JPS61285248A - Epoxy resin molding material - Google Patents

Abstract

PURPOSE:The titled material, obtained by incorporating an organopolysiloxane with a bicyclic amidine compound and having improved heat cycle resistance, electrical insulating properties and moldability. CONSTITUTION:An epoxy resin molding material containing an organo polysiloxane and a bicyclic amidine compound. An organopolysiloxane having >=1 epoxy groups in one molecule is used as the organopolysiloxane, and incorpo rated to give 0.1-10wt% based on the total amount. The bicyclic amidine compound is incorporated in an amount of 0.1-10wt% based on the total am ount. A polyfunctional epoxy resin having >=2 epoxy groups in one molecule is used as the epoxy resin.

Description

[Detailed Description of the Invention] [Technical Field] The present invention relates to an epoxy resin molding material A used for electronic equipment, electrical equipment, communication equipment, computing equipment, molded products and parts for vehicles and ships, and for sealing electronic parts. It is.

[Background technology]

Traditionally, electronic component encapsulation products and metal insert molded products have been required to have heat cycle resistance and excellent 1-volt insulation.
Imidazole compounds are widely used as curing aids, but they have problems such as large occurrence of flash during molding and no noticeable improvement in heat cycle resistance.

[Purpose of the invention]

An object of the present invention is to provide an epoxy resin molding material that has excellent heat cycle resistance, excellent electrical properties, and moldability.

[Disclosure of the invention]

The present invention is an epoxy resin molding material characterized by containing an organopolysiloxane and a bicyclic amidine compound. By adding this, it was possible to prevent heat cycle and also improve heat cycle resistance, and the present invention will be described in detail below.

The organopolysiloxane used in the present invention is represented by formula 1, and is preferably an organopolysiloxane □ having one or more epoxy groups in one molecule, and the amount added is preferably the same as the total amount. 9.1~to
It is desirable that it is tfi4 (hereinafter simply referred to as ``kate'').
That is, if it is not soaked at 0.1%, it is difficult to improve heat cycle resistance, and it is difficult to prevent Paris from flowing out during molding. This is because it is preferable for metal insert molding.

(In formula 1, R represents a hydrogen group, a methyl group, or a phenyl group, but it is preferable that a part of R is further modified with a hydroxyl group, an amino group, or an epoxy group.) As a bicyclic amidine compound For example, BBU manufactured by SunApoft Co., Ltd. may be used, but is not limited to this, but it is desirable that the amount added is preferably 0.1 to % of the total amount. That is, if it is less than 0.1 inch, the electrical insulation properties tend to decrease, and if it exceeds 10 degrees, the material storage stability tends to decrease. Epoxy resins include bisphenol Affi epoxy resin, novolac type epoxy resin,
Fluorescents, mixtures, modified products, etc. of resol type epoxy resins, halogenated epoxy resins, glycidyl ester type epoxy V resins, polymer type epoxy resins, etc. can be incorporated, but there is no particular limitation, but preferably one molecule It is desirable to use a polyfunctional epoxy resin having two or more epoxy groups in it18. As a curing agent, amine curing agent, aliphatic polyamine, polyamide resin, aromatic diamine, acid anhydride curing agent, Lewis acid complex compound, aromatic polyamine, polycarboxylic acid, polycarboxylic acid fluoride, trifluoride Boron monoethylamine, dicyandiamide, imidazole, phenol resin, melamine resin, acrylic resin, urea resin, isocyanate, etc. may be used, but are not particularly limited, but preferably in one molecule. It is desirable to incorporate a phenolic resin having two or more hydroxyl groups into the material, and examples of fillers and reinforcing agents include glass fiber, metal whiskers, carbon fiber, Kepler fiber,
Polyester fiber, polyamide fiber, pulp, asbestos, calcium silicate, pallite, mica, clay, sericite, alumina, molybdenum sulfide, calcium carbonate,
Silicic acid, basic magnesium carbonate, magnesium carbonate, calcium hydroxide, aluminum hydroxide, antimony trioxide, talc, 1,000 tananium oxide, etc. can be used, and stearic acid and stearic acid can be used as other additives if necessary. Mold release agents such as zinc, calcium stearate, and Work J-X, coloring agents such as carbon black, iron oxide, and pigments, surface treatment agents such as gamma-aminopropyltriethoxysilane,
It is possible to add flame retardants and the like. These epoxy resins and hardeners.

Organopolysiloxane, bicyclic amidine compound, mold release agent, coloring agent, etc. are added, mixed, and pulverized, and further granulated as necessary to obtain an epoxy resin molding material, and the molding material is transferred and molded. , injection molding, compression molding, extrusion molding, etc. to obtain encapsulated electronic parts, metal insert molding 8, and general molded products.

The present invention will be explained below based on examples.

Examples 1 to 3 and Comparative Examples 1 and 2! Based on the formulation table in Table 1, the materials are blended, mixed, mixed, and crushed to obtain an epoxy resin molding material, and the molding material is molded using a transfer molding machine at a mold temperature of 160°C and a molding pressure of
The electronic component was sealed with resin under the conditions of 4% Kg/kg and 2 minutes of curing time to obtain a sealed electronic component.

〔Effect of the invention〕

As clearly shown in Table 2, the heat cycle resistance, electrical insulation properties, and moldability of Examples 1 to 3 and Comparative Examples 1 and 2 are good, and the performance of the present invention is good, indicating the superiority of the epoxy V resin molding material of the present invention. I confirmed that

Claims (4)

[Claims] (1) An epoxy resin molding material containing an organopolysiloxane and a bicyclic amidine compound. (2) The epoxy resin molding material according to claim 1, which is an organopolysiloxane having one or more epoxy groups in one molecule. (3) The amount of organopolysiloxane is 0.1 to 0.1 of the total amount
Claim 1 characterized in that the amount is 10% by weight.
2. Epoxy resin molding material according to item 2. (4) The amount of bicyclic amidine compound is 0.1 to 1 of the total amount
The epoxy resin molding material according to claim 1, characterized in that the content is 0% by weight.