JPS6219631Y2 - - Google Patents

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Publication number
JPS6219631Y2
JPS6219631Y2 JP1980013805U JP1380580U JPS6219631Y2 JP S6219631 Y2 JPS6219631 Y2 JP S6219631Y2 JP 1980013805 U JP1980013805 U JP 1980013805U JP 1380580 U JP1380580 U JP 1380580U JP S6219631 Y2 JPS6219631 Y2 JP S6219631Y2
Authority
JP
Japan
Prior art keywords
suction cup
suction
substrate
spring
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1980013805U
Other languages
Japanese (ja)
Other versions
JPS56116339U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980013805U priority Critical patent/JPS6219631Y2/ja
Publication of JPS56116339U publication Critical patent/JPS56116339U/ja
Application granted granted Critical
Publication of JPS6219631Y2 publication Critical patent/JPS6219631Y2/ja
Expired legal-status Critical Current

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Description

【考案の詳細な説明】 本考案は孔あき板の供給装置に関する。[Detailed explanation of the idea] The present invention relates to a feeding device for perforated plates.

従来、プリント配線基板などの多数の小孔を有
する孔あき板を積重ねた状態から1枚ずつ供給す
る方法として、1枚ずつ板を押し出す押し出し方
式または真空吸盤で吸着して供給する真空吸盤方
式等の手段をとつている。しかし、前者の押し出
し方式は孔あき板相互が摺れ合うため、表面に微
細な傷がつく問題があり、この傷を嫌う板には適
用することが出来なかつた。
Conventionally, as a method for supplying perforated boards such as printed wiring boards that have a large number of small holes one by one from a stacked state, there have been methods such as extrusion method in which the boards are pushed out one by one, or vacuum suction method in which the boards are sucked and supplied using a vacuum suction cup. We are taking measures to However, the former extrusion method has the problem of causing minute scratches on the surface because the perforated plates rub against each other, and it could not be applied to plates that do not like these scratches.

一方、後者の真空吸盤方式は貫通した孔がある
ため2枚目の孔あき板まで一緒に重なつて吸着さ
れる欠点がある。このため、小型の真空吸盤を複
数個設け、板の孔のない位置を選んでその位置に
小型真空吸盤の接触点を合わせて使用している。
従つて多種小量生産の場合には調整頻度が増大し
自動化の利点がない欠点がある。
On the other hand, the latter vacuum suction cup method has the disadvantage that the second perforated plate is stacked together and suctioned because it has a through hole. For this reason, a plurality of small vacuum suction cups are provided, and a position on the plate with no holes is selected and the contact point of the small vacuum suction cup is aligned with that position.
Therefore, in the case of high-mix, low-volume production, the frequency of adjustment increases and there is no advantage of automation.

本考案の目的は、このような従来欠点を除去し
た孔あき板の供給装置を提供することにある。
An object of the present invention is to provide a perforated plate feeding device that eliminates such conventional drawbacks.

本考案によれば、排気手段と連接した真空吸盤
をバネにより保持板が上下動と前後進運動する真
空吸着保持具と前記真空吸盤保持具が上昇時に吸
盤の吸着面より阻止面が下側となる上昇防止上下
機構とを備えたことを特徴とする孔あき板の供給
装置が得られる。
According to the present invention, there is provided a vacuum suction holder in which a holding plate of a vacuum suction cup connected to an exhaust means is moved up and down and back and forth by means of a spring, and a blocking surface of the vacuum suction cup holder is lower than the suction surface of the suction cup when the vacuum suction cup holder is raised. A perforated plate feeding device is obtained, which is characterized by being equipped with a rise prevention vertical mechanism.

以下、本考案を図面を参照して説明する。 Hereinafter, the present invention will be explained with reference to the drawings.

