JPS62218939A - Production of liquid crystal display device - Google Patents
Production of liquid crystal display deviceInfo
- Publication number
- JPS62218939A JPS62218939A JP6238786A JP6238786A JPS62218939A JP S62218939 A JPS62218939 A JP S62218939A JP 6238786 A JP6238786 A JP 6238786A JP 6238786 A JP6238786 A JP 6238786A JP S62218939 A JPS62218939 A JP S62218939A
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- mounting
- image display
- liquid crystal
- display device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 33
- 229910052751 metal Inorganic materials 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 238000007789 sealing Methods 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 15
- 238000007639 printing Methods 0.000 claims description 4
- 238000004544 sputter deposition Methods 0.000 claims description 2
- 238000007738 vacuum evaporation Methods 0.000 claims description 2
- 239000010408 film Substances 0.000 abstract description 13
- 239000010409 thin film Substances 0.000 abstract description 5
- 238000005476 soldering Methods 0.000 abstract description 4
- 210000002858 crystal cell Anatomy 0.000 abstract description 3
- 239000003795 chemical substances by application Substances 0.000 abstract description 2
- 239000011521 glass Substances 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 2
- 229910052782 aluminium Inorganic materials 0.000 abstract 2
- 229910052759 nickel Inorganic materials 0.000 abstract 2
- 229910052804 chromium Inorganic materials 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 229910052750 molybdenum Inorganic materials 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 5
- 238000000059 patterning Methods 0.000 description 5
- 238000000151 deposition Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Liquid Crystal (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、液晶表示装置の電極と画像表示駆動用回路を
接続する為の実装用台ＦＡ層の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing a mounting base FA layer for connecting electrodes of a liquid crystal display device and an image display driving circuit.
（発明の概要）
本発明は、液晶表示装置の電極に、駆動用回路を接続づ
る方法において、前記液晶表示装置の透明絶縁置板上に
最初に実装用金属層を選択的に形成した後、画像表示部
を形成し、その後、駆動用回路を接続する事に」；す、
工程数が少なく、信頼性の高い実装をできるようにした
ものである。(Summary of the Invention) The present invention provides a method for connecting a driving circuit to electrodes of a liquid crystal display device, in which a mounting metal layer is first selectively formed on a transparent insulating mounting plate of the liquid crystal display device, and then, After forming the image display section, we connected the driving circuit.
This reduces the number of steps and allows for highly reliable implementation.
（従来の技術）
従来は、第２図（ａ）に示ずように回路基板１上にｌＧ
２等によって構成された、画像表示駆動用回路は、液晶
表示装置の′Ｆｉ権用専用導電膜３接にあるいは、異方
性導電膜４を介して接続されていた。また、第２図（ｂ
）に示すように、ＩＫ用導電膜３上に実装用金属層５を
選択的に形成し、そのＬｌ］Ｃ２等をハンダ付は等によ
って実装づる方法も一般に用いられていた。(Prior Art) Conventionally, as shown in FIG. 2(a), an lG
The image display driving circuit constituted by 2 and the like was connected to a conductive film 3 exclusively for 'Fi right of the liquid crystal display device or via an anisotropic conductive film 4. In addition, Fig. 2 (b
), a method of selectively forming a mounting metal layer 5 on the IK conductive film 3 and mounting the Ll]C2 and the like by soldering, etc. was also commonly used.
（発明が解決しようとする問題点）
しかし、従来の実装方法では、電極用導電膜と回路基板
との密着性が弱かったり、異方性導電膜中に水分等が入
る事によってライン間ショートや断線を起こし信頼性が
極度に低いものとなっていた。また、ＩＣ等をハンダ付
Ｕ等によって実装する方法は信頼性は高いが、新たに実
装用金属層を」１［積しフォトエツヂング工程等によっ
てパターニングする必要がありコスト高となっていた。(Problems to be solved by the invention) However, in the conventional mounting method, the adhesion between the conductive film for electrodes and the circuit board is weak, and short circuits between lines occur due to moisture entering into the anisotropic conductive film. The wires were broken and reliability was extremely low. Furthermore, although the method of mounting ICs and the like using soldered U or the like is highly reliable, it requires a new mounting metal layer to be laminated and patterned by a photo-etching process, etc., resulting in high costs.
