JPS6221552U - - Google Patents

Info

Publication number
JPS6221552U
JPS6221552U JP11388985U JP11388985U JPS6221552U JP S6221552 U JPS6221552 U JP S6221552U JP 11388985 U JP11388985 U JP 11388985U JP 11388985 U JP11388985 U JP 11388985U JP S6221552 U JPS6221552 U JP S6221552U
Authority
JP
Japan
Prior art keywords
semiconductor element
substrate
side wall
driving circuit
thermally conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11388985U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11388985U priority Critical patent/JPS6221552U/ja
Publication of JPS6221552U publication Critical patent/JPS6221552U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示し、ａは平面図
、ｂは側面、ｃは断面図、第２図は本考案の対象
となるパワートランジスタモジユールの一例の回
路図、第３図は本考案の異なる実施例を示し、ａ
は平面図、ｂは断面図である。 １：銅基板、２：セラミツク基板、３：トラン
ジスタチツプ、６：側壁、７：蓋体、１１：セラ
ミツク印刷基板、１２：半導体チツプ、１３：回
路部品。

Claims (1)

    【実用新案登録請求の範囲】
  1. 熱良導性の基板と主として絶縁材料からなる側
    壁および蓋体とを備える容器の基板上に、半導体
    素子およびその駆動用回路がそれぞれ絶縁板を介
    して装着されたことを特徴とする半導体装置。
JP11388985U 1985-07-25 1985-07-25 Pending JPS6221552U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11388985U JPS6221552U (ja) 1985-07-25 1985-07-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11388985U JPS6221552U (ja) 1985-07-25 1985-07-25

Publications (1)

Publication Number Publication Date
JPS6221552U true JPS6221552U (ja) 1987-02-09

Family

ID=30996111

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11388985U Pending JPS6221552U (ja) 1985-07-25 1985-07-25

Country Status (1)

Country Link
JP (1) JPS6221552U (ja)

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