JPS62202547A - Electronic circuit device - Google Patents

Electronic circuit device

Info

Publication number
JPS62202547A
JPS62202547A JP61044649A JP4464986A JPS62202547A JP S62202547 A JPS62202547 A JP S62202547A JP 61044649 A JP61044649 A JP 61044649A JP 4464986 A JP4464986 A JP 4464986A JP S62202547 A JPS62202547 A JP S62202547A
Authority
JP
Japan
Prior art keywords
lead wire
round bar
soldered
flat
land
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61044649A
Other languages
Japanese (ja)
Inventor
Masayuki Kataoka
正行 片岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP61044649A priority Critical patent/JPS62202547A/en
Publication of JPS62202547A publication Critical patent/JPS62202547A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To improve reliability by increasing the strength of the connection of a soldered region and making its structure difficult to be affected by an external stress by soldering an expansion formed at one end of a round-bar-like lead wire and part of the round bar continuous to the expansion with a wiring formed on a substrate. CONSTITUTION:A lead wire has a round bar 43 and a flat 44 which is formed at the end of the round bar 43 and is soldered with the land 3 of a wiring provided on a substrate 2. The flat 44 and part of the round bar continuous to the flat of the lead wire 4 are soldered with the land 3. In this structure, the strength of the soldering of the lead wire 4, i.e., the strength against peeling, is increased and an external peel stress has difficulty in effecting since the lead wire 4 is the round bar.

Description

【発明の詳細な説明】 〔産業上の利用分舒〕 この発明は電子＠路装置、特に配ｔ、１１Ｎ４造に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application] The present invention relates to an electronic @path device, particularly a 11N4 type device.

〔従来の技術〕[Conventional technology]

従来のこの種電子回路装置は、第４図〜第７図に示すよ
うに構成されていた。即ち第４図〜第７図において、１
はパッケージ、２はパッケージ１内に収納された混成集
積回路基板、３は基板２に形成された配線のランド部、
４は一端がランド部３に半田付部５によって取付けられ
、他端がパッケージ１に設けられた外部端子６に接続さ
れたリード線である。Conventional electronic circuit devices of this type have been constructed as shown in FIGS. 4 to 7. That is, in FIGS. 4 to 7, 1
2 is a package, 2 is a hybrid integrated circuit board housed in package 1, 3 is a land portion of wiring formed on substrate 2,
A lead wire 4 has one end attached to the land portion 3 by a soldering portion 5 and the other end connected to an external terminal 6 provided on the package 1.

ここでリード線４は通常第６図に示す如く半田メッキ等
を施した丸棒線４１或いは第７図に示す如くニッケル等
のリボンリード線４２等が用いられていた。Here, the lead wire 4 is usually a solder-plated round bar wire 41 as shown in FIG. 6 or a ribbon lead wire 42 made of nickel or the like as shown in FIG. 7.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

ところでリード線４として丸棒線４１を用いてランド部
３に半田付けした場合は、作業性がよくランド部３に応
力もかかりにくいが、パッケージ１に外部端子６に接続
する場合の成形時にかかるストレスや製品の外部環境ス
トレスに対しては、接続強度即ちランド部３からのひき
はがし強度が弱く工程内ではずれる場合がある。By the way, when the round bar wire 41 is used as the lead wire 4 and is soldered to the land portion 3, the workability is good and stress is not applied to the land portion 3 easily, but stress is applied during molding when connecting to the external terminal 6 of the package 1. With respect to stress and external environmental stress of the product, the connection strength, that is, the peeling strength from the land portion 3 is weak, and it may come off during the process.

まｌコ接続面積を大きくして接続強度を大きくするため
リボンリード線４２を用いると成形時に曲げ応力、即ち
ビール性の力がランド部３の半田付部５に加わってこの
部分が劣化する等信頼性の点でＲ題があった。If a ribbon lead wire 42 is used to increase the connection strength by increasing the round connection area, bending stress, i.e. beer force, is applied to the soldered part 5 of the land part 3 during molding, causing deterioration of this part. It was rated R in terms of reliability.

