JPS62195159A - Hybrid integrated circuit device and lead frame used for manufacture thereof - Google Patents
Hybrid integrated circuit device and lead frame used for manufacture thereofInfo
- Publication number
- JPS62195159A JPS62195159A JP61035172A JP3517286A JPS62195159A JP S62195159 A JPS62195159 A JP S62195159A JP 61035172 A JP61035172 A JP 61035172A JP 3517286 A JP3517286 A JP 3517286A JP S62195159 A JPS62195159 A JP S62195159A
- Authority
- JP
- Japan
- Prior art keywords
- fixing part
- lead
- wiring board
- fixed
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 229910000679 solder Inorganic materials 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 5
- 238000005452 bending Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 7
- 239000004020 conductor Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09045—Locally raised area or protrusion of insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09163—Slotted edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10946—Leads attached onto leadless component after manufacturing the component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、混成集積回路装置およびその製造において用
いられるリードフレームに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a hybrid integrated circuit device and a lead frame used in its manufacture.
混成集積回路装置における配線基板に固定されるリード
については、工業調査会発行の［電子材料Ｊ１９Ｂ５年
１２月号、昭和６０年１月１日発行、広告頁２７３に記
載されている。この頁には、配線基板の縁をクランプす
る構造のリード、あるいは配線基板の平坦面に直接固定
される固定部を有する直線状に延在するリードが表記さ
れている。The leads to be fixed to the wiring board in a hybrid integrated circuit device are described in "Electronic Materials J19B5 December issue, January 1, 1985, advertisement page 273, published by Kogyo Kenkyukai. This page describes leads that have a structure that clamps the edge of the wiring board, or leads that extend linearly and have a fixing part that is directly fixed to the flat surface of the wiring board.
コンピュータ等を始とする電子機器にあっては、その内
部のマザーボードに多くの電子部品を挿入実装′してい
るのが一般的である。この場合、マザ−ボードを多段に
配置する構造の場合、マザーボート“に挿入実装される
電子部品の高さを低くすることが、マザーボード間の間
隔縮小から電子機器の小型化に繋がる。そこで、電子部
品を搭載した配線基板の縁にリードを固定した構造の混
成集積回路装置にあっては、電子部品を搭載しない配線
基板面にリードを固定することによって配線基板面を有
効に使用し、配線基板の幅、すなわち、マザーボードに
実装した状態では高さとなる箇所を小さくしている。こ
の片面固定構造を採用するために、リードとしては、前
記文献にも表記されているように、直線状に延在するリ
ードが使用されている。BACKGROUND OF THE INVENTION In electronic devices such as computers, it is common for many electronic components to be inserted and mounted on an internal motherboard. In this case, in the case of a structure in which motherboards are arranged in multiple stages, lowering the height of the electronic components inserted and mounted on the motherboard will lead to the miniaturization of electronic devices by reducing the distance between the motherboards. In a hybrid integrated circuit device that has a structure in which leads are fixed to the edge of a wiring board on which electronic components are mounted, the wiring board surface is effectively used by fixing the leads to the wiring board surface where no electronic components are mounted. The width of the board, that is, the height when mounted on the motherboard, is reduced.In order to adopt this single-sided fixed structure, the leads are made in a straight line, as described in the above document. Extending leads are used.
しかし、このような片面固定構造のリード有する混成集
積回路装置は、リードが一面部分でしか配線基板に固定
されていないことから、接合強度が大きいとは言えず、
使用環境が悪い条件下での信頼性に問題があることが本
発明者によってあきらかにされた。However, such a hybrid integrated circuit device having leads fixed on one side cannot be said to have high bonding strength because the leads are fixed to the wiring board only on one side.
The inventor of the present invention has revealed that there is a problem with reliability under adverse usage conditions.
本発明の目的はリードの配線基板に対する接合強度を高
くし、かつ配線基板の実装高さの低い混成集積回路装置
を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a hybrid integrated circuit device in which the bonding strength of leads to a wiring board is increased and the mounting height of the wiring board is low.
本発明の他の目的は配線基板との接合強度が高くできる
リードフレームを提供することにある。Another object of the present invention is to provide a lead frame that can be bonded to a wiring board with high strength.
