CN111118559B - Composition for surface treatment of copper flexible connection - Google Patents
Composition for surface treatment of copper flexible connection Download PDFInfo
- Publication number
- CN111118559B CN111118559B CN201911323779.XA CN201911323779A CN111118559B CN 111118559 B CN111118559 B CN 111118559B CN 201911323779 A CN201911323779 A CN 201911323779A CN 111118559 B CN111118559 B CN 111118559B
- Authority
- CN
- China
- Prior art keywords
- composition
- copper flexible
- flexible connection
- acid
- amino
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
Abstract
The invention relates to the technical field of surface treatment, in particular to a composition for carrying out surface treatment on copper flexible connection. Each 1L of the composition contains: 22-30g of silver nitrate, 12-20g of potassium citrate, 12-20g of organic acid, 12-20g of alkali metal salt, 35-45g of succinimide and 15-25g of additive. The composition for surface treatment of copper flexible connection is prepared by adopting silver nitrate, potassium citrate, organic acid, alkali metal salt, succinimide and additive, and is non-toxic, stable and good in performance; the potassium citrate, the organic acid, the alkali metal salt, the additive and the like have good synergistic effect, the prepared composition has good effect and high surface glossiness after the surface treatment is carried out on the copper flexible connection, and the phenomena of color change, yellowing, darkening and the like can not occur on the surface of the copper flexible connection after the composition is placed for a period of time. In addition, the copper flexible connection is repeatedly bent, and the surface of the copper flexible connection does not fall off or peel.
Description
Technical Field
The invention relates to the technical field of surface treatment, in particular to a composition for carrying out surface treatment on copper flexible connection.
Background
The surface treatment is a process method for artificially forming a surface layer with mechanical, physical and chemical properties different from those of a substrate on the surface of a substrate material. Surface treatment techniques can be classified into electrochemical methods, chemical methods, thermal processing methods, vacuum methods, and the like, depending on the method used. Wherein the electrochemical process comprises an electroplating process. Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis, thereby having the effects of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), enhancing the appearance and the like.
Pure silver is silvery white, has a face-centered cubic lattice, and is a malleable noble metal. Silver is second only to gold in ductility, being the second in all metals. Silver has good electrical and thermal conductivity, and of all metals, silver has the best conductivity. In addition, silver has many excellent physical properties, such as high light reflectivity, and excellent solderability. In the prior art, silver cyanide complex salt and free cyanide are generally adopted to prepare silver plating solution, which is stable and reliable, has high current efficiency, good dispersing capacity and covering capacity, and fine and lustrous plating layer crystals. However, the cyanide silver plating solution is extremely toxic, so that the cyanide silver plating solution has the defects of environmental pollution, harm to the health of a producer, higher waste liquid treatment cost and the like.
In view of the above problems, the present invention has been made in an effort to provide a composition for surface treatment of copper flexible joints, which is non-toxic, stable and excellent in performance. The composition has good surface treatment effect on the copper flexible connection, has high surface glossiness, does not have the phenomena of color change, yellowing, darkening and the like on the surface of the copper flexible connection after being placed for a period of time, and does not have the phenomena of falling off, peeling and the like on the surface after being repeatedly bent.
Disclosure of Invention
In order to solve the above problems, a first aspect of the present invention provides a composition for surface treatment of copper flexible joints, comprising, per 1L of the composition:
22-30g of silver nitrate;
12-20g of potassium citrate;
12-20g of organic acid;
12-20g of alkali metal salt;
35-45g of succinimide;
15-25g of additive.
As a preferred technical scheme, each 1L of the composition contains:
25-28g of silver nitrate;
15-18g of potassium citrate;
16-19g of organic acid;
16-19g of alkali metal salt;
40-42g of succinimide;
18-22g of additive.
As a preferred technical scheme, each 1L of the composition contains:
27g of silver nitrate;
16g of potassium citrate;
18g of organic acid;
18g of an alkali metal salt;
41g of succinimide;
20g of additive.
As a preferable technical scheme, the organic acid is selected from at least one of benzoic acid, citric acid, ethylsulfonic acid, 2-amino-4-methyl-6-nitrobenzoic acid and 3-nitrophthalic acid.
As a preferable technical scheme, in the organic acid, the weight ratio of citric acid, ethylsulfonic acid and 2-amino-4-methyl-6-nitrobenzoic acid is (1-1.3): 1: (1.2-1.5).
