JPS62199791A - Cobalt and cobalt alloy plating solutions - Google Patents
Cobalt and cobalt alloy plating solutionsInfo
- Publication number
- JPS62199791A JPS62199791A JP4103186A JP4103186A JPS62199791A JP S62199791 A JPS62199791 A JP S62199791A JP 4103186 A JP4103186 A JP 4103186A JP 4103186 A JP4103186 A JP 4103186A JP S62199791 A JPS62199791 A JP S62199791A
- Authority
- JP
- Japan
- Prior art keywords
- cobalt
- chloride
- plating
- stainless steel
- hydrochloric acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 36
- 229910000531 Co alloy Inorganic materials 0.000 title claims abstract description 11
- 239000010941 cobalt Substances 0.000 title claims description 9
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 title claims description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims abstract description 20
- GVPFVAHMJGGAJG-UHFFFAOYSA-L cobalt dichloride Chemical compound [Cl-].[Cl-].[Co+2] GVPFVAHMJGGAJG-UHFFFAOYSA-L 0.000 claims abstract description 11
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims abstract description 4
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 claims abstract description 4
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims abstract description 4
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229910021626 Tin(II) chloride Inorganic materials 0.000 claims abstract description 3
- 239000001119 stannous chloride Substances 0.000 claims abstract description 3
- 235000011150 stannous chloride Nutrition 0.000 claims abstract description 3
- 229910017052 cobalt Inorganic materials 0.000 claims description 8
- 239000010935 stainless steel Substances 0.000 abstract description 14
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 11
- 239000007769 metal material Substances 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 9
- 229910052759 nickel Inorganic materials 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- -1 chlorine ions Chemical class 0.000 description 1
- 229910001429 cobalt ion Inorganic materials 0.000 description 1
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は金属材料、特にステンレス材上にめっきするコ
バルトおよびコバルト合金めっき液に関するものである
。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a cobalt and cobalt alloy plating solution for plating onto metal materials, particularly stainless steel materials.
（従来の技術とその問題点）
電気部品あるいは電子部品材料の素材として、鉄系材料
、銅系材料等が使用されて来たが、材料の経済性、強度
的な問題等からステンレス材が望ましい場合が多く、ス
テンレス材への切替が行われたり或いは検討されている
。例えば、リードフレーム素材としては鉄−ニッケル合
金材、鉄−ニッケルーコバルト合金材、鋼材または銅合
金材が使用されており、樹脂封止型半導体装置において
は、樹脂封止後プリント基板等とのはんだ付は性を確保
する目的でリードフレームの外部リード部に、錫めっき
、はんだめっきなどが施されて製品化される。このリー
ドフレームの素材としてステンレス材は他の材料と比較
して優れた点を持つものであるが、これらのめっきが良
好に行かなかった。(Conventional technology and its problems) Iron-based materials, copper-based materials, etc. have been used as materials for electrical and electronic components, but stainless steel is preferable due to material economy and strength issues. In many cases, a switch to stainless steel is being made or is being considered. For example, iron-nickel alloy, iron-nickel-cobalt alloy, steel, or copper alloy are used as lead frame materials, and in resin-sealed semiconductor devices, after resin-sealing, it is difficult to connect the printed circuit board, etc. In order to ensure soldering properties, the external leads of the lead frame are coated with tin plating, solder plating, etc. Stainless steel has advantages over other materials as a material for this lead frame, but the plating of these materials did not go well.
上記の理由からステンレス材上へのめっきは、めっき可
能なウッド浴によるニッケルめっきが一般的である。For the above reasons, nickel plating is generally performed on stainless steel using a wood bath capable of plating.
しかし乍ら、このめっき液によるニッケルめっきの問題
点は、（１）はんだ付は性が劣るため強いフラックスを
使用したり、更にはその上に錫などのめっきが必要であ
る。（２）ステンレス材成分の拡散バリヤーの役割が劣
るため、１μｍ程度のめっきの厚付けが必要である。（
３）上に金、銀をめっきした場合、ニッケルが金、銀山
に拡散しやすい等の問題がある。However, the problems with nickel plating using this plating solution are: (1) Since the soldering properties are poor, it is necessary to use a strong flux, and furthermore, it is necessary to plate with tin or the like on top of it. (2) Since the diffusion barrier role of stainless steel components is poor, it is necessary to thicken the plating to about 1 μm. (
3) When gold or silver is plated on top, there are problems such as nickel easily diffusing into the gold or silver pile.
（問題点を解決するための手段）
上記の各種の問題点を解決すべく鋭意検討し、はんだ付
は性が良く、下地の拡散バリヤーに優れ、貴金属中に拡
散しにくい金属をステンレス材上に直接めっき可能なめ
っき液を見出した。(Means for solving the problems) In order to solve the various problems mentioned above, we have made a thorough study to solve the above problems. We have discovered a plating solution that allows direct plating.
