JPH0151557B2 - - Google Patents
Info
- Publication number
- JPH0151557B2 JPH0151557B2 JP26790484A JP26790484A JPH0151557B2 JP H0151557 B2 JPH0151557 B2 JP H0151557B2 JP 26790484 A JP26790484 A JP 26790484A JP 26790484 A JP26790484 A JP 26790484A JP H0151557 B2 JPH0151557 B2 JP H0151557B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- gold
- nickel plating
- strike
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 55
- 238000007747 plating Methods 0.000 claims description 43
- 229910052759 nickel Inorganic materials 0.000 claims description 26
- 239000004020 conductor Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 16
- 229910052737 gold Inorganic materials 0.000 description 16
- 239000010931 gold Substances 0.000 description 16
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000004381 surface treatment Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- PQMFVUNERGGBPG-UHFFFAOYSA-N (6-bromopyridin-2-yl)hydrazine Chemical compound NNC1=CC=CC(Br)=N1 PQMFVUNERGGBPG-UHFFFAOYSA-N 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- XTFKWYDMKGAZKK-UHFFFAOYSA-N potassium;gold(1+);dicyanide Chemical compound [K+].[Au+].N#[C-].N#[C-] XTFKWYDMKGAZKK-UHFFFAOYSA-N 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子機器の構成ユニツト相互間や部品
間の分離又は組立操作用バツクパネル等に組み込
む接続導体片の表面処理に係る金めつき方法に関
する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a gold plating method for surface treatment of a connecting conductor piece to be incorporated into a back panel for separating or assembling constituent units or parts of an electronic device. .
装置相互間、機器のユニツト相互間の信号回路
あるいは電源回路の配線ケーブルは、プラグジヤ
ツク結合方式のコネクタを介して結線される。係
るコネクタの接続導体片はケーブル側リードとは
んだ付け等して結線されるが、本発明は前記導体
片のはんだ付け時に要請されるはんだぬれ性の良
い、又接続の信頼性が高い金めつき表面処理方法
につき提示する。 Wiring cables for signal circuits or power supply circuits between devices or between equipment units are connected via plug-jack type connectors. The connecting conductor piece of such a connector is connected to the cable side lead by soldering, etc., and the present invention provides gold plating that has good solderability and high reliability of connection, which is required when soldering the conductor piece. The surface treatment method will be presented.
例えばばね用リン青銅等から打ち抜き成形され
た従来の接続導体片に対する一般的金めつき表面
処理方法は次の通り。
For example, a general gold plating surface treatment method for a conventional connection conductor piece stamped and formed from phosphor bronze for springs is as follows.
先づ機械的成形時の表面の脱脂洗浄をした後、
前処理としてストライクニツケルめつきと、続い
てニツケルめつきを行い、金の密着性を良くする
に必要最小限のニツケルめつき膜厚さ略1.0μｍの
金下地膜が形成される。 First, after degreasing and cleaning the surface during mechanical molding,
As a pretreatment, strike nickel plating is performed, followed by nickel plating, and a gold base film with a minimum thickness of about 1.0 μm of nickel plating film necessary to improve adhesion of gold is formed.
次いで、目的とする金めつきをなすが、これは
予め金ストライク処理を短時間行つた後、電解槽
中、白金を陽極、接続導体片を陰極として金めつ
き膜の厚さ少なくとも0.5μｍが被着される。 Next, the desired gold plating is achieved, after a short period of gold strike treatment, the gold plating film is deposited in an electrolytic bath with platinum as an anode and the connecting conductor piece as a cathode until the thickness of the gold plating film is at least 0.5 μm. be coated.
前記電解浴の組成は、例えばニツシンオーロベ
ース24K（日進化成(株)）1000c.c.に対してシアン化
金カリ＝25gr.を添加し、PH5.0としたものを使用
する。このさいの金めつき条件は、温度60℃、電
流密度0.2A／cm2を与え電解めつきがされる。 The composition of the electrolytic bath is, for example, 1000 c.c. of Nisshin Oro Base 24K (Nichisei Seisakusho Co., Ltd.) to which 25 gr. of potassium gold cyanide is added to adjust the pH to 5.0. The gold plating conditions at this stage are electrolytic plating with a temperature of 60°C and a current density of 0.2A/cm 2 .