As a preferable technical scheme, in the organic acid, the weight ratio of citric acid, ethylsulfonic acid and 2-amino-4-methyl-6-nitrobenzoic acid is 1.2: 1: 1.4.
as a preferred embodiment, the additive is at least one selected from the group consisting of N- (((1-methyl-1- (hydroxymethyl) ethyl) amino) thiocarbonyl) benzamide, bis ((4- (2-hydroxyethyl) -1-piperazinyl) thiocarbonyl) disulfide, (S) -1-N-t-butoxycarbonyl-3-hydroxypyrrolidine, N-Boc-4-hydroxypiperidine, 1-t-butoxycarbonyl-4-hydroxypiperidine, and 2-butyne-1, 4-diol.
As a preferable technical scheme, in the additive, the weight ratio of N- (((1-methyl-1- (hydroxymethyl) ethyl) amino) thiocarbonyl) benzamide to 2-butyne-1, 4 diol is 1: (2.2-2.4).
As a preferable technical scheme, in the additive, the weight ratio of N- (((1-methyl-1- (hydroxymethyl) ethyl) amino) thiocarbonyl) benzamide to 2-butyne-1, 4 diol is 1: 2.3.
as a preferable technical scheme, the weight ratio of the potassium citrate, the organic acid and the alkali metal salt is 1: (1.1-1.15): (1.1-1.15).
Has the advantages that: the composition for surface treatment of copper flexible connection is prepared by adopting silver nitrate, potassium citrate, organic acid, alkali metal salt, succinimide and additive, and is non-toxic, stable and good in performance. The potassium citrate, the organic acid, the alkali metal salt, the additive and the like have good synergistic effect, the prepared composition has good effect and high surface glossiness after the surface treatment is carried out on the copper flexible connection, and the phenomena of color change, yellowing, darkening and the like can not occur on the surface of the copper flexible connection after the composition is placed for a period of time. In addition, the copper flexible connection is repeatedly bent, and the surface of the copper flexible connection does not fall off or peel.
Detailed Description
The technical features in the technical solutions provided by the present invention are further clearly and completely described below with reference to the specific embodiments, but the scope of protection of the present invention is not limited thereto.
"preferred", "more preferred", and the like, in the present invention, refer to embodiments of the invention that may provide certain benefits, under certain circumstances. However, other embodiments may be preferred, under the same or other circumstances. Furthermore, the recitation of one or more preferred embodiments does not imply that other embodiments are not useful, nor is it intended to exclude other embodiments from the scope of the invention.
The first aspect of the present invention provides a composition for surface treatment of copper flexible joints, comprising, per 1L of the composition:
22-30g of silver nitrate;
12-20g of potassium citrate;
12-20g of organic acid;
12-20g of alkali metal salt;
35-45g of succinimide;
15-25g of additive.
In a preferred embodiment, per 1L of the composition, comprises:
25-28g of silver nitrate;
15-18g of potassium citrate;
16-19g of organic acid;
16-19g of alkali metal salt;
40-42g of succinimide;
18-22g of additive.
In a more preferred embodiment, per 1L of the composition, there is present:
27g of silver nitrate;
16g of potassium citrate;
18g of organic acid;
18g of an alkali metal salt;
41g of succinimide;
20g of additive.
The preparation method of the composition for carrying out surface treatment on the copper flexible connection comprises the following steps: the components are weighed according to the content, and water is added to prepare 1L for standby.
In a preferred embodiment, the organic acid is selected from at least one of benzoic acid, citric acid, ethyl sulfonic acid, 2-amino-4-methyl-6-nitrobenzoic acid, 3-nitrophthalic acid.
In a more preferred embodiment, the organic acid is citric acid, ethyl sulfonic acid, 2-amino-4-methyl-6-nitrobenzoic acid.
In a preferred embodiment, the weight ratio of citric acid, ethylsulfonic acid, 2-amino-4-methyl-6-nitrobenzoic acid is (1-1.3): 1: (1.2-1.5).
In a more preferred embodiment, the weight ratio of citric acid, ethyl sulfonic acid, 2-amino-4-methyl-6-nitrobenzoic acid is 1.2: 1: 1.4.
the CAS number of the 2-amino-4-methyl-6-nitrobenzoic acid is 100093-07-0.
In a preferred embodiment, the alkali metal salt is potassium hydroxide and/or sodium hydroxide.