本発明の前記ならびにそのほかの目的と新規な特徴は、
本明細書の記述および添付図面からあきらかになるであ
ろう。The above and other objects and novel features of the present invention include:
It will become clear from the description of this specification and the accompanying drawings.
本願において開示される発明のうち代表的なものの概要
を籠準に説明すれば、下記のとおりである。A brief summary of typical inventions disclosed in this application is as follows.
すなわち、本発明のり一ドは、配線基板に固定される部
分として、配線基板の平坦な面に対面する主固定部と、
配線基板の側面に対面する補助固定部と、を有し、この
主固定部と補助固定部とが半田で配線基板に固定されて
いる。さらに、前記補助固定部は配線基板の側面に設け
た窪みの底中央に位置している。That is, the adhesive of the present invention has a main fixing part facing the flat surface of the wiring board as a part fixed to the wiring board;
The main fixing part and the auxiliary fixing part are fixed to the wiring board with solder. Further, the auxiliary fixing portion is located at the center of the bottom of the recess provided on the side surface of the wiring board.
−Ｊ二記した手段によれば、リードは主固定部と補助固
定部との三箇所で配線基板に固定されていることにより
、リードの配線基板に対する接合面積が広くなることか
ら、混成集積回路装置におけるリードの接合強度の向ヒ
が達成できる。さらに、配線基板の側面に設けた窪みの
底中央部にリードの補助固定部を位置させるため、その
窪み深さに対応した寸法だけ配線基板の実装高さを低く
できる。According to the method described in -J2, the lead is fixed to the wiring board at three places, the main fixing part and the auxiliary fixing part, so that the bonding area of the lead to the wiring board is widened, so the hybrid integrated circuit It is possible to improve the bonding strength of the leads in the device. Furthermore, since the auxiliary fixing portion of the lead is located at the center of the bottom of the recess provided on the side surface of the wiring board, the mounting height of the wiring board can be lowered by a dimension corresponding to the depth of the recess.
以下図面を参照して本発明の一実施例について説明する
。An embodiment of the present invention will be described below with reference to the drawings.
第１図は本発明の一実施例による混成集積回路装置の要
部を示す模式的断面図、第２図は同しく混成集積回路装
置の平面図、第３図は同じくリード固定部を示す拡大斜
視図、第４図は同じく混成集積回路装置の組立に用いら
れるリードフレームの平面図、第５図は同じく断面図、
第６図は同じく配線基板にリードを接続する状態を示す
平面図、第７図は同じく断面図である。FIG. 1 is a schematic cross-sectional view showing the main parts of a hybrid integrated circuit device according to an embodiment of the present invention, FIG. 2 is a plan view of the hybrid integrated circuit device, and FIG. 3 is an enlarged view showing the lead fixing part. A perspective view, FIG. 4 is a plan view of a lead frame used for assembling a hybrid integrated circuit device, and FIG. 5 is a cross-sectional view.
FIG. 6 is a plan view showing how the leads are connected to the wiring board, and FIG. 7 is a sectional view.
本発明の一実施例による混成集積回路装置は、第１図に
示されるような構造となっている。同図では、混成集積
回路装置はマザーボー「′１に挿入実装された状態とな
っている。混成集積回路装置は、ガラスエポキシ樹脂か
らなる配線基板２の平坦な主面（同図では左側の面）に
電子部品３が実装されるとともに、前記配線基板２の縁
にり−１４が半田（接合材）５によって固定されている
。A hybrid integrated circuit device according to an embodiment of the present invention has a structure as shown in FIG. In the figure, the hybrid integrated circuit device is inserted and mounted on the motherboard '1. ) is mounted with an electronic component 3, and the edge -14 of the wiring board 2 is fixed with solder (bonding material) 5.