即ち、本発明は（１１塩酸および塩化コバルトより成る
ことを特徴とするコバルトめっき液。（２）塩酸、塩化
コバルトおよび第三成分として塩化ニッケル、又は塩化
鉄、又は塩化第一錫より成ることを特徴こするコバルト
合金めっき液に関するものである。That is, the present invention provides (11) a cobalt plating solution characterized by comprising hydrochloric acid and cobalt chloride; (2) comprising hydrochloric acid, cobalt chloride and nickel chloride, iron chloride, or stannous chloride as a third component Features This product relates to a rubbing cobalt alloy plating solution.
更に詳しくは、該めっき液はコバルトイオンおよび合金
めっき皮膜形成の場合は更にニッケル、鉄、錫の陽イオ
ンおよび塩素イオンから成立っている。本発明のコバル
トめっき液の好ましい塩化コバルトの組成は２５０〜３
５０ｇ／ｇである。また好ましい電流密度は５〜ＩＯＡ
／ｄｍ２である。また、コバルト合金めっき液において
は、コバルトめっき液に塩化ニッケル、塩化鉄、塩化錫
の第三成分の必要な塩を１〜３ ｇ／ ７！加えて行っ
た。この時の好ましい電流密度は５〜６ Ａ／ｄｍ２で
ある。More specifically, the plating solution is composed of cobalt ions and, in the case of forming an alloy plating film, further cations of nickel, iron, tin, and chlorine ions. The preferred cobalt chloride composition of the cobalt plating solution of the present invention is 250-3
It is 50g/g. The preferred current density is 5 to IOA.
/dm2. In addition, in a cobalt alloy plating solution, 1 to 3 g/7. I added it. The preferred current density at this time is 5 to 6 A/dm2.
以下に実施例を挙げて説明する。Examples will be described below.
〔実施例１〕
塩化コバルト ３００ｇ／Ａ
塩酸 １２０ ｇ／β
上記のめっき液を用い、電流密度７Ａ／ｄｍ２（電圧６
Ｖ）でステンレス上に３０秒間めっきした。得られたコ
バルトめっき皮膜は０．１μｍであった。この皮膜は弱
いフラックスを使用しても十分なはんだ付は性が得られ
た。[Example 1] Cobalt chloride 300 g/A Hydrochloric acid 120 g/β Using the above plating solution, current density 7 A/dm2 (voltage 6
V) was plated on stainless steel for 30 seconds. The cobalt plating film obtained was 0.1 μm. This film had sufficient solderability even when weak flux was used.
〔実施例２〕
塩化コバルト ２００ｇ／Ｊ
塩化鉄 １００ｇ＃！
塩酸 １２０ ｇ／β
上記のめっき液を用い、電流密度７Ａ／ｄｍ２（電圧６
Ｖ）でステンレス上に３０秒間めっきした。この合金皮
膜は弱いフラックスを使用しても十分なはんだ付は性が
得られた。[Example 2] Cobalt chloride 200g/J Iron chloride 100g#! Hydrochloric acid 120 g/β Using the above plating solution, current density 7 A/dm2 (voltage 6
V) was plated on stainless steel for 30 seconds. This alloy film had sufficient solderability even when weak flux was used.
〔実施例３〕
塩化コバルト ２００ｇ＃！
塩化ニッケル １００ｇ／ｊ２
塩酸 １２０ ｇ／β
上記のめっき液を用い、電流密度７Ａ／ｄｍ２（電圧６
Ｖ）でステンレス上に３０秒間めっきした。[Example 3] Cobalt chloride 200g#! Nickel chloride 100g/j2 Hydrochloric acid 120g/β Using the above plating solution, current density 7A/dm2 (voltage 6
V) was plated on stainless steel for 30 seconds.
〔実施例４〕
塩化コバルト ２００ｇ＃！
塩化第−Ｓ′ＩＪ５ ｇ／β
塩酸 １２０ｇ／ｊ２
上記のめっき液を用い、電流密度５Ａ／ｄｍ２（電圧６
Ｖ）でステンレス上に３０秒間、めっきした。[Example 4] Cobalt chloride 200g#! Chloride S'IJ5 g/β Hydrochloric acid 120 g/j2 Using the above plating solution, current density 5 A/dm2 (voltage 6
V) on stainless steel for 30 seconds.
