JPS62204339U - - Google Patents
Info
- Publication number
- JPS62204339U JPS62204339U JP9266786U JP9266786U JPS62204339U JP S62204339 U JPS62204339 U JP S62204339U JP 9266786 U JP9266786 U JP 9266786U JP 9266786 U JP9266786 U JP 9266786U JP S62204339 U JPS62204339 U JP S62204339U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dip
- dissipation fin
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 3
- 230000013011 mating Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9266786U JPS62204339U (enExample) | 1986-06-17 | 1986-06-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9266786U JPS62204339U (enExample) | 1986-06-17 | 1986-06-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62204339U true JPS62204339U (enExample) | 1987-12-26 |
Family
ID=30954575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9266786U Pending JPS62204339U (enExample) | 1986-06-17 | 1986-06-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62204339U (enExample) |
-
1986
- 1986-06-17 JP JP9266786U patent/JPS62204339U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS62204339U (enExample) | ||
| JPH028097U (enExample) | ||
| JPS58166049U (ja) | ハイブリツトｉｃの放熱構造 | |
| JPS63128742U (enExample) | ||
| JPS6022841U (ja) | 放熱器 | |
| JPH0180948U (enExample) | ||
| JPS63100893U (enExample) | ||
| JPH0361386U (enExample) | ||
| JPH0265347U (enExample) | ||
| JPS594650U (ja) | 半導体装置 | |
| JPS63193896U (enExample) | ||
| JPS62174341U (enExample) | ||
| JPS6146745U (ja) | 集積回路装置の集中放熱機構 | |
| JPH01104039U (enExample) | ||
| JPS59182939U (ja) | ラジエ−タ付き半導体パツケ−ジ | |
| JPH0276844U (enExample) | ||
| JPS6439649U (enExample) | ||
| JPH0233494U (enExample) | ||
| JPS5996841U (ja) | 混成集積回路の放熱構造 | |
| JPH02125348U (enExample) | ||
| JPS6255354U (enExample) | ||
| JPS58166048U (ja) | Ｉｃパツケ−ジ | |
| JPH0426550U (enExample) | ||
| JPS6343446U (enExample) | ||
| JPS59159954U (ja) | プリント基板用放熱装置 |