このリード４は、前述のように、マザーボード１に挿入
実装されている。前記電子部品３は、たとえば、大容量
２５６にビットダイナミックＲＡＭであり、第２図に示
されるように、配線基板２に４個並んで実装されている
。また、二つの電子部品３の下にはチップコンデンサー
１７を実装し、電子部品実装後の配線基板の厚みＴを小
とし、マザーボードへの高密度実装を達成させる。The leads 4 are inserted and mounted on the motherboard 1 as described above. The electronic components 3 are, for example, bit dynamic RAMs with a large capacity 256, and as shown in FIG. 2, four electronic components 3 are mounted in line on the wiring board 2. Furthermore, a chip capacitor 17 is mounted under the two electronic components 3, and the thickness T of the wiring board after mounting the electronic components is reduced, thereby achieving high-density mounting on the motherboard.
前記リード４は、前記マザーボード１に挿入される真直
なリード本体６と、このリート′本体６の先端に配設さ
れた主固定部７と、補助固定部８とからなっている。前
記補助固定部８は、第３図に示されるように、前記リー
ド本体６よりも幅広の矩形部９を端から、それぞれ切り
込みを途中まで入れて３分割とし、中央の小片を９０度
折り曲げることによって形成されている。したがって、
前記主固定部７と補助固定部８とは９０度のなす角を有
して対峙している。前記主固定部７は、前記配線基板２
の電子部品３を等を実装しない平坦な面（裏面：右側の
面）の縁に設けられたメタライズ層からなるリード取付
パッド１０に、第３図では点々で示される半田５を介し
て固定されている。The lead 4 includes a straight lead body 6 that is inserted into the motherboard 1, a main fixing part 7 disposed at the tip of the lead body 6, and an auxiliary fixing part 8. As shown in FIG. 3, the auxiliary fixing part 8 is made by cutting a rectangular part 9 wider than the lead body 6 from one end to the middle to divide it into three parts, and bending the small piece in the center by 90 degrees. is formed by. therefore,
The main fixing part 7 and the auxiliary fixing part 8 face each other at a 90 degree angle. The main fixing part 7 is connected to the wiring board 2
An electronic component 3 is fixed to a lead attachment pad 10 made of a metallized layer provided on the edge of a flat surface (back surface: right side surface) on which no electronic components are mounted, via solder 5 shown as dots in FIG. ing.
また、前記補助固定部８は配線基板２の端面のスルーホ
ール内壁面に設けられたメタライズ層からなるリード取
付パッド１１に、半田５を介して固定されている。前記
配線基板２は、その製造終了工程で、配線基板素材を配
線基板素材に穿たれた直線状に並ぶスルーホール列に沿
って切断することによって製造される。前記切断幅はス
ルーホール径よりも小さいことから、製造された配線基
板２の一端面にはスルーホールの一部が残留し、この結
果、リード取付パッド１１が形成されることになる。前
記補助固定部８はこのリード取付パッド１１の中央、す
なわちスルーホールの曲面からなる窪みの底中央部に位
置するように固定される。Further, the auxiliary fixing portion 8 is fixed via solder 5 to a lead attachment pad 11 made of a metallized layer provided on the inner wall surface of the through hole on the end surface of the wiring board 2. The wiring board 2 is manufactured by cutting the wiring board material along a linear array of through holes bored in the wiring board material in the manufacturing completion process. Since the cutting width is smaller than the diameter of the through hole, a portion of the through hole remains on one end surface of the manufactured wiring board 2, and as a result, the lead attachment pad 11 is formed. The auxiliary fixing part 8 is fixed so as to be located at the center of the lead attachment pad 11, that is, at the center of the bottom of the depression formed by the curved surface of the through hole.
なお、前記電子部品３は、パッケージ１２の周面から突
き出されかつパンケージ１２の底面側に周り込むように
形成されたり一部１３を、配線基板２の主面に設けられ
たメタライズ層からなる搭載パッド１４に載せ、さらに
半田１５で固定されることによって、配線基板２に実装
されている。また、第１図に示される１６は、配置ｉ！
基板２の主面および裏面の導体層（メタライズ層）を電
気的に接続する導体である。The electronic component 3 is formed so as to protrude from the circumferential surface of the package 12 and wrap around the bottom side of the pan cage 12. It is mounted on the wiring board 2 by placing it on the pad 14 and further fixing it with solder 15. Further, 16 shown in FIG. 1 indicates the arrangement i!
This is a conductor that electrically connects the conductor layer (metallized layer) on the main surface and back surface of the substrate 2.