然る後、めつき後の洗浄並びに乾燥をへて接続
導体片が完成する。 Thereafter, the connecting conductor piece is completed after plating, washing and drying.
係る金めつき導体片の表面は、例えばJIS Ｃ−
5033電子部品のはんだ付け性試験方法によるめつ
き膜評価や、あるいはメニスコグラフによるはん
だぬれ接触角度の検査等するが、例えば前記検査
ではぬれ角度が32〜36.5゜と大きい。 The surface of such a gold-plated conductor piece is, for example, JIS C-
5033 Electronic component solderability test method is used to evaluate the plating film, or the solder wetting contact angle is inspected using a meniscograph. For example, in the above inspection, the wetting angle is as large as 32 to 36.5 degrees.
この原因は金めつき電解浴又はニツケル電解浴
に添加されている光沢性を維持するための有機光
沢剤によるものと考えられ、これがめつき膜中に
共析する為と思われる。 The cause of this is thought to be due to the organic brightener added to the gold plating electrolytic bath or nickel electrolytic bath to maintain gloss, and it is thought that this is eutectoid in the plating film.
本発明は従来の金めつき浴を特に改変すること
なくはんだぬれ性を改善することである。即ち、
成形されたばね性導体素板の特に平坦な表面が形
成された端子部分のはんだぬれ性を改善するこ
と、断面が角形状の導体片端子では角隅部におけ
るはんだぬれ性をよくすることである。
The present invention is to improve solderability without particularly modifying conventional gold plating baths. That is,
To improve the solderability of a terminal portion of a molded spring conductor base plate having a particularly flat surface, and to improve the solderability at the corners of a conductor piece terminal having a rectangular cross section.
前記の問題点は、接続導体片に光沢剤を添加し
ない第一のストライクニツケルめつきをし、続い
て光沢剤を添加するニツケルめつきをし、続いて
光沢剤を添加しない第二のストライクニツケルめ
つきをし、続いて金めつきする金めつき方法によ
り解決される。
The problem mentioned above is that the first strike nickel plating without the addition of a brightener is applied to the connecting conductor piece, followed by the nickel plating with the addition of a brightener, and then the second strike nickel plating without the addition of a brightener. The solution is to use a gilding method that involves plating and then gold plating.
接続導体片のはんだぬれ性は、冶金的観点から
表面側の金は寧ろはんだ中に拡散することから、
基本的には下地ニツケル膜に対してはんだの親和
性（密着性）をよくすることである。従つて、ニ
ツケルめつき成膜を下記の順で行う。
From a metallurgical point of view, the solderability of the connecting conductor piece is determined by the fact that the gold on the surface side rather diffuses into the solder.
Basically, the purpose is to improve the affinity (adhesion) of the solder to the underlying nickel film. Therefore, nickel plating film formation is performed in the following order.
(1) 光沢剤を添加しない第一のストライクニツケ
ルめつき
(2) 光沢剤を添加するニツケルめつき
(3) 光沢剤を添加しない第二のストライクニツケ
ルめつき
換言すれば、従来の光沢のある下地ニツケル膜
に活性力のある第二のストライクニツケルめつき
をすれば、はんだとニツケル膜面の均一な密着性
が確保される。(1) First strike nickel plating without the addition of a brightener (2) Nickel plating with the addition of a brightener (3) Second strike nickel plating without the addition of a brightener In other words, conventional shiny nickel plating By applying a second active strike nickel plating to the underlying nickel film, uniform adhesion between the solder and the nickel film surface is ensured.
以下、本発明の一実施例を詳細に説明する。 Hereinafter, one embodiment of the present invention will be described in detail.
下地側をニツケルNi、表面側を少なくとも厚
さが0.5μｍの金めつき膜を形成する接続導体片の
表面処理に於いて、はんだとの密着性を良くする
ための有機光沢剤無添加のストライクめつきの浴
組成とその加工条件は次の通り。 In the surface treatment of the connecting conductor piece, which forms a Ni plating film on the base side and a gold plating film with a thickness of at least 0.5 μm on the surface side, a strike without the addition of organic brighteners is used to improve adhesion with solder. The plating bath composition and processing conditions are as follows.
