JPS62211571A - Heating and heat absorbing method for electronic component - Google Patents

Abstract

PURPOSE:To increase the efficiency of measuring operation by setting an electronic component at desired temperature by using a lead terminal that the electronic component has. CONSTITUTION:An upper presser 12 moves up through the operation of a cylinder 22 and an IC 15 reaches a heating device 10 along a chute 11 and is stopped by a stopper from moving. Then, the upper presser 12 moves down through the operation of the cylinder 22 and the IC 15 is clamped between the chute 11 and upper presser 12. Namely, the reverse surface of the molding part 23 of the IC 15 is heated by the chute 11 and the root part of the lead terminal 25 of the IC 15 and the molding part 23 facing the upper presser 12 are heated by the projection part 26 of the upper presser 12. Thus, the whole of the IC 15 is heated to the desired temperature in a short period.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a heating/endothermic method for electronic components, which sets the electronic components to a desired temperature.

[Technical Background of the Invention] Conventionally, the characteristics of electronic components such as ICs and LSIs are measured not only at room temperature but also at high or low temperatures. Therefore, when measuring characteristics under high-temperature conditions, electronic components are heated before the measurement by the measuring section, and when measuring characteristics under low-temperature conditions, heat is absorbed. Such heating and heat absorption of electronic components is possible, for example, by the device described in Japanese Utility Model Publication No. 54-494ON.

FIG. 3 is a front sectional view showing a conventionally commonly used IC heating device. In the figure, 1 is a chute constituting a lower heating element, 2 is a chute disposed opposite to the chute 1, and is directed in the direction of arrow A. An upper presser 3.4 constituting the upper heating body which can be moved up and down as needed is a heater embedded in the chute 1 and the upper presser 2, respectively. The IC 5 falling down the chute 1 in the C heating device under its own weight is temporarily prevented from falling by a stopper (not shown).

Then, the upper presser 2 moves downward and its tip abuts the molded part 6 of the IC 5, so that the IC5, particularly the molded part 6, is held between the chute 1 and the upper presser 2. In this state, I'C5 is heated and set to a desired temperature suitable for measurement. Thereupon, the upper presser 2 moves upward, and the stopper releases the movement prevention of the IC5, and therefore,
The IC 5, which has been set to a desired temperature, moves to the measurement section, where its characteristics are measured.

Although the heating device has been described above, the other aspects are the same in the heat absorbing device by replacing the heater 3.4 with a medium such as fluid nitrogen.

[Problems in the Background Art] As described above, in the conventional heating/endothermic device, the heating body or heat absorbing body is brought into contact with the molded portion 6 of the IC 5, and the heat of the IC 5 is transmitted through the molded portion 6. Raise (heating) or lower (endotherm) the internal temperature of the IC
5 to the desired temperature. By the way, since the mold part 6 is made of resin or ceramic and heat transfer is relatively slow, it takes a long time to set the IC 5 to a desired temperature, which hinders the improvement of work efficiency.

[Object of the Invention] The present invention has been made to eliminate the above-mentioned drawbacks, and provides a heating/endothermic method for electronic components that allows electronic components having lead terminals to be set to a desired temperature in a short time. In order to achieve the above object, the present invention is characterized in that a lead terminal of an electronic component is used, and a heating body or a heat absorbing body is brought into contact with this lead terminal. .

[Embodiments of the Invention] Examples of the present invention will be described below. FIG. 1 shows a front sectional view showing a first embodiment of a heating device used to carry out the present invention. In the figure, the heating device 10 has a chute 11 constituting a lower heating body and an upper presser 12 constituting an upper heating body, each of which extends in a direction perpendicular to the plane of the paper. Furnace body 1
Surrounded by 4. The chute 11 guides the movement of a dual inline type IC (DIP type IC>15) on its upper surface, and has a heater 16 inside and a heat insulating material 17.
It is fixed to the lower furnace body 13 via. On the other hand, upper presser 12
A vertical rod 19 is provided with a heater 16 and is disposed on the upper furnace body 14 through a bush 18 so as to be vertically movable in the direction of arrow B.
is supported via a heat insulating material 20. A spring 21 is interposed between the heat insulating material 20 and the upper furnace body 14, so that the upper and lower rods 19 are constantly urged downward.
Further, the vertical movement of the vertical rod 19 is appropriately performed by a cylinder 22 fixed to the upper furnace body 14.