このような混成集積回路装置にあっては、配線基板２に
接続されるリード４の固定部は、配線基板２の主面には
接続されないことから、配線基板２は電子部品３を実装
するに必要最小限の面積でよくなり、その幅（Ｗ）も狭
くできるため、第１図に示されるように、マザーボード
１からの混成集積回路装置の挿入実装高さくＩ］）を低
くすることができるようになっている。この結果、実施
例の混成集積回路装置を挿入実装したマザーボード■を
電子機器に組み込めば、電子機器の小型化が図れること
になる。In such a hybrid integrated circuit device, the fixed portion of the lead 4 connected to the wiring board 2 is not connected to the main surface of the wiring board 2, so the wiring board 2 is not suitable for mounting the electronic component 3. Since the necessary minimum area is required and the width (W) can be narrowed, the insertion mounting height (I) of the hybrid integrated circuit device from the motherboard 1 can be lowered, as shown in Fig. 1. It looks like this. As a result, if the motherboard (2) on which the hybrid integrated circuit device of the embodiment is inserted and mounted is incorporated into an electronic device, the size of the electronic device can be reduced.
一方、この実施例の混成集積回路装置は、リード４の配
線基板２に対する固定部が、配線基板２の平坦な面に固
定される主固定部７と、配線基板２の端面に固定される
補助固定部８と、三箇所に亘って設けられていることか
ら、接合面積が広くなり、接合強度が高くなる。この接
合強度の向上は混成集積回路装置の信頼度（信軌性）向
上ともなる。On the other hand, in the hybrid integrated circuit device of this embodiment, the fixing parts of the leads 4 to the wiring board 2 are a main fixing part 7 fixed to the flat surface of the wiring board 2, and an auxiliary fixing part 7 fixed to the end surface of the wiring board 2. Since the fixing portion 8 is provided at three locations, the bonding area becomes large and the bonding strength increases. This improvement in bonding strength also improves the reliability (trustworthiness) of the hybrid integrated circuit device.
つぎに、前述のような混成集積回路装置の製造（組立）
に用いるリードフレームおよびそのり−ドフレームを用
いて混成集積回路装置を組み立てる方法について説明す
る。Next, manufacture (assembly) the hybrid integrated circuit device as described above.
A lead frame used in the present invention and a method for assembling a hybrid integrated circuit device using the lead frame will be described.
リードフレーム１８は、鉄−ニッケル合金、銅。The lead frame 18 is made of iron-nickel alloy, copper.
銅合金等からなる薄い金属板を打ち抜き成形することに
よって形成され、第４図および第５図に示されるような
構造となっている。リードフレーム１８は、平行に延在
する一対の細い砕片１９．２０と定間隔に配設されかつ
前記枠片１９．２０を連結するタイバー２１と、前記タ
イバー２１間に配設されかつ一方の枠片に一端が固定さ
れた片持梁構造のり一部４とからなっている。前記リー
ド４は、前述のようにリード本体６の先端の矩形部９に
主固定部７および補助固定部８を有する構造となってい
る。また、各リード４の位置は前記配線基板２のリード
取付パッド１０．１１に対応するようになっている。ま
た、タイバー２１はり−ド４の補助固定部８が突出する
方向とは逆の方向に盛り上がるように屈曲している。ま
た、前記枠片１９．２０にはガイド孔２２．２３が設け
られている。It is formed by punching and forming a thin metal plate made of copper alloy or the like, and has a structure as shown in FIGS. 4 and 5. The lead frame 18 includes a pair of thin broken pieces 19.20 extending in parallel, a tie bar 21 arranged at regular intervals and connecting the frame pieces 19.20, and a tie bar 21 arranged between the tie bars 21 and connected to one frame. It consists of a cantilever structure glue part 4 fixed at one end to the piece. As described above, the lead 4 has a structure in which the rectangular portion 9 at the tip of the lead body 6 includes the main fixing portion 7 and the auxiliary fixing portion 8. Further, the position of each lead 4 corresponds to the lead attachment pad 10.11 of the wiring board 2. Further, the tie bar 21 is bent so as to bulge in the opposite direction to the direction in which the auxiliary fixing part 8 of the beam bar 4 protrudes. Further, the frame piece 19.20 is provided with a guide hole 22.23.