第1図は本考案の一実施例の側面図、第2図は
真空系統の配管図、第3図a,b,c,dは本考
案の吸着部の吸着動作を示す側面図である。本実
施例は、テーブル上に積み重ねて置いた孔あけ後
のプリント配線基板(以下基板と称す)を基板処
理機へ連続して供給する連続ハンドリング装置に
適用したものであり、装置は大別して真空吸盤部
と、昇降テーブル部よりなる。吸盤1は排気手段
としての真空ポンプ2に第1図では簡単のため省
略した電磁弁3、圧力検知器4を中間に直列接続
したフレキシブルホース5で連結され、上下シリ
ンダ6のシヤフト6aに釣支されている保持板と
しての吸盤ヘツド7に取り付けたバネ8でランダ
ムに多数個吊持されている。なお、上下シリンダ
6及びそのシヤフト6aにより吸盤ヘツド7を昇
降させる機構を構成している。
FIG. 1 is a side view of an embodiment of the present invention, FIG. 2 is a piping diagram of a vacuum system, and FIGS. 3 a, b, c, and d are side views showing the suction operation of the suction unit of the present invention. This example is applied to a continuous handling device that continuously supplies printed wiring boards (hereinafter referred to as boards) after holes are stacked on a table to a board processing machine. Consists of a suction cup part and an elevating table part. The suction cup 1 is connected to a vacuum pump 2 as an exhaust means by a flexible hose 5 with a solenoid valve 3 and a pressure detector 4, which are omitted for simplicity in FIG. A large number of them are randomly suspended by springs 8 attached to a suction cup head 7 which serves as a holding plate. Note that the upper and lower cylinders 6 and their shafts 6a constitute a mechanism for raising and lowering the suction head 7.

上下シリンダ6の取り付け板9は、規定以上に
上昇することを防止する上昇ストツパー10を上
下動させるストツパーシリンダー11が取り付け
られ、第1図矢印の如く左右に前後進する前後進
シリンダー12に連結されている。基板13を積
載する昇降テーブル14は、バネ15を介して、
モーター16の回転により上下動する。
The mounting plate 9 of the vertical cylinder 6 is attached with a stopper cylinder 11 that moves up and down a lift stopper 10 that prevents it from rising above a specified level, and is connected to a forward and backward movement cylinder 12 that moves back and forth left and right as shown by the arrows in FIG. has been done. The lifting table 14 on which the substrates 13 are loaded is moved by means of springs 15.
It moves up and down by the rotation of the motor 16.

次に基板13の供給動作について説明する。 Next, the operation of supplying the substrate 13 will be explained.

先ず、基板13を昇降テーブル14上へ積み重
ね、始動操作により、モーター16が回転し、ネ
ジ15により、昇降テーブル14を上昇させ、基
板13の最上層にある板の位置レベルをフオトセ
ンサA17で検出し、規定位置に停止させる。吸
盤1が上下シリンダ6の駆動により、下降し、昇
降テーブル14上の基板13へ接触する。吸盤1
が基板13へ接触すると真空ポンプ2の働きによ
り吸盤1が吸着状態になり、上下シリンダ6の駆
動により吸盤ヘツド7が上昇を開始する。基板1
3が吸盤1により第3図aのように2枚重なつて
吸着されている場合は、吸盤ヘツド7が上昇する
につれて上昇ストツパー10に基板13が当たり
第3図bのように基板13は上昇ストツパー10
により上昇を阻止される。
First, the substrates 13 are stacked on the lifting table 14, and by a starting operation, the motor 16 rotates, the screw 15 raises the lifting table 14, and the position level of the top layer of the substrates 13 is detected by the photo sensor A17. , and stop it at the specified position. The suction cup 1 is lowered by the drive of the upper and lower cylinders 6 and comes into contact with the substrate 13 on the lifting table 14. Sucker 1
When the suction cup 1 comes into contact with the substrate 13, the suction cup 1 is brought into a suction state by the action of the vacuum pump 2, and the suction cup head 7 starts to rise by driving the upper and lower cylinders 6. Board 1
3 are suctioned in two layers by the suction cup 1 as shown in FIG. 3a, as the suction cup head 7 rises, the substrate 13 hits the lift stopper 10 and the substrate 13 rises as shown in FIG. 3b. stopper 10
is prevented from rising.

