. In such a method, the plating time,
By controlling the current density, the plating thickness can be adjusted to 0.1, 0.2,
Five types of samples of 0.3, 0.4 and 0.5- were prepared.
（比較例）
りん青銅板（厚さ０．３ｍｍ ）に対し、ワット浴を用
いて厚さ２−の光沢ニッケル下地めっきを施し、更にそ
の上に実施例と同様の方法でめっき厚０．５−の金めつ
きを施した試料を作製した。(Comparative Example) A phosphor bronze plate (thickness: 0.3 mm) was coated with a 2-thick bright nickel base plating using a Watts bath, and then further plated with a thickness of 0.5 mm using the same method as in the example. A sample with - gold plating was prepared.
このようにして得られた本発明例および比較例の各試料
の耐食性を評価するため、日本電子工業振興協会規格Ｊ
ＥＩＤ八−３２ｒ電子機器用コネクタ二酸化いおう試験
方法」に準拠し、ｓｏ２ガス濃度１０±３ｐｐｍ、温度
４０±２℃に保ったデシケータ内で２４０時間暴露した
。In order to evaluate the corrosion resistance of each sample of the present invention example and comparative example obtained in this way, the Japan Electronic Industry Promotion Association Standard J
In accordance with the EID 8-32r electronic device connector sulfur dioxide test method, the test was exposed for 240 hours in a desiccator maintained at a SO2 gas concentration of 10±3 ppm and a temperature of 40±2°C.
この結果、比較例の試料では、全表面の全面に微小めっ
きフクレ、腐食生成物による斑点状変色等が認められた
が、本発明例の試料では、いずれも全表面に何らの変化
も認められず、極めて正常であった。As a result, micro plating blisters and spotty discoloration due to corrosion products were observed on the entire surface of the sample of the comparative example, but no changes were observed on the entire surface of the sample of the invention example. It was completely normal.
このことから本発明例ではめっき厚を０．５戸以下と薄
くしてもめっき密着性が良好でかつ優れた耐食性を保持
することが確認された。From this, it was confirmed that in the examples of the present invention, even if the plating thickness was reduced to 0.5 mm or less, the plating adhesion was good and excellent corrosion resistance was maintained.
〈発明の効果〉
本発明の金めつき接点材によれば、外層がステンレス鋼
のクラッド材に金および／または金系合金めっきを施し
たことにより、従来の金めつき接点材に比べ以下のよう
な諸点において優れる。<Effects of the Invention> According to the gold-plated contact material of the present invention, the outer layer is plated with gold and/or gold-based alloy on the cladding material of stainless steel, so that it has the following properties compared to conventional gold-plated contact materials: It is excellent in these points.
（１）金（金系合金）めっきの素地鋼は高耐食性のステ
ンレス鋼であるため、金（金系合金）めっきのピンホー
ルを通じての素地鋼の腐食がない。(1) Since the base steel for gold (gold alloy) plating is highly corrosion-resistant stainless steel, there is no corrosion of the base steel through pinholes in the gold (gold alloy) plating.
しかも、金（金系合金）めっきはステンレス鋼に対する
めっき密着性が良好である。Furthermore, gold (gold-based alloy) plating has good plating adhesion to stainless steel.
従って金めつき接点材は、金めつき厚を薄くしても高耐
食性、高性能を維持することができ、高価な金の消費量
を低減し、大幅なコストダウンを図ることが可能となる
。Therefore, gold-plated contact materials can maintain high corrosion resistance and high performance even if the gold plating thickness is reduced, reducing the consumption of expensive gold and making it possible to achieve significant cost reductions. .
（２）従来の金めつき接点材の製造において行っていた
ニッケル下地めっきを省略できるので、めフき工程を簡
略化することができる。(2) Since the nickel base plating that was performed in the production of conventional gold-plated contact materials can be omitted, the plating process can be simplified.
（３）素材たるクラッド材の構成材料、構成比率等やめ
っき金属、めっきの構成、パターン等を適当に選定する
ことによりコネクター、スイッチ等の製品の用途に応じ
た機械的特性、電気的特性に対応させることができるの
で、金めつき接点材から製造し得る製品のバリエーショ
ンが広がる。(3) By appropriately selecting the constituent materials, composition ratio, etc. of the cladding material, plating metal, plating composition, pattern, etc., the mechanical and electrical characteristics of the product, such as connectors and switches, can be adjusted according to the intended use. This allows for a wider variety of products that can be manufactured from gold-plated contact materials.
第１図、第２図および第３図は、各々本発明の金めつき
接点材の構成例を示す拡大断面図である。
符号の説明
ｌ・・・金めつき接点材、
２・・・クラッド材、
２１−・・芯材、 ２２−・・ステンレス鋼板、
３・・・めっき層、 ４−・・接点部。
５・・−錫または半田めっき層
１ ＦＩＧ、１FIG. 1, FIG. 2, and FIG. 3 are enlarged sectional views each showing an example of the structure of the gold-plated contact material of the present invention. Explanation of symbols l...Gold plated contact material, 2...Clad material, 21-...Core material, 22-...Stainless steel plate,
3... Plating layer, 4-... Contact portion. 5...-Tin or solder plating layer 1 FIG, 1
Claims (4)
にステンレス鋼をクラッドしたクラッド材に、前記ステ
ンレス鋼の表面の全面または部分的に金めっきおよび／
または金系合金めっきを施してなることを特徴する金め
っき接点材。(1) A cladding material in which stainless steel is clad on one or both sides of a core material made of copper or a copper-based alloy, and the entire or partial surface of the stainless steel is gold plated and/or
Or a gold-plated contact material characterized by being plated with a gold-based alloy.
ストライクめっきを施し、その上に金系合金めっきを施
した特許請求の範囲第１項に記載の金めっき接点材。(2) The gold-plated contact material according to claim 1, wherein the entire or partial surface of the stainless steel is plated with gold strike, and gold-based alloy plating is applied thereon.
特許請求の範囲第１項または第２項に記載の金めっき接
点材。(3) The gold-plated contact material according to claim 1 or 2, wherein the gold-based alloy plating is hard gold alloy plating.
目付量は、厚さ０．１μｍ〜０．５μｍである特許請求
の範囲第１項ないし第３項のいずれかに記載の金めっき
接点材。(4) The gold-plated contact according to any one of claims 1 to 3, wherein the total basis weight of the gold plating and/or gold-based alloy plating is 0.1 μm to 0.5 μm in thickness. Material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6298786A JPS62219479A (en) | 1986-03-20 | 1986-03-20 | Gold plated contact material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6298786A JPS62219479A (en) | 1986-03-20 | 1986-03-20 | Gold plated contact material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62219479A true JPS62219479A (en) | 1987-09-26 |
Family
ID=13216224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6298786A Pending JPS62219479A (en) | 1986-03-20 | 1986-03-20 | Gold plated contact material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62219479A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3211820U (en) * | 2016-03-18 | 2017-08-03 | アップル インコーポレイテッド | Precious metal alloy contacts |
-
1986
- 1986-03-20 JP JP6298786A patent/JPS62219479A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3211820U (en) * | 2016-03-18 | 2017-08-03 | アップル インコーポレイテッド | Precious metal alloy contacts |
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