このようなリードフレーム１８にあっては、混成集積回
路装置の組立に際しては、第６図および第７図に示され
るように、リード４の主固定部７および補助固定部８が
、これらの図には示されていないが、電子部品３等を実
装した配線基板２のリード取付パッド１０．．１１に重
ねられるとともに、配線基板２の他の縁部分に重なるリ
ードフレーム１８の一方の枠片１９．２０と配線基板２
とがクリップ２４で仮固定される。この際、前記タイバ
ー２１がハネの作用をするため、主固定部７および補助
固定部８は配線基板２に弾力的に接触し、主固定部７お
よび補助固定部８は第７図では図示しないリード取付パ
ッド１０．１１に正確確実に重なる。そこで、半田５に
よって主固定部７および補助固定部８をリード取付パン
１〜１０．１１に固定する。また、その後、配￥ａ基板
２とリードフレーム１８を仮固定していたクリップ２４
は取り外されるとともに、リード４は枠片２０の付は根
部分で切断され、第１図および第２図に示されるような
混成集積回路装置が製造される。なお、前記主固定部７
が配線基板２に強く接触するように、一対の枠片１９．
２０の平坦面を結ぶ平面よりも、主固定部７の配線基板
２に接触する面が突出するようにしておけば、主固定部
７の配線基板２に対する固定の信頼度はより高くなる。In such a lead frame 18, when assembling a hybrid integrated circuit device, as shown in FIGS. 6 and 7, the main fixing part 7 and the auxiliary fixing part 8 of the lead 4 are Although not shown in the figure, the lead attachment pad 10. of the wiring board 2 on which the electronic components 3 etc. are mounted. ．． 11 and one frame piece 19.20 of the lead frame 18 which overlaps the other edge portion of the wiring board 2 and the wiring board 2.
are temporarily fixed with clips 24. At this time, since the tie bar 21 acts as a spring, the main fixing part 7 and the auxiliary fixing part 8 come into elastic contact with the wiring board 2, and the main fixing part 7 and the auxiliary fixing part 8 are not shown in FIG. Accurately and reliably overlaps the lead attachment pads 10.11. Therefore, the main fixing part 7 and the auxiliary fixing part 8 are fixed to the lead attachment pans 1 to 10.11 using solder 5. Also, after that, the clip 24 that had temporarily fixed the wiring board 2 and the lead frame 18
is removed, and the leads 4 are cut at the base of the frame piece 20 to produce a hybrid integrated circuit device as shown in FIGS. 1 and 2. In addition, the main fixing part 7
a pair of frame pieces 19. so that they strongly contact the wiring board 2.
If the surface of the main fixing section 7 that contacts the wiring board 2 is made to protrude beyond the plane connecting the flat surfaces of the main fixing section 20, the reliability of fixing the main fixing section 7 to the wiring board 2 will be higher.
このような実施例によれば、つぎのような効果が得られ
る。According to such an embodiment, the following effects can be obtained.
（１）本発明の混成集積回路装置は、配線基板に固定さ
れたリードは、配線基板の平坦面に固定される主固定部
と、配線基板の端面に固定される補助固定部とによって
配線基板に固定されているため、接合面積が広い故に接
合強度が向上するという効果が得られる。(1) In the hybrid integrated circuit device of the present invention, the leads fixed to the wiring board are fixed to the wiring board by the main fixing part fixed to the flat surface of the wiring board and the auxiliary fixing part fixed to the end surface of the wiring board. Since the bonding area is large, the bonding strength is improved.
（２）上記（１）により、本発明の混成集積回路装置は
、リードの接合強度向上により、信頼度が向−ヒ安定す
るという効果が得られる。(2) Due to the above (1), the hybrid integrated circuit device of the present invention has the effect of stabilizing the reliability from one direction to another by improving the bonding strength of the leads.