画像表示部を形成した後、実装用金属層を印刷等によっ
て形成する方法も考えられるが、薄膜トランジスタ等の
能動素子を用いた液晶表示装置では、電極ピッチが小ざ
くなり、位置合せ精度が悪い印刷等では困難である。After forming the image display section, it is possible to form a metal layer for mounting by printing, etc., but in liquid crystal display devices using active elements such as thin film transistors, the electrode pitch becomes small and printing results in poor alignment accuracy. etc., it is difficult.
そこで本発明は、従来のこのような欠点を解決づる為に
、パターニング工程を増加ざＵる１Ｔなく実装用金属層
を形成する製造方法を提供するものである。SUMMARY OF THE INVENTION In order to solve these conventional drawbacks, the present invention provides a manufacturing method for forming a mounting metal layer without increasing the number of patterning steps.
（問題点を解決するための手段）
上記問題点を解決するために、本発明は、実装用金ＨＩ
Ｍを、画像表示部を形成する前に、少なくとも画像表示
部を除いた部分に形成し、その後画像表示部を形成する
と同時に実装用金属層を任意の形状に形成し、画像表示
駆動用回路を実装する製造方法により、工程数を増やす
事なく、信頼性の高い液晶表示装置が可能となった。(Means for Solving the Problems) In order to solve the above problems, the present invention provides mounting metal HI
M is formed at least on a portion excluding the image display section before forming the image display section, and then, at the same time as forming the image display section, a mounting metal layer is formed in an arbitrary shape, and an image display driving circuit is formed. The mounting manufacturing method has made it possible to create a highly reliable liquid crystal display device without increasing the number of steps.
（作用）
上記のように構成された液晶表示装置の製造方法は、実
装用金属層が画像表示部以外に形成されている為、画像
表示部に薄膜トランジスタや非線形素子専の能動素子を
任意に形成する事が可能で、また画像表示部に信＠電極
をパターニングする時に、実装用金属層も同時にパター
ニングする為、新たに実装用金属層のパターニング工程
を追加する必要がない。(Function) In the manufacturing method of the liquid crystal display device configured as described above, since the metal layer for mounting is formed in areas other than the image display area, thin film transistors and active elements dedicated to nonlinear elements are optionally formed in the image display area. Furthermore, since the mounting metal layer is patterned at the same time when patterning the signal electrode on the image display section, there is no need to add a new patterning process for the mounting metal layer.
一方ＩＣ等の駆動用回路は実装用金属層４層どハンダ付
ｔ′Ｊ等によって完全に接続され、高い信頼性を保って
いる。On the other hand, the driving circuit such as an IC is completely connected to the four mounting metal layers by soldering T'J, etc., and maintains high reliability.
（実施例） 以下に本発明の実ｂ５例を図面にもとずいて説明する。(Example) Below, five practical examples of the present invention will be explained based on the drawings.
第１図は本発明の第１の実施例で、第１図（ａ）はガラ
ス等の透明絶縁基板１１上に、旧９Ｍ、＾Ｕ。FIG. 1 shows a first embodiment of the present invention, and FIG. 1(a) shows an old 9M, ^U on a transparent insulating substrate 11 made of glass or the like.
Ｃｕ、ハンダ等が含まれる実装用台ａ層１２を印刷等に
よって選択的に形成した断面図で、第１図（ｄ）は、Ｉ
Ｃ笠を実装する場合の実装用金属層１２のパターン平面
図である。第１図（ｂ）は、画像表示部１３に、配線用
電極１４を形成した断面図で、配線用電極１４は、一般
にＩＴＯ等の透明導電膜が用いられるが、画像表示部に
、薄膜トランジスタ等の能動素子を形成する場合は、Ｃ
ｒ。FIG. 1(d) is a cross-sectional view of the mounting base a layer 12 containing Cu, solder, etc. selectively formed by printing or the like.
It is a pattern plan view of the metal layer 12 for mounting when mounting a C shade. FIG. 1(b) is a cross-sectional view of the wiring electrode 14 formed in the image display section 13. The wiring electrode 14 is generally made of a transparent conductive film such as ITO, but in the image display section, a thin film transistor, etc. When forming an active element of C
r.
Ｎｏ、 Ｎｉ、 Ａｊ！等が用いられゲートあるいはド
レインと」口角する。配線用電極１４は第１図（ｅ）に
示すように少なくとも一部で、実装用電極１２と接続す
るように形成する必要がある。画像表示部を形成した情
、第１図（Ｃ）に示すように、上部透明絶縁基板１５．
シール剤１６．液晶１７等によって液晶セルの組立てを
行なった侵、ＩＣｌ３！７）実装を、ハンダ付り等によ
って実装用金属層１２十に行なう。ＩＣｌ３は第１図（
ｆ＞に示すように別の回路基板１９に取りつ１プた後実
装用金属層１２に実装する事も可能である。No, Ni, Aj! etc. are used to connect the gate or drain. The wiring electrode 14 needs to be formed so as to be connected to the mounting electrode 12 at least in part, as shown in FIG. 1(e). Regarding the formation of the image display section, as shown in FIG. 1(C), the upper transparent insulating substrate 15.