In the lower part of the upper presser 12, that is, the part facing the ICl3, there is a groove 24 facing the molded part 23 of the IC 15.
is provided, and protrusions 26 are provided at both ends to contact the root portions of lead terminals 25 of the IC 15. Note that in the figure, there is a gap S between the bottom of the groove 24 and the mold part 23 of the ICl3, but the mold part 23
It may be formed so as to be in contact with. Reference numerals 27 and 28 in the figure indicate temperature sensors attached to the chute 11 and the upper presser 12, and although not shown, the chute 11 is provided with a stopper that temporarily prevents the sliding ICl 3 from moving.

Next, the operation of the above configuration will be explained. First, the upper presser 12 is moved upward by the operation of the cylinder 22. The ICl3 then reaches the heating device 10 along the chute 11, and this rc15 is stopped from moving by a stopper.

Next, the upper presser 12 is moved downward by the operation of the cylinder 22, and the ICl3 whose movement has been stopped is in a state where it is held between the chute 11 and the upper presser 12. That is, the lower surface of the mold part 23 of the ICl3 is heated by the chute 11, and the upper presser 1
The base portion of the lead terminal 25 of the ICl 3 and the mold portion 23 facing the upper presser 12 are heated by the protruding portion 26 of the second portion. Note that if the bottom of the groove 24 and the top of the mold part 23 are formed so as to be in contact with each other, the top surface of the mold part 23 will also be directly heated. When ICl3 is heated to the desired temperature in this way,
The upper presser 12 is moved upward by the operation of the cylinder 22, the stopper releases the movement prevention of the IC'15, and the ICl3 set at the desired temperature moves to the measuring section.

As described above, in the first embodiment described above, the lead terminal of the DIP type ICl 3 is brought into direct contact with the protrusion 26 of the upper presser 12, which is a heating body, to heat the ICl 3.

Therefore, when heating only from the mold part 23, the IC is heated through the lead terminal 25 made of metal with good heat transfer.
Since ICl3 is heated, it becomes possible to raise the entire ICl3 to a desired temperature in a shorter time.

Next, the second embodiment, a flat package type IC30
The heating device 31 will be explained using FIG. 2. In the drawings, parts that are the same as those in FIG. 1 are designated by the same reference numerals, and their explanations will be omitted. The heating device 31 includes a chute 32 constituting a lower heating body and an upper presser 33 constituting an upper heating body.
and each extending in a direction perpendicular to the plane of the paper,
The whole is surrounded by a lower furnace body 13 and an upper furnace body 14.

A groove 34 is formed on the upper surface of the chute 32, and the IC 30 is guided by this groove 34. On the other hand, the upper presser 33 has a concave groove 36 in a portion facing the mold part 35 of the IC 30, and a protrusion 38 is provided in a position facing the tip of the lead terminal 37 of the IC 30. In addition, in the figure, the concave groove 36 of the upper presser 33 and the IC
There is a gap tn between the mold part 35 of 30,
It may be formed so as to be in contact with the mold part 35.

The operation and effects of this configuration are the same as those of the previously shown embodiment, and will therefore be omitted.

Note that in both of the above two embodiments, the heating device has been explained, but if the IC is to absorb heat to a desired temperature, a medium such as liquid nitrogen may be used instead of the heater 16, so a detailed explanation of the heat absorbing device will be omitted. do.

[Effects of the Invention] According to the method of heating and absorbing heat for electronic components according to the present invention, the lead terminals of the electronic components are used to set the electronic components to a desired temperature, so the electronic components can be heated in a shorter time than before. This makes it possible to greatly increase work efficiency.

[Brief explanation of drawings]

FIG. 1 is a front sectional view showing a first embodiment of a heating device for implementing the present invention, FIG. 2 is a front sectional view showing a second embodiment of the heating device, and FIG. 3 is a conventional heating device. A front sectional view of the device is shown in each case. 1.11.32...shoot, 2.12.33...
Upper presser, 3.4.16... Heater, 5.15.3
0...IC110,31...Heating device, 25.37
...Lead terminal.

Claims (1)

[Claims] (1) In a method of heating and absorbing heat for an electronic component, the heating body or heat absorbing body is brought into contact with the electronic component having lead terminals to set the electronic component at a desired temperature. A method for heating and absorbing heat from an electronic component, characterized in that the electronic component is brought into contact with a lead terminal of the component.