In a more preferred embodiment, the alkali metal salt is potassium hydroxide.
In a preferred embodiment, the weight ratio of potassium citrate, organic acid and alkali metal salt is 1: (1.1-1.15): (1.1-1.15).
In a more preferred embodiment, the weight ratio of potassium citrate, organic acid and alkali metal salt is 1: 1.125: 1.125.
the pH environment in the system has great influence on the surface treatment effect of the copper flexible connection. Through a large number of experiments, the applicant finds that when the weight ratio of potassium citrate, organic acid and alkali metal salt is strictly controlled to be 1: (1.1-1.15): (1.1-1.15) and simultaneously cooperates with a specific additive in the system, so that a better surface treatment effect can be ensured, and the surface of the copper flexible connection is silvery white. This is probably because the mutual synergy among potassium citrate, organic acid, alkali metal salt and additive can reduce the instability of the composition to some extent and increase the cathode polarization.
In a preferred embodiment, the additive is selected from at least one of N- (((1-methyl-1- (hydroxymethyl) ethyl) amino) thiocarbonyl) benzamide, bis ((4- (2-hydroxyethyl) -1-piperazinyl) thiocarbonyl) disulfide, (S) -1-N-tert-butoxycarbonyl-3-hydroxypyrrolidine, N-Boc-4-hydroxypiperidine, 1-tert-butoxycarbonyl-4-hydroxypiperidine, 2-butyne-1, 4-diol.
In a more preferred embodiment, the additive is N- (((1-methyl-1- (hydroxymethyl) ethyl) amino) thiocarbonyl) benzamide, 2-butyne-1, 4 diol.
In a preferred embodiment, the weight ratio of N- (((1-methyl-1- (hydroxymethyl) ethyl) amino) thiocarbonyl) benzamide to 2-butyne-1, 4 diol is 1: (2.2-2.4).
In a more preferred embodiment, the weight ratio of N- (((1-methyl-1- (hydroxymethyl) ethyl) amino) thiocarbonyl) benzamide to 2-butyne-1, 4 diol is 1: 2.3.
the CAS number of the N- (((1-methyl-1- (hydroxymethyl) ethyl) amino) thiocarbonyl) benzamide is 1007232-81-6.
The applicant has found that with the composition according to the invention, particularly for copper soft joints, a good surface treatment is ensured even at higher treatment temperatures. The reason is probably that the N- (((1-methyl-1- (hydroxymethyl) ethyl) amino) thiocarbonyl) benzamide contains active groups such as carbonyl and the like, and can be strongly adsorbed on the surface of a cathode, so that the potential of the cathode is obviously shifted negatively, the plating layer is crystallized finely and is not easy to peel or fall off; meanwhile, 2-butyne-1, 4 diol and the like in a synergistic system can effectively adjust the diffusion rate of ions in the composition, thereby improving the surface treatment effect of copper flexible connection.
The composition prepared by the invention is used for surface treatment of copper flexible connection, the treatment temperature is 60-70 ℃, and the treatment time is 20-30 min.
Hereinafter, the present invention will be described in more detail by way of examples, but it should be understood that these examples are merely illustrative and not restrictive. In addition, all the raw materials are commercially available if not particularly limited.
Examples
Example 1
Example 1 of the present invention provides a composition for surface treatment of copper flexible joints, comprising, per 1L of the composition:
27g of silver nitrate;
16g of potassium citrate;
18g of organic acid;
18g of an alkali metal salt;
41g of succinimide;
20g of additive.
The organic acid is citric acid, ethylsulfonic acid, 2-amino-4-methyl-6-nitrobenzoic acid.
The weight ratio of the citric acid to the ethyl sulfonic acid to the 2-amino-4-methyl-6-nitrobenzoic acid is 1.2: 1: 1.4.
the alkali metal salt is potassium hydroxide.
The additive is N- (((1-methyl-1- (hydroxymethyl) ethyl) amino) thiocarbonyl) benzamide and 2-butyne-1, 4 diol.
The weight ratio of the N- (((1-methyl-1- (hydroxymethyl) ethyl) amino) thiocarbonyl) benzamide to the 2-butyne-1, 4 diol is 1: 2.3.
the preparation method of the composition for carrying out surface treatment on the copper flexible connection comprises the following steps: the components are weighed according to the content, and water is added to prepare 1L for standby.