Sealing agent 16. After assembling the liquid crystal cell using the liquid crystal 17, etc., mounting is performed on the mounting metal layer 120 by soldering or the like. ICl3 is shown in Figure 1 (
It is also possible to mount it on the mounting metal layer 12 after mounting it on another circuit board 19, as shown in FIG.
画像表示部に薄膜トランジスタ等能動素子を７１〜リツ
クス状に配置した場合の第２の実施例を第３図に示す。A second embodiment is shown in FIG. 3 in which active elements such as thin film transistors are arranged in a grid pattern in the image display section.
まず第４図に示ずにうに透明ｊｉ板１１上にマスク２０
を、少なくとも画１象表示部１３が覆われるように配固
し、その後、真空蒸着法あるいはスパッター法によって
、Ｎｔ、 Ｍ、 八ｕ。First, a mask 20 is placed on the transparent jigs board 11 (not shown in FIG. 4).
are arranged so as to cover at least the image display section 13, and then Nt, M, and 8000 are deposited by vacuum evaporation or sputtering.
Ｃｕ等の含まれる実装用金属Ｐｙｊ１２を堆積した断面
図が第３図（ａ）で、第３図（ｄ）は、この時の平面図
で少なくとも画像表示部１３以外に実装用金属層１２が
堆積している。第３図（ｂ）は、画像表示部１３に、ａ
膜トランジスタのゲート電極２１を形成した図で、この
時実装用金属層１２も同時に任意の形状にパターニング
した平面図が第３図（ｅ）である。第３図（Ｃ）は、画
像表示部１３に絶縁膜２２．半導体膜２３を選択形成し
た後、ソース電極２４．ドレイン電極２５を選択した図
で、ドレイン電極２５は、実装用金属層１２と少なくと
も一部で電気的に接続していて、実装用金属層１２の少
なくともｔＣ等を実装する部分の表面は、画像表示部１
３の形成時に、露出するようにする。液晶セルの組立て
工程及びｔＣ等の実装工程は、第１の実施例と同様に行
なう。FIG. 3(a) is a cross-sectional view showing the deposition of the mounting metal Pyj12 containing Cu, etc., and FIG. It's accumulating. FIG. 3(b) shows that a
FIG. 3(e) is a plan view in which the gate electrode 21 of the membrane transistor is formed, and the mounting metal layer 12 is also patterned into an arbitrary shape at the same time. FIG. 3(C) shows an insulating film 22 on the image display section 13. After selectively forming the semiconductor film 23, the source electrode 24. In the figure in which the drain electrode 25 is selected, the drain electrode 25 is electrically connected to the mounting metal layer 12 at least in part, and at least the surface of the part of the mounting metal layer 12 where tC etc. are mounted is shown in the image. Display section 1
When forming 3, make sure to expose it. The liquid crystal cell assembly process and the mounting process such as tC are performed in the same manner as in the first embodiment.
（発明の効果）
本発明は以上説明したように、実装用金属をはじめに選
択的に堆積し、画像表示部の電極をパターニングすると
同時に、実装用金属をパターニングする為、実装用金属
のパターニング工程を減らす事ができ、低コストで、高
歩留りの液晶表示装置の製造方法を提供する効果がある
。(Effects of the Invention) As explained above, the present invention selectively deposits the mounting metal first and patterns the mounting metal at the same time as patterning the electrodes of the image display section, so the patterning process of the mounting metal is performed. This has the effect of providing a method for manufacturing a liquid crystal display device that can be reduced, is low cost, and has a high yield.
