JPS6219750U - - Google Patents
Info
- Publication number
- JPS6219750U JPS6219750U JP1985110087U JP11008785U JPS6219750U JP S6219750 U JPS6219750 U JP S6219750U JP 1985110087 U JP1985110087 U JP 1985110087U JP 11008785 U JP11008785 U JP 11008785U JP S6219750 U JPS6219750 U JP S6219750U
- Authority
- JP
- Japan
- Prior art keywords
- casing
- shaft
- heat dissipation
- utility
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000009751 slip forming Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Description
第１図は、本考案の螺旋状放熱フインの模式要
部側面図、第２図は、従来の平行型の放熱フイン
の模式要部断面図、図において、
１は半導体装置、２１は放熱フイン、２２は中
心軸、２３は放熱フイン、２４は有機接着材、を
それぞれ示している。
Fig. 1 is a schematic side view of the main part of a spiral heat dissipation fin of the present invention, and Fig. 2 is a schematic cross-sectional view of the main part of a conventional parallel heat dissipation fin. , 22 indicates a central axis, 23 indicates a heat dissipation fin, and 24 indicates an organic adhesive, respectively.
Claims (1)
２２の周囲に放熱用フイン２３が螺旋状で連続的
に形成された放熱体とを有することを特徴とする
半導体装置。[Claims for Utility Model Registration] A casing in which a semiconductor chip is mounted, one end of a shaft 22 is fixed to the casing, and heat dissipation fins 23 are continuously formed in a spiral shape around the shaft 22. 1. A semiconductor device comprising: a heat dissipating body;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985110087U JPS6219750U (en) | 1985-07-17 | 1985-07-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985110087U JPS6219750U (en) | 1985-07-17 | 1985-07-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6219750U true JPS6219750U (en) | 1987-02-05 |
Family
ID=30988784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985110087U Pending JPS6219750U (en) | 1985-07-17 | 1985-07-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6219750U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020096016A (en) * | 2018-12-10 | 2020-06-18 | 三菱マテリアル株式会社 | Insulation circuit board with heat sink and electronic component module |
-
1985
- 1985-07-17 JP JP1985110087U patent/JPS6219750U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020096016A (en) * | 2018-12-10 | 2020-06-18 | 三菱マテリアル株式会社 | Insulation circuit board with heat sink and electronic component module |