しかし、吸盤ヘツド7はさらに上昇するので吸
盤1と吸盤ヘツド7につながつているバネ8が伸
び、吸盤1を基板13から離そうとする張力が発
生する。一方、上側の基板13の孔18を介して
下側の2枚目の基板13を持ち上げている吸盤、
つまり、孔18に当つている吸盤21の吸着力
は、2枚重なつた基板13のすき間からのエアー
リークにより、孔18に当つていない吸盤1の吸
着力と比べると弱い。従つて、バネ8に最大張力
が孔18に当つていない吸盤1の吸着力より小さ
く、かつ孔18に当つている吸盤21の吸着力よ
り大きいバネ8を選ぶことにより、第3図cのよ
うに孔18を介して、下側の2枚目の基板13を
吸着している吸盤21の1枚目の枚から外れて2
枚目の基板13は積み重ねた基板13上へ落下す
る。
However, as the suction cup head 7 rises further, the spring 8 connected to the suction cup 1 and the suction cup head 7 stretches, and a tension force is generated that tends to separate the suction cup 1 from the substrate 13. On the other hand, a suction cup lifting the second lower substrate 13 through the hole 18 of the upper substrate 13;
In other words, the suction force of the suction cup 21 that is in contact with the hole 18 is weaker than the suction force of the suction cup 1 that is not in contact with the hole 18 due to air leakage from the gap between the two overlapping substrates 13. Therefore, by selecting a spring 8 whose maximum tension is smaller than the suction force of the suction cup 1 that is not in contact with the hole 18 and larger than the suction force of the suction cup 21 that is in contact with the hole 18, the result shown in FIG. As shown in FIG.
The first substrate 13 falls onto the stacked substrates 13.

外れた吸盤21はフレキシブルホース5に接続
されている圧力検知器4(第2図参照)により、
外れたことが検知され、電磁弁3が閉じられて、
吸盤21の真空系統の配管回路をしや断し、エア
ーもれを防止する。フオトセンサB19で吸着枚
数が1枚であることを検知確認した後、第3図d
のようにストツパーシリンダ11が駆動し、上昇
ストツパー10が上へすなわちストツパーシリン
ダ11内へ引き込むことにより、バネの伸びが縮
まり基板1はバネ8の張力から開放され、更に上
へ持ち上げられる。
The detached suction cup 21 is detected by the pressure detector 4 (see Fig. 2) connected to the flexible hose 5.
It is detected that the solenoid valve 3 has come off, and the solenoid valve 3 is closed.
The piping circuit of the vacuum system of the suction cup 21 is cut off to prevent air leakage. After the photo sensor B19 detects and confirms that the number of sheets to be picked up is one, the
The stopper cylinder 11 is driven as shown in FIG. 1, and the lifting stopper 10 is pulled upward, that is, into the stopper cylinder 11, whereby the extension of the spring is reduced, and the substrate 1 is released from the tension of the spring 8 and lifted further upward.

もし、基板13が吸盤1により2枚重なつて吸
着されることなく、正常状態すなわち1枚のみを
吸着した場合はフオトセンサB19でバネ8にス
トレスを与えないように直ちにストツパーシリン
ダ11が駆動して上昇ストツパー10が上へ引き
込む。
If two substrates 13 are not attracted by the suction cup 1 in a stacked manner, but in a normal state, that is, only one substrate is attracted, the stopper cylinder 11 is immediately actuated by the photo sensor B19 so as not to apply stress to the spring 8. Then the lift stopper 10 pulls it upward.

吸着された基板13は矢印の如く左右に前後進
シリンダ12が駆動することにより右側の処理コ
ンベア20上へ移動する。移動した後、真空ポン
プ2を停止させ、基板13を吸盤1から外し、処
理コンベア20上へ乗せる。
The attracted substrate 13 is moved onto the processing conveyor 20 on the right side by driving the forward and backward movement cylinder 12 in the left and right directions as shown by the arrows. After moving, the vacuum pump 2 is stopped, the substrate 13 is removed from the suction cup 1, and placed on the processing conveyor 20.

以上の動作を繰り返して基板13を連続的にハ
ンドリングして供給する。昇降テーブル14は、
フオトセンサーA17により、基板13の最上面
を常に一定レベルに維持するようモーター16に
よつて駆動調整される。
The above operations are repeated to continuously handle and supply the substrates 13. The lifting table 14 is
The photo sensor A17 drives and adjusts the drive of the motor 16 so that the top surface of the substrate 13 is always maintained at a constant level.