第１図（ａ）〜（ｆ）は本発明の第１実施例の液晶表示
装置の工程を示す図、第２図（ａ）。
（ｂ）は、従来の液晶表示装置の断面図で、第３図（ａ
）〜（ｅ）は、本発明の第２実施例の液晶表示装置の工
程を示す図、第４図は第２実施例にお【プる実装用金属
層堆積時の児取り図である。
１・・・回路基板
２・・・ＩＣ
３・・・電極用導電膜
４・・・異方性導′電膜
５・・・実装用金属層
１１・・・透明絶縁基板
１２・・・実装用金属層
１３・・・画像表示部
１４・・・配線用電極
１５・・・上部透明絶縁基板
１６・・・シール剤
１７・・・液晶
１８・・・ＩＣ
１つ・・・回路基板
２０・・・マスク
２１・・・ゲート電極
２２・・・絶縁膜
２３・・・半導体膜
２４・・・ソース電極
２５・・・ドレイン電極
（ａ）
（ｂ）
催６熊の〕ｂ１衾オｑ蔓置のＶな酌図
第２図FIGS. 1(a) to 1(f) are diagrams showing the steps of a liquid crystal display device according to a first embodiment of the present invention, and FIG. 2(a) is a diagram showing the steps of a liquid crystal display device according to a first embodiment of the present invention. (b) is a cross-sectional view of a conventional liquid crystal display device, and FIG.
) to (e) are diagrams showing the steps of a liquid crystal display device according to a second embodiment of the present invention, and FIG. 4 is a diagram showing the process of depositing a metal layer for mounting according to the second embodiment. 1... Circuit board 2... IC 3... Conductive film for electrode 4... Anisotropic conductive film 5... Metal layer for mounting 11... Transparent insulating substrate 12... Mounting Metal layer 13...Image display section 14...Wiring electrode 15...Upper transparent insulating substrate 16...Sealant 17...Liquid crystal 18...One IC...Circuit board 20... ... Mask 21 ... Gate electrode 22 ... Insulating film 23 ... Semiconductor film 24 ... Source electrode 25 ... Drain electrode (a) (b) Figure 2 of the V cup diagram
Claims (2)
対向する絶縁基板間に液晶を封入し、表示駆動用回路を
実装する事によつて画像表示を行なう液晶表示装置の製
造方法において、少なくとも一方の前記絶縁基板に ａ）画像表示部以外に金属層を形成する第１工程 ｂ）前記金属層が画像表示部の電極と少なくとも一部で
接触するように画像表示部を形 成すると同時に、前記金属層を選択的に除 去する第２工程 ｃ）前記金属層と表示駆動用回路を電気的に導通するよ
うに実装する第３工程 とからなる液晶表示装置の製造方法。(1) A method for manufacturing a liquid crystal display device that displays an image by sealing liquid crystal between two opposing insulating substrates on which at least one layer of transparent conductive film is deposited and mounting a display driving circuit, which includes at least a) a first step of forming a metal layer on one of the insulating substrates other than the image display area; b) forming an image display area so that the metal layer is at least partially in contact with the electrode of the image display area; A method for manufacturing a liquid crystal display device, comprising: a second step of selectively removing the metal layer; c) a third step of mounting the metal layer and a display driving circuit so as to be electrically conductive.
、真空蒸着法によって選択的に形成される事を特徴とす
る特許請求の範囲第１項記載の液晶表示装置の製造方法
。(2) The method for manufacturing a liquid crystal display device according to claim 1, wherein the metal layer is selectively formed by printing, sputtering, or vacuum evaporation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6238786A JPS62218939A (en) | 1986-03-20 | 1986-03-20 | Production of liquid crystal display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6238786A JPS62218939A (en) | 1986-03-20 | 1986-03-20 | Production of liquid crystal display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62218939A true JPS62218939A (en) | 1987-09-26 |
Family
ID=13198662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6238786A Pending JPS62218939A (en) | 1986-03-20 | 1986-03-20 | Production of liquid crystal display device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62218939A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5500787A (en) * | 1989-10-09 | 1996-03-19 | Sharp Kabushiki Kaisha | Electrodes on a mounting substrate and a liquid crystal display apparatus including same |
| US5767635A (en) * | 1993-06-04 | 1998-06-16 | Sihi Gmbh & Co. Kg | Displacement machine with electronic motor synchronization |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52113196A (en) * | 1976-03-18 | 1977-09-22 | Seiko Epson Corp | Liquid crystal unit |
-
1986
- 1986-03-20 JP JP6238786A patent/JPS62218939A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52113196A (en) * | 1976-03-18 | 1977-09-22 | Seiko Epson Corp | Liquid crystal unit |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5500787A (en) * | 1989-10-09 | 1996-03-19 | Sharp Kabushiki Kaisha | Electrodes on a mounting substrate and a liquid crystal display apparatus including same |
| US5767635A (en) * | 1993-06-04 | 1998-06-16 | Sihi Gmbh & Co. Kg | Displacement machine with electronic motor synchronization |
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