ストライクめつき浴組成
塩化ニツケル …150〜300gr.／
濃塩酸 …50〜150ml／
条 件
電流密度 …２〜10A／cm2
時 間 …10〜60秒
温 度 …10〜40℃
PH …1.0以下
陽 極 …Ni板
前記無添加の電解浴を用いて本発明の第一並び
に第二のストライクニツケルめつき付けがされ
る。Strike plating bath composition Nickel chloride...150-300gr./Concentrated hydrochloric acid...50-150ml/Condition current density...2-10A/cm 2 hours...10-60 seconds Temperature...10-40℃ PH...1.0 or less positive Pole...Ni plate The first and second strike nickel plating of the present invention is performed using the additive-free electrolytic bath.
前記第一のストライクニツケルめつきと第二の
ストライクニツケルめつき間に行う光沢剤を添加
したニツケルめつきは、
電解めつき浴組成
硫酸ニツケル …300gr.／
塩化ニツケル …40gr.／
硼 酸 …40gr／
光沢剤（ユージライト(株)） …2.5c.c.／
条 件
電流密度 …2.0A／cm2
比 重 …25゜（ボーメ度）
温 度 …10〜40℃
PH …4.0以下
陽 極 …Ni板
により行われる。 Nickel plating with a brightening agent added between the first strike nickel plating and the second strike nickel plating is performed as follows: Electrolytic plating bath composition: Nickel sulfate...300gr./Nickel chloride...40gr./Boric acid...40gr. / Brightener (Eugerite Co., Ltd.) …2.5cc/ Conditions Current density…2.0A/cm 2 Specific gravity…25° (Baume degrees) Temperature…10 to 40°C PH…4.0 or less Anode…By Ni plate It will be done.
前記めつき前処理としての第一のストライクニ
ツケルめつきと、光沢剤を添加したニツケルめつ
き及び第二のストライクニツケルめつきにより、
総合のめつき膜厚さ略1.0μｍの金下地膜を成膜す
れば、はんだぬれの接触角度が60゜以下のはんだ
付け性に優れた接続導体片が形成される。 By the first strike nickel plating as the plating pre-treatment, the nickel plating with a brightener added, and the second strike nickel plating,
By forming a gold base film with a total plating thickness of about 1.0 μm, a connection conductor piece with excellent solderability with a solder contact angle of 60° or less is formed.
以上説明のように本発明のめつき処理によれ
ば、はんだ付け性の良い金めつき接続導体片が形
成されるので、例えばプリント板コネクタ等の装
置組立時における接続信頼性が向上する等の顕著
な効果がある。
As explained above, according to the plating process of the present invention, a gold-plated connection conductor piece with good solderability is formed, which improves connection reliability when assembling devices such as printed board connectors. It has a remarkable effect.
Claims (1)
ライクニツケルめつきをし、続いて光沢剤を添加
するニツケルめつきをし、続いて光沢剤を添加し
ない第二のストライクニツケルめつきをし、続い
て金めつきすることを特徴とする金めつき方法。1 Perform first strike nickel plating without adding a brightener to the connecting conductor piece, then nickel plating with a brightener added, followed by second strike nickel plating without adding a brightener, A gilding method characterized by subsequent gilding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26790484A JPS61166995A (en) | 1984-12-19 | 1984-12-19 | Gold plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26790484A JPS61166995A (en) | 1984-12-19 | 1984-12-19 | Gold plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61166995A JPS61166995A (en) | 1986-07-28 |
| JPH0151557B2 true JPH0151557B2 (en) | 1989-11-06 |
Family
ID=17451233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26790484A Granted JPS61166995A (en) | 1984-12-19 | 1984-12-19 | Gold plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61166995A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3916586B2 (en) * | 2003-05-16 | 2007-05-16 | 株式会社三井ハイテック | Lead frame plating method |
-
1984
- 1984-12-19 JP JP26790484A patent/JPS61166995A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61166995A (en) | 1986-07-28 |
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