以上、本考案により、孔あき板を積み重ねた状
態より、表面に摺れ傷をつけることなく、確実に
一枚ずつ分離して、各種の製造装置へ自動供給す
ることが出来る。品種毎の吸盤位置合わせが不要
のため、多種小量生産の無人化に適する効果が大
きい。
As described above, according to the present invention, from a stacked state of perforated plates, it is possible to reliably separate the perforated plates one by one without causing scratches on the surface and automatically supply them to various manufacturing devices. Since there is no need to align the suction cup for each product, it is highly effective in unmanned high-mix, low-volume production.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例の側面図、第2図
は、真空配管図、第3図a,b,c,dは本考案
の吸着部の吸着動作を説明する側面図である。 1……吸盤、2…真空ポンプ、3……電磁弁、
4……圧力検知器、5……フレキシブルホース、
6……上下シリンダ、6a……シヤフト、7……
吸盤ヘツド、8……バネ、9……取り付け板、1
0……上昇ストツパー、11……ストツパーシリ
ンダ、12……前後進シリンダ、13……基板、
14……昇降テーブル、15……ネジ、16……
モーター、17……フオトセンサA、18……
孔、19……フオトセンサB、20……処理コン
ベア、21……孔18に当つている吸盤。
FIG. 1 is a side view of an embodiment of the present invention, FIG. 2 is a vacuum piping diagram, and FIGS. 3 a, b, c, and d are side views illustrating the suction operation of the suction unit of the present invention. 1... Suction cup, 2... Vacuum pump, 3... Solenoid valve,
4...Pressure detector, 5...Flexible hose,
6... Upper and lower cylinders, 6a... Shaft, 7...
Suction cup head, 8... Spring, 9... Mounting plate, 1
0... Ascent stopper, 11... Stopper cylinder, 12... Forward and backward movement cylinder, 13... Board,
14... Lifting table, 15... Screw, 16...
Motor, 17...Photo sensor A, 18...
Hole, 19... Photo sensor B, 20... Processing conveyor, 21... Suction cup in contact with hole 18.

Claims (1)

【実用新案登録請求の範囲】 排気手段2と接続された複数の真空吸盤1,2
1を各々バネ8を介して吊持する保持板7と、 前記保持板を上昇させる機構6,6aと、 前記保持板が上昇した時前記吸盤で吸着した孔
あき板13の上昇を防止する手段10とを備え、 前記バネとしてその最大張力が前記孔あき板の
孔18に当つていない吸盤1の吸着力より小さ
く、かつ孔に当つている吸盤21の吸着力より大
きいバネが使用されていることを特徴とする孔あ
き板の供給装置。
[Scope of claim for utility model registration] Plural vacuum suction cups 1 and 2 connected to exhaust means 2
1 by means of springs 8, mechanisms 6 and 6a for lifting the holding plates, and means for preventing the perforated plate 13 attracted by the suction cups from rising when the holding plates rise. 10, and a spring is used as the spring, the maximum tension of which is smaller than the suction force of the suction cups 1 that are not in contact with the holes 18 of the perforated plate, and greater than the suction force of the suction cups 21 that are in contact with the holes. A feeding device for perforated plates, characterized in that:
JP1980013805U 1980-02-06 1980-02-06 Expired JPS6219631Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980013805U JPS6219631Y2 (en) 1980-02-06 1980-02-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980013805U JPS6219631Y2 (en) 1980-02-06 1980-02-06

Publications (2)

Publication Number Publication Date
JPS56116339U JPS56116339U (en) 1981-09-05
JPS6219631Y2 true JPS6219631Y2 (en) 1987-05-20

Family

ID=29610314

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980013805U Expired JPS6219631Y2 (en) 1980-02-06 1980-02-06

Country Status (1)

Country Link
JP (1) JPS6219631Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9341912B2 (en) 2012-03-13 2016-05-17 View, Inc. Multi-zone EC windows

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH065617Y2 (en) * 1987-02-24 1994-02-09 株式会社東洋精機製作所 Supply device for gauze etc. in melting test

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5032938U (en) * 1973-07-20 1975-04-10
JPS5222872B2 (en) * 1974-11-25 1977-06-20

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4726477U (en) * 1971-07-16 1972-11-25
JPS5222872U (en) * 1975-08-06 1977-02-17

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5032938U (en) * 1973-07-20 1975-04-10
JPS5222872B2 (en) * 1974-11-25 1977-06-20

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9341912B2 (en) 2012-03-13 2016-05-17 View, Inc. Multi-zone EC windows

Also Published As

Publication number Publication date
JPS56116339U (en) 1981-09-05

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