Example 2
Example 2 of the present invention provides a composition for surface treatment of copper flexible joints, comprising, per 1L of the composition:
22g of silver nitrate;
20g of potassium citrate;
12g of organic acid;
12g of an alkali metal salt;
35g of succinimide;
25g of additive.
The organic acid is citric acid, ethylsulfonic acid, 2-amino-4-methyl-6-nitrobenzoic acid.
The weight ratio of the citric acid to the ethyl sulfonic acid to the 2-amino-4-methyl-6-nitrobenzoic acid is 1.2: 1: 1.4.
the alkali metal salt is potassium hydroxide.
The additive is N- (((1-methyl-1- (hydroxymethyl) ethyl) amino) thiocarbonyl) benzamide and 2-butyne-1, 4 diol.
The weight ratio of the N- (((1-methyl-1- (hydroxymethyl) ethyl) amino) thiocarbonyl) benzamide to the 2-butyne-1, 4 diol is 1: 2.3.
the preparation method of the composition for carrying out surface treatment on the copper flexible connection comprises the following steps: the components are weighed according to the content, and water is added to prepare 1L for standby.
Example 3
Example 3 of the present invention provides a composition for surface treatment of copper flexible joints, comprising, per 1L of the composition:
25g of silver nitrate;
15g of potassium citrate;
17g of organic acid;
17g of an alkali metal salt;
40g of succinimide;
and 18g of additive.
The organic acid is citric acid, ethylsulfonic acid, 2-amino-4-methyl-6-nitrobenzoic acid.
The weight ratio of the citric acid to the ethyl sulfonic acid to the 2-amino-4-methyl-6-nitrobenzoic acid is 1: 1: 1.2.
the alkali metal salt is potassium hydroxide.
The additive is N- (((1-methyl-1- (hydroxymethyl) ethyl) amino) thiocarbonyl) benzamide and 2-butyne-1, 4 diol.
The weight ratio of the N- (((1-methyl-1- (hydroxymethyl) ethyl) amino) thiocarbonyl) benzamide to the 2-butyne-1, 4 diol is 1: 2.2.
the preparation method of the composition for carrying out surface treatment on the copper flexible connection comprises the following steps: the components are weighed according to the content, and water is added to prepare 1L for standby.
Example 4
Example 4 of the present invention provides a composition for surface treatment of copper flexible joints, comprising, per 1L of the composition:
28g of silver nitrate;
17g of potassium citrate;
19g of organic acid;
19g of an alkali metal salt;
42g of succinimide;
22g of additive.
The organic acid is citric acid, ethylsulfonic acid, 2-amino-4-methyl-6-nitrobenzoic acid.
The weight ratio of the citric acid to the ethyl sulfonic acid to the 2-amino-4-methyl-6-nitrobenzoic acid is 1.3: 1: 1.5.
the alkali metal salt is potassium hydroxide.
The additive is N- (((1-methyl-1- (hydroxymethyl) ethyl) amino) thiocarbonyl) benzamide and 2-butyne-1, 4 diol.
The weight ratio of the N- (((1-methyl-1- (hydroxymethyl) ethyl) amino) thiocarbonyl) benzamide to the 2-butyne-1, 4 diol is 1: 2.4.
the preparation method of the composition for carrying out surface treatment on the copper flexible connection comprises the following steps: the components are weighed according to the content, and water is added to prepare 1L for standby.
Example 5
Example 5 of the present invention provides a composition for surface treatment of copper flexible joints, comprising, per 1L of the composition:
27g of silver nitrate;
16g of potassium citrate;
18g of organic acid;
18g of an alkali metal salt;
41g of succinimide;
20g of additive.
The organic acid is citric acid, ethylsulfonic acid, 2-amino-4-methyl-6-nitrobenzoic acid.
The weight ratio of the citric acid to the ethyl sulfonic acid to the 2-amino-4-methyl-6-nitrobenzoic acid is 1.2: 1: 1.4.
the alkali metal salt is potassium hydroxide.
The additive is 2-butyne-1, 4 diol.
The preparation method of the composition for carrying out surface treatment on the copper flexible connection comprises the following steps: the components are weighed according to the content, and water is added to prepare 1L for standby.
Example 6
Example 6 of the present invention provides a composition for surface treatment of copper flexible joints, comprising, per 1L of the composition:
27g of silver nitrate;
16g of potassium citrate;
18g of organic acid;
18g of an alkali metal salt;
41g of succinimide;
20g of additive.
