JPS6220552A - Phenolic resin molding material - Google Patents

Abstract

PURPOSE:To provide the titled molding material containing a specific amount of colemanite, having excellent solvent-resistance and injection moldability and low impurity ion content, and suitable for a molded resin article to seal an electrical or electronic part, especially as a sealing plate for capacitor. CONSTITUTION:A phenolic resin is compounded with 10-70wt% colemanite of formula based on the whole composition. A molding material having objective characteristics can be produced owing to the low impurity ion content and high solvent resistance and moldability of colemanite.

Description

[Detailed Description of the Invention] [Field of Witchcraft] The present invention relates to resin molded products for sealing electronic parts, particularly injection moldable phenolic resin molding materials for use in sealing plates for T1I capacitors and the like. It is something.

[Background technology]

In recent years, in order to improve the performance, reliability, and productivity of electric and electronic I'd devices, encapsulation that has surpassed that of plastic has come to be used. These electrical and electronic components include transistors, diodes, capacitors, filters, rectifiers, resistors, coils, etc. In particular, phenolic resin molding materials used for capacitor sealing plates require solvent resistance,
There were problems with injection moldability and impurity ions such as chlorine ions in the molding material. In other words, if the solvent resistance is poor, material deterioration will be significant, if the injection moldability is poor, the appearance of the molded product will be poor and the molding efficiency will be lowered, and if there are many impurity ions in the molding material, the capacitor aluminum terminals will be corroded. It's for a reason.

[Purpose of the invention]

An object of the present invention is to provide a phenolic resin molding material that has excellent solvent resistance and injection moldability, and has a low content of impurity ions in the molding material.

[Disclosure of the invention]

The present invention is a phenolic resin molding material characterized by containing colemanite, and because of colemanite itself's low impurity ion content, solvent resistance, and good moldability, the objects can be achieved as follows. The present invention will be described in detail.

The colemanite included in the present invention has the following structural formula.

20a0.3B*Os, 5Hz The amount of O colemanite is preferably 10 to 70% by weight (hereinafter referred to as "A") of the total amount.

That is, if it is less than +oq6, it tends to be difficult to improve solvent resistance and injection moldability, and if it exceeds 70qb, solvent resistance and injection moldability tend to decrease due to a decrease in the phenolic resin content. As a phenolic resin, phenol,
Phenol resins consisting of cresol, xylenol, etc. alone or in mixtures, and even phenol resins modified with naphthalene, molasses, aromatic hydrocarbons, epoxy, oil, etc., which can modify phenol resins, can also be used. Either a novolabuku type phenolic resin or a resol type phenolic resin can be used. Additives other than phenol resin and colemanite include wood flour, pulp, cotton powder, asbestos, glass fiber, synthetic TAA, organic fillers such as calcium carbonate, clay, silica, magnesium carbonate, talc, inorganic fillers and hardening agents, A surfactant, a mold release agent, a coloring agent, etc. are added as necessary, and a phenol resin molding material is obtained by mixing, mixing, crushing, and further granulating as necessary. Regarding molding of the phenolic resin molding material, it is suitable not only for injection molding but also for transfer molding, compression molding, etc.

The present invention will be explained below using examples.

Examples 1 to 4 and Comparative Examples 1 to 7 Materials were blended, mixed, kneaded, and crushed according to the recipe in Table 1 to obtain a phenolic resin molding material, and a nucleic acid molding material was injection molded to produce a sealing plate for an electrolytic capacitor. Obtained.

Table 1 [Effects of the Invention] As is clear from Table 2, the solvent resistance, injection moldability, and chlorine ion concentration in the molding materials of Examples 1 to 4 and Comparative Examples 1 to 7 are as follows. The performance of the material was good, and it was confirmed that the phenolic resin molding material of the present invention is excellent.

Table 2 Note: 20 hours tu in dimethylformamide at 100℃
It is the weighted Iσ reduction rate of M erV;:.

Claims (2)

[Claims] (1) A phenolic resin molding material characterized by containing colemanite. (2) The phenolic resin molding material according to claim 1, wherein the amount of colemanite is 10 to 70% by weight of the total amount.