（発明の効果）
以上のように本発明に係るコバルトおよびコバルト合金
めっき液によれば、電解によってステンレス上に直接コ
バルト、およびコバルト合金がめつきできた。この結果
、ステンレス上にニッケルストライクを施さずにコバル
トめっきを施すことができて、工程の簡略化が可能とな
り経済的な効果は著しいものがある。また下地の拡散バ
リヤーとして機能するため、下地の金属の表面への拡散
が少なく、めっき皮膜自身も貴金属中に拡散しにくいこ
と、更に弱いフラックスを使用して十分なはんだ付は性
が得られるため電子部品、ＩＣパッケージ用リードフレ
ーム、コネクター等のめっきに利用できる効果がある。(Effects of the Invention) As described above, according to the cobalt and cobalt alloy plating solution according to the present invention, cobalt and cobalt alloy could be directly plated on stainless steel by electrolysis. As a result, cobalt plating can be applied to stainless steel without nickel strike, which simplifies the process and has a significant economical effect. In addition, since it functions as a diffusion barrier for the underlying metal, there is less diffusion to the surface of the underlying metal, and the plating film itself is difficult to diffuse into the precious metal. Furthermore, sufficient solderability can be obtained by using a weak flux. It is effective in plating electronic components, lead frames for IC packages, connectors, etc.
以上本発明につき実施例を挙げて説明したが、この実施
例に限定されるものではなく、本発明の精神を逸脱しな
い範囲内で多くの改変を施し得るのはもちろんのことで
ある。Although the present invention has been described above with reference to embodiments, it is not limited to these embodiments, and it goes without saying that many modifications can be made without departing from the spirit of the present invention.
Claims (1)
コバルトめっき液。 ２、塩酸、塩化コバルトおよび第三成分として塩化ニッ
ケル、又は塩化鉄、又は塩化第一錫より成ることを特徴
とするコバルト合金めっき液。[Claims] 1. A cobalt plating solution comprising hydrochloric acid and cobalt chloride. 2. A cobalt alloy plating solution comprising hydrochloric acid, cobalt chloride, and a third component of nickel chloride, iron chloride, or stannous chloride.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4103186A JPS62199791A (en) | 1986-02-26 | 1986-02-26 | Cobalt and cobalt alloy plating solutions |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4103186A JPS62199791A (en) | 1986-02-26 | 1986-02-26 | Cobalt and cobalt alloy plating solutions |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62199791A true JPS62199791A (en) | 1987-09-03 |
Family
ID=12597026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4103186A Pending JPS62199791A (en) | 1986-02-26 | 1986-02-26 | Cobalt and cobalt alloy plating solutions |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62199791A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62228497A (en) * | 1986-02-27 | 1987-10-07 | Nippon Mining Co Ltd | Cobalt-nickel alloy striking solution |
| KR100793840B1 (en) | 2007-01-10 | 2008-01-10 | 김기형 | Cobalt electro plating solution and products coated thereby |
| KR100854505B1 (en) | 2007-02-23 | 2008-08-26 | (주)해빛정보 | Plating layer using w-co and sn-co and method for plating the same |
| JP2009139755A (en) * | 2007-12-07 | 2009-06-25 | Irgb Co Ltd | Multi-view/multi-angle image reconstruction device |
| US20130302606A1 (en) * | 2011-01-18 | 2013-11-14 | Bridgestone Corporation | Steel cord-rubber composite |
| JP2016135927A (en) * | 2015-01-09 | 2016-07-28 | Ｊｘ金属株式会社 | Metal base material with plating material |
| JP2016138337A (en) * | 2015-01-09 | 2016-08-04 | Ｊｘ金属株式会社 | Metal base with plating |
| JP2022182186A (en) * | 2021-05-27 | 2022-12-08 | 石原ケミカル株式会社 | Structure including under-barrier metal and solder layer |
-
1986
- 1986-02-26 JP JP4103186A patent/JPS62199791A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62228497A (en) * | 1986-02-27 | 1987-10-07 | Nippon Mining Co Ltd | Cobalt-nickel alloy striking solution |
| JPH0356319B2 (en) * | 1986-02-27 | 1991-08-27 | ||
| KR100793840B1 (en) | 2007-01-10 | 2008-01-10 | 김기형 | Cobalt electro plating solution and products coated thereby |
| KR100854505B1 (en) | 2007-02-23 | 2008-08-26 | (주)해빛정보 | Plating layer using w-co and sn-co and method for plating the same |
| JP2009139755A (en) * | 2007-12-07 | 2009-06-25 | Irgb Co Ltd | Multi-view/multi-angle image reconstruction device |
| US20130302606A1 (en) * | 2011-01-18 | 2013-11-14 | Bridgestone Corporation | Steel cord-rubber composite |
| JP2016135927A (en) * | 2015-01-09 | 2016-07-28 | Ｊｘ金属株式会社 | Metal base material with plating material |
| JP2016138337A (en) * | 2015-01-09 | 2016-08-04 | Ｊｘ金属株式会社 | Metal base with plating |
| JP2022182186A (en) * | 2021-05-27 | 2022-12-08 | 石原ケミカル株式会社 | Structure including under-barrier metal and solder layer |
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