（３）本発明の混成集積回路装置にあっては、リードは
配線基板の裏面に固定され、電子部品を実装する配線基
板の主面には固定されないため、配線基板の主面にはリ
ード固定領域を設ける必要もなくなり、その分電子部品
の実装領域として利用でき、配線基板の面積縮小、すな
わち配線基板の幅縮小化が図れ、混成集積回路装置の小
型化が達成できるという効果が得られる。(3) In the hybrid integrated circuit device of the present invention, the leads are fixed to the back surface of the wiring board and are not fixed to the main surface of the wiring board on which electronic components are mounted, so the leads are fixed to the main surface of the wiring board. There is no need to provide an area, which can be used as a mounting area for electronic components, and the area of the wiring board can be reduced, that is, the width of the wiring board can be reduced, and the effect that the size of the hybrid integrated circuit device can be achieved can be achieved.
（４）上記（３）により、本発明の混成集積回路装置は
配線基板の幅の縮小化により、マザーボードの挿入実装
時のマザーボードからの背の高さを低くでき、マザーボ
ードを利用して混成集積回路装置を組み込んだ電子機器
の小型化が達成できるという効果が得られる。(4) According to (3) above, the hybrid integrated circuit device of the present invention can reduce the height from the motherboard when the motherboard is inserted and mounted by reducing the width of the wiring board, and can perform hybrid integration using the motherboard. The effect is that electronic equipment incorporating the circuit device can be miniaturized.
（５）本発明のリードフレームは、配線基板に固定され
る固定部が配線基板の平坦面に固定される主固定部と、
配線基板の端面に固定される補助固定部と２箇所有して
いることから配線基板に対する接合強度を向上できると
いう効果が得られる。(5) In the lead frame of the present invention, the fixing part fixed to the wiring board has a main fixing part fixed to the flat surface of the wiring board;
Since there are two auxiliary fixing parts fixed to the end surface of the wiring board, it is possible to improve the bonding strength to the wiring board.
（６）本発明のリードフレームは、配線基板にリードを
固定する際、固定部は配線基板に弾力的に接触する構造
となっているため、リードの接合作業が容易かつ確実と
なるという効果が得られる。(6) The lead frame of the present invention has a structure in which the fixing portion elastically contacts the wiring board when fixing the leads to the wiring board, so that the lead joining work is easy and reliable. can get.
（７）上記（５）、 （６）により、本発明によれば
、リードの接合強度の高い混成集積回路装置を再現性よ
く製造できるため、歩留り向上により、製造コストの低
減が達成できるという効果が得られる。(7) As a result of (5) and (6) above, according to the present invention, a hybrid integrated circuit device with high lead bonding strength can be manufactured with good reproducibility, so that a reduction in manufacturing costs can be achieved through improved yield. is obtained.
（８）上記（１）〜（７）により、本発明によれば、マ
ザーボードへの実装高さが低くかつ信頼性が高い混成集
積回路装置を安価に提供できるという相乗効果が得られ
る。(8) According to the above (1) to (7), according to the present invention, a synergistic effect can be obtained in that a hybrid integrated circuit device that can be mounted on a motherboard at a low height and has high reliability can be provided at a low cost.
以上本発明者によってなされた発明を実施例に基づき具
体的に説明したが、本発明は一ヒ記実施例に限定される
ものではなく、その要旨を逸脱しない範囲で種々変更可
能であることはいうまでもない。たとえば、第７図に示
されるように、リード４の先端部を段付状に屈曲させ、
この段付部を補助固定部８とするとともに、その先端部
を主固定部７とする構造であってもリードの接合強度を
向上させることができる。Although the invention made by the present inventor has been specifically explained based on Examples above, the present invention is not limited to the Examples described above, and it is understood that various changes can be made without departing from the gist of the invention. Needless to say. For example, as shown in FIG. 7, the tip of the lead 4 is bent in a stepped shape,
Even with a structure in which this stepped part is used as the auxiliary fixing part 8 and the tip thereof is used as the main fixing part 7, the bonding strength of the leads can be improved.
以上の説明では主として本発明者によってなされた発明
をその背景となった利用分野である混成集積回路装置の
製造技術に適用した場合について説明したが、それに限
定されるものではない。In the above description, the invention made by the present inventor is mainly applied to the technology for manufacturing hybrid integrated circuit devices, which is the background field of application, but the invention is not limited thereto.
