JPS6219070B2 - - Google Patents
Info
- Publication number
- JPS6219070B2 JPS6219070B2 JP56172925A JP17292581A JPS6219070B2 JP S6219070 B2 JPS6219070 B2 JP S6219070B2 JP 56172925 A JP56172925 A JP 56172925A JP 17292581 A JP17292581 A JP 17292581A JP S6219070 B2 JPS6219070 B2 JP S6219070B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- epoxy resin
- acid ester
- boric acid
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56172925A JPS5875857A (ja) | 1981-10-30 | 1981-10-30 | 樹脂封止型半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56172925A JPS5875857A (ja) | 1981-10-30 | 1981-10-30 | 樹脂封止型半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5875857A JPS5875857A (ja) | 1983-05-07 |
| JPS6219070B2 true JPS6219070B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-04-25 |
Family
ID=15950890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56172925A Granted JPS5875857A (ja) | 1981-10-30 | 1981-10-30 | 樹脂封止型半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5875857A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2574434B2 (ja) * | 1988-11-14 | 1997-01-22 | 日東電工株式会社 | 半導体装置 |
| US5378928A (en) * | 1993-04-27 | 1995-01-03 | Motorola, Inc. | Plastic encapsulated microelectronic device and method |
| JP3308397B2 (ja) * | 1994-07-07 | 2002-07-29 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物 |
| CN109679045B (zh) * | 2018-12-27 | 2022-04-12 | 山东圣泉新材料股份有限公司 | 一种轮胎橡胶用新型绿色补强树脂及其组合物 |
-
1981
- 1981-10-30 JP JP56172925A patent/JPS5875857A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5875857A (ja) | 1983-05-07 |