The organic acid is citric acid, ethylsulfonic acid, 2-amino-4-methyl-6-nitrobenzoic acid.
The weight ratio of the citric acid to the ethyl sulfonic acid to the 2-amino-4-methyl-6-nitrobenzoic acid is 1.2: 1: 1.4.
the alkali metal salt is potassium hydroxide.
The additive is N- (((1-methyl-1- (hydroxymethyl) ethyl) amino) thiocarbonyl) benzamide.
The preparation method of the composition for carrying out surface treatment on the copper flexible connection comprises the following steps: the components are weighed according to the content, and water is added to prepare 1L for standby.
Example 7
Example 7 of the present invention provides a composition for surface treatment of copper flexible joints, comprising, per 1L of the composition:
27g of silver nitrate;
16g of potassium citrate;
18g of organic acid;
18g of an alkali metal salt;
41g of succinimide.
The organic acid is citric acid, ethylsulfonic acid, 2-amino-4-methyl-6-nitrobenzoic acid.
The weight ratio of the citric acid to the ethyl sulfonic acid to the 2-amino-4-methyl-6-nitrobenzoic acid is 1.2: 1: 1.4.
the alkali metal salt is potassium hydroxide.
The preparation method of the composition for carrying out surface treatment on the copper flexible connection comprises the following steps: the components are weighed according to the content, and water is added to prepare 1L for standby.
Example 8
Example 8 of the present invention provides a composition for surface treatment of copper flexible joints, comprising, per 1L of the composition:
27g of silver nitrate;
15g of potassium citrate;
18g of organic acid;
18g of an alkali metal salt;
41g of succinimide;
20g of additive.
The organic acid is citric acid, ethylsulfonic acid, 2-amino-4-methyl-6-nitrobenzoic acid.
The weight ratio of the citric acid to the ethyl sulfonic acid to the 2-amino-4-methyl-6-nitrobenzoic acid is 1.2: 1: 1.4.
the alkali metal salt is potassium hydroxide.
The additive is N- (((1-methyl-1- (hydroxymethyl) ethyl) amino) thiocarbonyl) benzamide and 2-butyne-1, 4 diol.
The weight ratio of the N- (((1-methyl-1- (hydroxymethyl) ethyl) amino) thiocarbonyl) benzamide to the 2-butyne-1, 4 diol is 1: 2.3.
the preparation method of the composition for carrying out surface treatment on the copper flexible connection comprises the following steps: the components are weighed according to the content, and water is added to prepare 1L for standby.
Example 9
Example 9 of the present invention provides a composition for surface treatment of copper flexible joints, comprising, per 1L of the composition:
27g of silver nitrate;
18g of potassium citrate;
18g of organic acid;
18g of an alkali metal salt;
41g of succinimide;
20g of additive.
The organic acid is citric acid, ethylsulfonic acid, 2-amino-4-methyl-6-nitrobenzoic acid.
The weight ratio of the citric acid to the ethyl sulfonic acid to the 2-amino-4-methyl-6-nitrobenzoic acid is 1.2: 1: 1.4.
the alkali metal salt is potassium hydroxide.
The additive is N- (((1-methyl-1- (hydroxymethyl) ethyl) amino) thiocarbonyl) benzamide and 2-butyne-1, 4 diol.
The weight ratio of the N- (((1-methyl-1- (hydroxymethyl) ethyl) amino) thiocarbonyl) benzamide to the 2-butyne-1, 4 diol is 1: 2.3.
the preparation method of the composition for carrying out surface treatment on the copper flexible connection comprises the following steps: the components are weighed according to the content, and water is added to prepare 1L for standby.
Example 10
Example 10 of the present invention provides a composition for surface treatment of copper flexible joints, comprising, per 1L of the composition:
30g of silver nitrate;
14g of potassium citrate;
16g of organic acid;
16g of an alkali metal salt;
45g of succinimide;
15g of additive.
The organic acid is citric acid, ethylsulfonic acid, 2-amino-4-methyl-6-nitrobenzoic acid.
The weight ratio of the citric acid to the ethyl sulfonic acid to the 2-amino-4-methyl-6-nitrobenzoic acid is 1.2: 1: 1.4.
the alkali metal salt is potassium hydroxide.