本発明は少なくとも板状物に棒材等を接続する技術には
適用できる。The present invention can be applied to at least a technique for connecting a bar or the like to a plate-like object.
本願において開示される発明のうち代表的なものによっ
て得られる効果を簡単に説明すれば、下記のとおりであ
る。A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.
本発明の混成集積回路装置は、配線基板に固定されるリ
ードは、配線基板の電子部品が搭載されない平坦な面に
対面して配線基板に固定される主固定部と、配線基板の
側面に対面して配線基板に固定される補助固定部と、を
有しているため、リードと配線基板との接続箇所は三箇
所となり、接合面積を大きくすることができることから
、リードの接合強度向上、換言すれば、混成集積回路装
置の信輔度向上が達成できるものであるIn the hybrid integrated circuit device of the present invention, the lead fixed to the wiring board has a main fixing part facing the flat surface of the wiring board on which no electronic components are mounted, and a main fixing part facing the side surface of the wiring board. Since it has an auxiliary fixing part that is fixed to the wiring board, there are three connection points between the leads and the wiring board, and the bonding area can be increased, which improves the bonding strength of the leads. By doing so, it is possible to improve the reliability of hybrid integrated circuit devices.
第１図は本発明の一実施例による混成集積回路装置の要
部を示す模式的断面図、
第２図は同じく混成集積回路装置の平面図、第３図は同
じくリード固定部を示す拡大斜視図、第４図は同じく混
成集積回路装置の組立に用いられるリードフレームの平
面図、
第５図は同じく断面図、
第６図は同じく配線基板にリードを接続する状態を示す
平面図、
第７図は同じく断面図、
第８図は本発明の他の実施例による模式図であ１・・・
マザーボード、２・・・配線基板、３・・・電子部品、
４・・・リード、５・・・半田、６・・・リード本体、
７・・・主固定部、８・・・補助固定部、９・・・矩形
部、１０．１１・・・リード取付パッド、１２・・・パ
ッケージ、１３・ ・ ・リード、１４・ ・ ・搭載
パッド、１５・・・半田、１６・・・導体層（メタライ
ズ層）、１７・・・チップコンデンサー、１８・・・リ
ードフレーム、１９．２０・・・枠片、２１・・・タイ
バー、２２．２３・・・ガイド孔、２４・・・クリンプ
１１１．１１１１
〜訃ぐ〜（翳＼蜀
＼Ｃ：″ＪＮFIG. 1 is a schematic sectional view showing the main parts of a hybrid integrated circuit device according to an embodiment of the present invention, FIG. 2 is a plan view of the same hybrid integrated circuit device, and FIG. 3 is an enlarged perspective view showing the lead fixing part. 4 is a plan view of a lead frame used for assembling a hybrid integrated circuit device, FIG. 5 is a cross-sectional view, FIG. 6 is a plan view showing a state in which leads are connected to a wiring board, and FIG. The figure is also a sectional view, and FIG. 8 is a schematic diagram according to another embodiment of the present invention.
Motherboard, 2... Wiring board, 3... Electronic components,
4...Lead, 5...Solder, 6...Lead body,
7... Main fixing part, 8... Auxiliary fixing part, 9... Rectangular part, 10.11... Lead attachment pad, 12... Package, 13... Lead, 14... Mounting Pad, 15...Solder, 16...Conductor layer (metallized layer), 17...Chip capacitor, 18...Lead frame, 19.20...Frame piece, 21...Tie bar, 22. 23...Guide hole, 24...Crimp 111.1111 ~Death~(翳＼蜀＼C:″JN
Claims (3)
してなる混成集積回路装置であって、前記リードは前記
配線基板の平坦な面に対面する主固定部と、前記配線基
板の側面に対面する補助固定部と、を有し、この主固定
部と補助固定部が接合体を介して配線基板に固定されて
いることを特徴とする混成集積回路装置。1. A hybrid integrated circuit device comprising leads fixed to edges of a wiring board on which electronic components are mounted, the leads having a main fixing part facing a flat surface of the wiring board and a side face of the wiring board. 1. A hybrid integrated circuit device comprising: an auxiliary fixing section; the main fixing section and the auxiliary fixing section are fixed to a wiring board via a bonded body.
