JPS62193729U - - Google Patents

Info

Publication number
JPS62193729U
JPS62193729U JP8329586U JP8329586U JPS62193729U JP S62193729 U JPS62193729 U JP S62193729U JP 8329586 U JP8329586 U JP 8329586U JP 8329586 U JP8329586 U JP 8329586U JP S62193729 U JPS62193729 U JP S62193729U
Authority
JP
Japan
Prior art keywords
land portion
large area
semiconductor pellet
view
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8329586U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8329586U priority Critical patent/JPS62193729U/ja
Publication of JPS62193729U publication Critical patent/JPS62193729U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Description

【図面の簡単な説明】
第１図は本考案の第１の実施例を示す樹脂モー
ルド直前のリードフレームの平面図、第２図は第
１図に示すリードフレームの要部を拡大して示す
部分平面図である。第３図は本考案の第２の実施
例を示すリードフレームの要部を拡大して示す部
分平面図、第４図及び第５図は第３の実施例を示
し、第４図はリードフレームの要部を示す部分平
面図、第５図は第４図のＡ―Ａ線に沿う断面図で
ある。第６図及び第７図は第４の実施例を示し、
第６図はリードフレームの要部を示す部分平面図
、第７図は第６図のＢ―Ｂ線に沿う断面図である
。第８図は、第５の実施例のリードフレームの要
部を示す部分平面図である。第９図は従来のコン
デンサ内蔵型ＩＣの樹脂モールド工程直前の状態
を示すリードフレームの平面図、第１０図は第９
図に示す状態から完成されたＩＣの斜視図である
。 １１……リードフレーム、１１ａ……ランド部
、１１ｂ……リード、１１ｂ―１４……電源供給
用のリード、１１ｃ……釣りピン、１１ｄ……タ
イバー、１２，１３，１８，２４……大面積部分
、１４……連結部、１５……半導体ペレツト、１
６……金属細線、１７……チツプコンデンサ。

Claims (1)

  1. 【実用新案登録請求の範囲】 パツケージ内に、釣りピンによつて支持された
    ランド部、ランド部を囲むように配置された複数
    のリード、ランド部に載置・固定された半導体ペ
    レツト、半導体ペレツトと上記各リードを電気的
    に接続する金属細線、およびチツプ部品を封入し
    たものにおいて、 上記リードのうち電源供給用のリードと釣りピ
    ンの隣接部分にそれぞれ大面積部分を設け、この
    大面積部分に股がつてチツプ部品を載置固定した
    ことを特徴とする半導体装置。
JP8329586U 1986-05-30 1986-05-30 Pending JPS62193729U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8329586U JPS62193729U (ja) 1986-05-30 1986-05-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8329586U JPS62193729U (ja) 1986-05-30 1986-05-30

Publications (1)

Publication Number Publication Date
JPS62193729U true JPS62193729U (ja) 1987-12-09

Family

ID=30936750

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8329586U Pending JPS62193729U (ja) 1986-05-30 1986-05-30

Country Status (1)

Country Link
JP (1) JPS62193729U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003037239A (ja) * 2001-07-24 2003-02-07 Sanyo Electric Co Ltd 半導体装置およびその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5954249A (ja) * 1982-09-22 1984-03-29 Fujitsu Ltd 半導体装置
JPS5972757A (ja) * 1982-10-20 1984-04-24 Fujitsu Ltd 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5954249A (ja) * 1982-09-22 1984-03-29 Fujitsu Ltd 半導体装置
JPS5972757A (ja) * 1982-10-20 1984-04-24 Fujitsu Ltd 半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003037239A (ja) * 2001-07-24 2003-02-07 Sanyo Electric Co Ltd 半導体装置およびその製造方法
JP4618941B2 (ja) * 2001-07-24 2011-01-26 三洋電機株式会社 半導体装置

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