この発明はこのような従来のものの問題点を解消するた
めになされたもので、作業性が良くかつ外部から加わる
応力に対し非常に強り、シかも半田付けするランド部に
対しほとんど応力のかからない信頼性の高い電子回路装
置を得ようとするものである。This invention was made in order to solve the problems of the conventional products, and it has good workability and is very strong against stress applied from the outside, and almost no stress is applied to the land part to be soldered. The aim is to obtain a highly reliable electronic circuit device.

〔問題点を解決するための手段〕[Means for solving problems]

この発明に係る電子回路装置は、丸棒状のリード線の一
端に拡大部を形成し、この拡大部をこれに続く丸棒部の
一部を共に基板上に形成された配線に半田付けしたもの
である。The electronic circuit device according to the present invention has an enlarged part formed at one end of a round bar-shaped lead wire, and a part of the round bar part following this enlarged part is soldered to wiring formed on a board. It is.

〔作用〕[Effect]

この発明に係るリード線は、拡大部とこれに続く丸棒部
の一部が共に配線に半田付けされるので、半田付部の接
続強度が増大すると共に半田付部近傍におけるリード線
へのビール性の力が加わり難くなる。In the lead wire according to the present invention, both the enlarged part and a part of the round bar part following it are soldered to the wiring, so the connection strength of the soldered part is increased and the beer to the lead wire near the soldered part is increased. It becomes difficult to apply sexual power.

〔実施例〕〔Example〕

以下この発明の一実施例を第１図〜第３図にもとづいて
説明する。即ち第１図〜第３図において、４は丸棒部４
３とこれの端部に形成され基板２に配置されｔこ配線の
ランド部３に半田付けされろ平坦部４４とを有するリー
ド線である。ここでランド部３にはリード線４の平坦部
４４とこれに続く丸棒部の一部とを半田付けするように
する。なおその他の構成は第４図〜第７図に示す従来の
ものと同様であるので説明を省略する。An embodiment of the present invention will be described below with reference to FIGS. 1 to 3. That is, in FIGS. 1 to 3, 4 represents the round bar portion 4.
3 and a flat portion 44 formed at the end of the lead wire and disposed on the substrate 2 and soldered to the land portion 3 of the lead wire. Here, the flat part 44 of the lead wire 4 and a part of the round bar part following the flat part 44 of the lead wire 4 are soldered to the land part 3. The rest of the structure is the same as the conventional one shown in FIGS. 4 to 7, so the explanation will be omitted.

このように構成されｒこものでは、リード線４の半田付
強度即ち引きはがし強度が増大すると共にリード線４が
丸棒部材であるためビール性の応力が外部から加わりに
くい。With this structure, the soldering strength, that is, the peeling strength, of the lead wire 4 is increased, and since the lead wire 4 is a round bar member, beer stress is not easily applied from the outside.

なお、リード線４の半田付けする先端部分の形状はここ
では平坦なつぶし形状のものを示したが、その外に接触
面積を増加し配線のランド部の接続強度を上げるｔコめ
の拡大部を有する形状であればよい。The shape of the tip of the lead wire 4 to be soldered is shown here as a flat crushed shape, but there is also an enlarged part that increases the contact area and increases the connection strength of the land part of the wiring. Any shape is sufficient as long as it has the following.

〔発明の効果〕〔Effect of the invention〕

上記のようにこの発明による電子回路装置は、リード線
の一端に形成された拡大部とこれに続く丸棒部の一部が
共に配線に半田付けされるので、半田付部の接続強度が
増大すると共に外部からの応力が加わすｔ、ｆｌい構造
となり信頼性が向上する。As described above, in the electronic circuit device according to the present invention, the enlarged part formed at one end of the lead wire and a part of the round bar part following this are both soldered to the wiring, so the connection strength of the soldered part is increased. At the same time, external stress is applied to the structure, resulting in a thinner structure and improved reliability.