板の側面は窪みを有し、前記補助固定部はその窪みの底
中央部に位置していることを特徴とする特許請求の範囲
第１項記載の混成集積回路装置。2. Claim 1, wherein the side surface of the wiring board to which the auxiliary fixing part of the lead is fixed has a recess, and the auxiliary fixing part is located at the center of the bottom of the recess. hybrid integrated circuit device.
ードを有するリードフレームであって、前記リードは配
線基板に固定される固定片として、配線基板の平坦な面
に対面する主固定部と、配線基板の側面に対面する補助
固定部と、を有していることを特徴とする混成集積回路
装置の製造に用いられるリードフレーム。3. A lead frame having a lead fixed to the edge of a wiring board on which electronic components are mounted, the lead serving as a fixed piece fixed to the wiring board, and a main fixing part facing a flat surface of the wiring board, and a wiring board. A lead frame used for manufacturing a hybrid integrated circuit device, comprising: an auxiliary fixing part facing a side surface of a substrate.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61035172A JPS62195159A (en) | 1986-02-21 | 1986-02-21 | Hybrid integrated circuit device and lead frame used for manufacture thereof |
| KR1019870001186A KR950006432B1 (en) | 1986-02-21 | 1987-02-13 | Hybrid intergrated circuit device and method of and lead facturing the same |
| US07/015,327 US4785533A (en) | 1986-02-21 | 1987-02-17 | Hybrid integrated circuit device, and method of and lead frame for use in manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61035172A JPS62195159A (en) | 1986-02-21 | 1986-02-21 | Hybrid integrated circuit device and lead frame used for manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62195159A true JPS62195159A (en) | 1987-08-27 |
Family
ID=12434436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61035172A Pending JPS62195159A (en) | 1986-02-21 | 1986-02-21 | Hybrid integrated circuit device and lead frame used for manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62195159A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010003858A (en) * | 2008-06-20 | 2010-01-07 | Sumitomo Electric Ind Ltd | Semiconductor device |
-
1986
- 1986-02-21 JP JP61035172A patent/JPS62195159A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010003858A (en) * | 2008-06-20 | 2010-01-07 | Sumitomo Electric Ind Ltd | Semiconductor device |
| JP4614107B2 (en) * | 2008-06-20 | 2011-01-19 | 住友電気工業株式会社 | Semiconductor device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100323052B1 (en) | Liquid crystal display device having an ic chip mounted on a narrow film wiring board | |
| JP3907145B2 (en) | Chip electronic components | |
| KR950006432B1 (en) | Hybrid intergrated circuit device and method of and lead facturing the same | |
| US5446317A (en) | Single in-line package for surface mounting | |
| JPS62113452A (en) | Power semiconductor device | |
| EP0513743B1 (en) | Semiconductor package for surface mounting | |
| JPH02260450A (en) | Semiconductor device and its mounting | |
| JPH03295266A (en) | High integrated semiconductor device | |
| JPS62195159A (en) | Hybrid integrated circuit device and lead frame used for manufacture thereof | |
| JPS62262447A (en) | Semiconductor package and mounting thereof | |
| JP2624742B2 (en) | Hybrid integrated circuit device and lead frame | |
| JP2001126950A (en) | Chip-type electronic component | |
| JPS62195160A (en) | Manufacture of hybrid integrated circuit device and lead frame used for manufacture thereof | |
| JP2731584B2 (en) | Lead frame and method of manufacturing electronic component package using the same | |
| JP3229068B2 (en) | TAB film and semiconductor device using the TAB film | |
| JPH0739260Y2 (en) | Hybrid integrated circuit device | |
| JP2530783Y2 (en) | Chip component mounting structure | |
| JPH01161707A (en) | Chip component | |
| JP2002252304A (en) | Semiconductor device and support substrate used therefor | |
| JP2777114B2 (en) | Tape carrier | |
| JPH01273384A (en) | Integrated circuit device | |
| JPH07147368A (en) | Semiconductor integrated circuit device and its mounting structure | |
| JPH09139440A (en) | Chip scale package | |
| JPH0710969U (en) | Printed board | |
| JPS63160320A (en) | Thin electric component |