The additive is N- (((1-methyl-1- (hydroxymethyl) ethyl) amino) thiocarbonyl) benzamide and 2-butyne-1, 4 diol.
The weight ratio of the N- (((1-methyl-1- (hydroxymethyl) ethyl) amino) thiocarbonyl) benzamide to the 2-butyne-1, 4 diol is 1: 2.3.
the preparation method of the composition for carrying out surface treatment on the copper flexible connection comprises the following steps: the components are weighed according to the content, and water is added to prepare 1L for standby.
Performance evaluation
Example 1: the copper soft joint was surface-treated with the composition described in example 1, using a silver plate as the anode and a copper soft joint as the cathode, with a distance of 10cm between the cathode and the anode and a current density of 1A/dm2The treatment temperature is 70 ℃, the treatment time is 25min, and the treated copper flexible connection surface is compact and uniform, is silvery white and has good glossiness; the copper flexible connection is repeatedly bent for 180 degrees until the copper flexible connection is broken, and the surface of the copper flexible connection does not peel and fall off; the treated copper flexible joint is placed at normal temperature for 3 months, and the surface of the copper flexible joint is unchanged.
Example 2: the copper soft joint was surface-treated with the composition described in example 2, using a silver plate as the anode and a copper soft joint as the cathode, with a distance of 10cm between the cathode and the anode and a current density of 1A/dm2The treatment temperature is 70 ℃, the treatment time is 25min, and the treated copper flexible connection surface is rough and has poor glossiness; repeatedly bending the copper flexible connection for 180 degrees until the copper flexible connection is broken, and peeling and falling off the surface of the copper flexible connection; the treated copper flexible joint was left at room temperature for 3 months, and its surface was darkened.
Example 3: the copper soft joint was surface-treated with the composition described in example 3, using a silver plate as anode and a copper soft joint as cathode, with a distance of 10cm between the cathode and the anode and a current density of 1A/dm2The treatment temperature is 70 ℃, the treatment time is 25min, and the treated copper flexible connection surface is compact and uniform, is silvery white and has good glossiness; the copper flexible connection is repeatedly bent for 180 degrees until the copper flexible connection is broken, and the surface of the copper flexible connection does not peel and fall off; the treated copper flexible joint is placed at normal temperature for 3 months, and the surface of the copper flexible joint is unchanged.
Example 4: the copper soft joint was surface treated with the composition described in example 4, using a silver plate as the anode, a copper soft joint as the cathode, and a cathode and an anodeThe distance between the poles was 10cm and the current density was 1A/dm2The treatment temperature is 70 ℃, the treatment time is 25min, and the treated copper flexible connection surface is compact and uniform, is silvery white and has good glossiness; the copper flexible connection is repeatedly bent for 180 degrees until the copper flexible connection is broken, and the surface of the copper flexible connection does not peel and fall off; the treated copper flexible joint is placed at normal temperature for 3 months, and the surface of the copper flexible joint is unchanged.
Example 5: the copper soft joint was surface-treated with the composition described in example 5, using a silver plate as anode and a copper soft joint as cathode, with a distance of 10cm between the cathode and the anode and a current density of 1A/dm2The treatment temperature is 70 ℃, the treatment time is 25min, and the treated copper flexible connection surface is rough and has poor glossiness; repeatedly bending the copper flexible connection for 180 degrees until the copper flexible connection is broken, and peeling and falling off the surface of the copper flexible connection; the treated copper flexible joint was left at room temperature for 3 months, and its surface was darkened.
Example 6: the copper soft joint was surface-treated with the composition described in example 6, using a silver plate as anode and a copper soft joint as cathode, with a distance of 10cm between the cathode and the anode and a current density of 1A/dm2The treatment temperature is 70 ℃, the treatment time is 25min, and the treated copper flexible connection surface is rough and has poor glossiness; repeatedly bending the copper flexible connection for 180 degrees until the copper flexible connection is broken, and peeling the surface of the copper flexible connection without falling off; the treated copper flexible joint was left at room temperature for 3 months, and its surface was darkened.
Example 7: the copper soft joint was surface-treated with the composition described in example 7, using a silver plate as anode and a copper soft joint as cathode, with a distance of 10cm between the cathode and the anode and a current density of 1A/dm2The treatment temperature is 70 ℃, the treatment time is 25min, and the treated copper flexible connection surface is rough and has poor glossiness; repeatedly bending the copper flexible connection for 180 degrees until the copper flexible connection is broken, and peeling and falling off the surface of the copper flexible connection; the treated copper flexible joint was left at room temperature for 3 months, and its surface was darkened.
