JPS62192648U - - Google Patents

Info

Publication number
JPS62192648U
JPS62192648U JP1986079682U JP7968286U JPS62192648U JP S62192648 U JPS62192648 U JP S62192648U JP 1986079682 U JP1986079682 U JP 1986079682U JP 7968286 U JP7968286 U JP 7968286U JP S62192648 U JPS62192648 U JP S62192648U
Authority
JP
Japan
Prior art keywords
semiconductor chip
bonding pad
recess
chip component
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986079682U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986079682U priority Critical patent/JPS62192648U/ja
Publication of JPS62192648U publication Critical patent/JPS62192648U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1986079682U 1986-05-27 1986-05-27 Pending JPS62192648U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986079682U JPS62192648U (fr) 1986-05-27 1986-05-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986079682U JPS62192648U (fr) 1986-05-27 1986-05-27

Publications (1)

Publication Number Publication Date
JPS62192648U true JPS62192648U (fr) 1987-12-08

Family

ID=30929776

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986079682U Pending JPS62192648U (fr) 1986-05-27 1986-05-27

Country Status (1)

Country Link
JP (1) JPS62192648U (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008130618A (ja) * 2006-11-16 2008-06-05 Murata Mfg Co Ltd 多層配線基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008130618A (ja) * 2006-11-16 2008-06-05 Murata Mfg Co Ltd 多層配線基板

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