【図面の簡単な説明】[Brief explanation of drawings]

第１図〜第３図はいずれろこの発明の一実施例を示す図
で、第１図は要部平面図、第２図は要部拡大側面図、第
３図は要部拡大平面図、第４図〜第７図はいずれも従来
のこの種電子回路装置を示す図で、第４図は部分側断面
図、第５図は要部拡大側面図、第６図および第７図は要
部拡大平面図である。 図中、１はパッケージ、２は基板、３はランド部、４は
リード線、４３は丸棒部、４４は平坦部、５は半田付部
、６は外部ｊ、ｌ、：ｊ子である。 尚、図中同一符号は同−又Ｃま相当部分を示ず。1 to 3 are views showing an embodiment of the present invention, in which FIG. 1 is a plan view of the main part, FIG. 2 is an enlarged side view of the main part, and FIG. 3 is an enlarged plan view of the main part. Figures 4 to 7 all show conventional electronic circuit devices of this type, with Figure 4 being a partial side sectional view, Figure 5 being an enlarged side view of the main parts, and Figures 6 and 7 showing the main parts. FIG. In the figure, 1 is the package, 2 is the board, 3 is the land part, 4 is the lead wire, 43 is the round bar part, 44 is the flat part, 5 is the soldering part, and 6 is the external j, l, :j part. . Note that the same reference numerals in the drawings do not indicate corresponding parts.

Claims (2)

【特許請求の範囲】[Claims] （１）一端に拡大部が形成された丸棒状のリード線、こ
のリード線の拡大部とこれに続く丸棒部の一部が共に半
田付けされる基板上に形成された配線を備えた電子回路
装置。(1) An electronic device comprising a round bar-shaped lead wire with an enlarged part formed at one end, and wiring formed on a board to which the enlarged part of this lead wire and a part of the round bar part following it are soldered together. circuit device. （２）リード線の拡大部は平坦状に形成されている特許
請求の範囲第１項記載の電子回路装置。(2) The electronic circuit device according to claim 1, wherein the enlarged portion of the lead wire is formed in a flat shape.
JP61044649A 1986-02-28 1986-02-28 Electronic circuit device Pending JPS62202547A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61044649A JPS62202547A (en) 1986-02-28 1986-02-28 Electronic circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61044649A JPS62202547A (en) 1986-02-28 1986-02-28 Electronic circuit device

Publications (1)

Publication Number Publication Date
JPS62202547A true JPS62202547A (en) 1987-09-07

Family

ID=12697288

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61044649A Pending JPS62202547A (en) 1986-02-28 1986-02-28 Electronic circuit device

Country Status (1)

Country Link
JP (1) JPS62202547A (en)

Similar Documents

Publication Publication Date Title
US6037662A (en) Chip scale package
US5358598A (en) Folded bus bar leadframe and method of making
JPS63258050A (en) Semiconductor device
JPS62232948A (en) Lead frame
JPS62202547A (en) Electronic circuit device
JPH04196555A (en) Tab package
JP4467195B2 (en) Lead frame and semiconductor device storage package using the same
JPH0713181A (en) Connecting structure between outer lead of film carrier and printed circuit board terminal
JPH0651331A (en) Lcd module
JPH02250388A (en) Hybrid integrated circuit
JPS63250163A (en) Semiconductor integrated circuit device
US6002164A (en) Semiconductor lead frame
JPH06260538A (en) Semiconductor device
JP3925280B2 (en) Manufacturing method of semiconductor device
JPH1134560A (en) Non-contact ic card
JPH06132448A (en) External terminal of semiconductor device
JPS62213270A (en) Lead frame for semiconductor device
JPH053275A (en) Lead frame of semiconductor device
JPH03196555A (en) Semiconductor package
JPH04162466A (en) Lead frame for semiconductor device
JPS6292354A (en) Hybrid ic
JPH1022439A (en) Wiring circuit board
JPH01154543A (en) Semiconductor package
JPH0669274A (en) Tool center pointer
JPH0487389A (en) Printed board for power circuit wiring