Example 8: the copper soft joint was surface-treated with the composition described in example 8, using a silver plate as anode and a copper soft joint as cathode, with a distance of 10cm between the cathode and the anode and a current density of 1A/dm2The treatment temperature is 70 DEG CThe treatment time is 25min, and the treated copper flexible connection surface is rough and has poor glossiness; repeatedly bending the copper flexible connection for 180 degrees until the copper flexible connection is broken, and peeling and falling off the surface of the copper flexible connection; the treated copper flexible joint was left at room temperature for 3 months, and its surface was darkened.
Example 9: the copper soft joint was surface-treated with the composition described in example 9, using a silver plate as anode and a copper soft joint as cathode, with a distance of 10cm between the cathode and the anode and a current density of 1A/dm2The treatment temperature is 70 ℃, the treatment time is 25min, and the treated copper flexible connection surface is rough and has poor glossiness; repeatedly bending the copper flexible connection for 180 degrees until the copper flexible connection is broken, and peeling and falling off the surface of the copper flexible connection; the treated copper flexible joint was left at room temperature for 3 months, and its surface was darkened.
Example 10: the copper soft joint was surface-treated with the composition described in example 10, using a silver plate as the anode and a copper soft joint as the cathode, with a distance of 10cm between the cathode and the anode and a current density of 1A/dm2The treatment temperature is 70 ℃, the treatment time is 25min, the treated copper flexible connection surface is uniform and compact, and the glossiness is general; repeatedly bending the copper flexible connection for 180 degrees until the copper flexible connection is broken, and peeling the surface of the copper flexible connection without falling off; the treated copper flexible joint is placed at normal temperature for 3 months, and the surface of the copper flexible joint becomes yellow.
The foregoing examples are merely illustrative and serve to explain some of the features of the method of the present invention. The appended claims are intended to claim as broad a scope as is contemplated, and the examples presented herein are merely illustrative of selected implementations in accordance with all possible combinations of examples. Accordingly, it is applicants' intention that the appended claims are not to be limited by the choice of examples illustrating features of the invention. The use of some numerical ranges in the claims also includes sub-ranges within their range, and variations in these ranges are also to be construed as being covered by the appended claims where possible.
Claims (4)
1. A composition for surface treatment of copper flexible joints,
each 1L of the composition contains:
22-30g of silver nitrate;
12-20g of potassium citrate;
12-20g of organic acid;
12-20g of alkali metal salt;
35-45g of succinimide;
15-25g of additive;
the weight ratio of the potassium citrate to the organic acid to the alkali metal salt is 1: (1.1-1.15): (1.1-1.15);
the additive is N- (((1-methyl-1- (hydroxymethyl) ethyl) amino) thiocarbonyl) benzamide and 2-butyne-1, 4 diol;
the weight ratio of the N- (((1-methyl-1- (hydroxymethyl) ethyl) amino) thiocarbonyl) benzamide to the 2-butyne-1, 4 diol is 1: (2.2-2.4);
the organic acid is citric acid, ethylsulfonic acid, 2-amino-4-methyl-6-nitrobenzoic acid;
the weight ratio of the citric acid to the ethyl sulfonic acid to the 2-amino-4-methyl-6-nitrobenzoic acid is 1.2: 1: 1.4.
2. the composition for surface treatment of copper flexible connections according to claim 1,
25-28g of silver nitrate;
15-18g of potassium citrate;
16-19g of organic acid;
16-19g of alkali metal salt;
40-42g of succinimide;
18-22g of additive.
3. The composition for surface treatment of copper flexible connections according to claim 2,
27g of silver nitrate;
16g of potassium citrate;
18g of organic acid;
18g of an alkali metal salt;
41g of succinimide;
20g of additive.
