JPS62199949U - - Google Patents
Info
- Publication number
- JPS62199949U JPS62199949U JP1986088734U JP8873486U JPS62199949U JP S62199949 U JPS62199949 U JP S62199949U JP 1986088734 U JP1986088734 U JP 1986088734U JP 8873486 U JP8873486 U JP 8873486U JP S62199949 U JPS62199949 U JP S62199949U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- semiconductor chip
- thermocompression bonding
- metal electrode
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/073—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986088734U JPS62199949U (enExample) | 1986-06-11 | 1986-06-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986088734U JPS62199949U (enExample) | 1986-06-11 | 1986-06-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62199949U true JPS62199949U (enExample) | 1987-12-19 |
Family
ID=30947092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986088734U Pending JPS62199949U (enExample) | 1986-06-11 | 1986-06-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62199949U (enExample) |
-
1986
- 1986-06-11 JP JP1986088734U patent/JPS62199949U/ja active Pending