4. The composition for surface treating a copper soft link according to claim 1, wherein the additive comprises N- (((1-methyl-1- (hydroxymethyl) ethyl) amino) thiocarbonyl) benzamide and 2-butyne-1, 4 diol in a weight ratio of 1: 2.3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911323779.XA CN111118559B (en) | 2019-12-20 | 2019-12-20 | Composition for surface treatment of copper flexible connection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911323779.XA CN111118559B (en) | 2019-12-20 | 2019-12-20 | Composition for surface treatment of copper flexible connection |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111118559A CN111118559A (en) | 2020-05-08 |
| CN111118559B true CN111118559B (en) | 2020-12-01 |
Family
ID=70500520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911323779.XA Active CN111118559B (en) | 2019-12-20 | 2019-12-20 | Composition for surface treatment of copper flexible connection |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111118559B (en) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102277601B (en) * | 2011-08-09 | 2013-07-24 | 南京大学 | Cyanogen-free silver-plating electroplating liquid containing auxiliary complexing agent |
| CN103806060A (en) * | 2012-11-12 | 2014-05-21 | 无锡三洲冷轧硅钢有限公司 | Electroplating method of improving binding force of silver coating and matrix |
| CN103397355A (en) * | 2013-07-19 | 2013-11-20 | 哈尔滨工业大学 | Cyanide-free electrosilvering solution applicable to high-speed electroplating and electroplating process |
| CN104746113A (en) * | 2015-04-27 | 2015-07-01 | 南京宁美表面技术有限公司 | Cyanide-free silver plating solution and electroplating method |
| CN105040047B (en) * | 2015-07-21 | 2018-05-15 | 江苏澳光电子有限公司 | Plate silver plating solution and preparation method thereof |
| CN105420770A (en) * | 2015-11-30 | 2016-03-23 | 苏州市金星工艺镀饰有限公司 | Color-change-preventing cyanide-free silver plating electroplating liquid and electroplating method thereof |
| CN107227470A (en) * | 2017-07-20 | 2017-10-03 | 贵州大学 | A kind of non-cyanide silver electroplating solution and preparation method thereof |
| CN107299367A (en) * | 2017-08-24 | 2017-10-27 | 重庆立道表面技术有限公司 | Non-cyanide bright plate silver plating solution |
| CN109504989A (en) * | 2018-12-11 | 2019-03-22 | 湖北工程学院 | A kind of bright brush plating silver plating liquid and its preparation process, application method |
-
2019
- 2019-12-20 CN CN201911323779.XA patent/CN111118559B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN111118559A (en) | 2020-05-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102277601B (en) | Cyanogen-free silver-plating electroplating liquid containing auxiliary complexing agent | |
| CN101665963B (en) | Environmental non-cyanide plating solution for silver-plating | |
| US6176996B1 (en) | Tin alloy plating compositions | |
| US5552031A (en) | Palladium alloy plating compositions | |
| CN110344089B (en) | Gold sodium sulfite plating solution and electroplating method thereof | |
| JP2006009039A (en) | Tin based plating film in which growth of whisker is suppressed and forming method therefor | |
| EP0663460A1 (en) | Tin-zinc alloy electroplating bath and method for electroplating using the same | |
| CN111118559B (en) | Composition for surface treatment of copper flexible connection | |
| CN113463148A (en) | Method for electroplating gold on surface of titanium or titanium alloy substrate | |
| JP2011214066A (en) | Glossy nickel plating material, electronic component comprising glossy nickel plating material, and process for production of glossy nickel plating material | |
| US6331240B1 (en) | Tin-indium alloy electroplating solution | |
| US20030196906A1 (en) | Nickel electroplating solution | |
| CN108251824A (en) | A kind of environmental-protecting chemical sinks nickel solution | |
| KR102295180B1 (en) | Ag-Nano Alloy Plating Solution Compositions for Improving of Conductivity and Durability and Plating Methods Using Thereof | |
| JPH10317183A (en) | Non-cyan gold electroplating bath | |
| US6852211B2 (en) | Nickel electroplating solution | |
| US4297179A (en) | Palladium electroplating bath and process | |
| CN107385440B (en) | Electroplating method for cyanide-free composite plating of La-TiO 2 -Ag layer on surface of steel substrate | |
| JP3405669B2 (en) | Nickel-plated steel sheet excellent in corrosion resistance and surface appearance and method for producing the same | |
| JPH0553879B2 (en) | ||
| KR102024419B1 (en) | method for wet electroplating | |
| JP4480509B2 (en) | Copper strike plating bath | |
| KR20200144701A (en) | Electroplating solution | |
| KR102055883B1 (en) | Pd-Ni Alloy Plating Solution Compositions for Decoration and Plating Methods Using Thereof | |
| JPS639034B2 (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |