JPS62186435U - - Google Patents

Info

Publication number
JPS62186435U
JPS62186435U JP1986075191U JP7519186U JPS62186435U JP S62186435 U JPS62186435 U JP S62186435U JP 1986075191 U JP1986075191 U JP 1986075191U JP 7519186 U JP7519186 U JP 7519186U JP S62186435 U JPS62186435 U JP S62186435U
Authority
JP
Japan
Prior art keywords
substrate
sub
electronic components
pattern
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986075191U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986075191U priority Critical patent/JPS62186435U/ja
Publication of JPS62186435U publication Critical patent/JPS62186435U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案の集積回路の第１実施例の要
部断面図、第２図は同上集積回路の第２実施例の
要部断面図である。 １０……基板、１１……導体パターン、１２…
…印刷抵抗（電子部品）、１３……コンデンサチ
ツプ（電子部品）、１４……副基板、１６……副
導体パターン、１７……パワートランジスタチツ
プ（大電流消費型の電子部品）、１８……ヒート
シンク。 FIG. 1 is a sectional view of a main part of a first embodiment of the integrated circuit of this invention, and FIG. 2 is a sectional view of a main part of a second embodiment of the same integrated circuit. 10...Substrate, 11...Conductor pattern, 12...
...Printed resistor (electronic component), 13... Capacitor chip (electronic component), 14... Sub-board, 16... Sub-conductor pattern, 17... Power transistor chip (large current consuming electronic component), 18... heat sink.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 導体パターンおよび印刷抵抗、コンデンサチツ
プ等の電子部品を形成した基板と、この基板の裏
面側に配置され導電性の良い副導体パターンを形
成した熱伝導の良い副基板と、この副基板の前記
副導対パターンに載置したパワートランジスタチ
ツプ等の大電流消費型の電子部品とから成ること
を特徴とする集積回路。 A substrate with conductor patterns and electronic components such as printed resistors and capacitor chips formed thereon, a sub-substrate with good thermal conductivity arranged on the back side of this substrate and with a sub-conductor pattern with good conductivity formed thereon, and the sub-substrate of this sub-substrate. An integrated circuit characterized by comprising large current consuming electronic components such as power transistor chips mounted on a conductive pair pattern.
JP1986075191U 1986-05-19 1986-05-19 Pending JPS62186435U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986075191U JPS62186435U (en) 1986-05-19 1986-05-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986075191U JPS62186435U (en) 1986-05-19 1986-05-19

Publications (1)

Publication Number Publication Date
JPS62186435U true JPS62186435U (en) 1987-11-27

Family

ID=30921105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986075191U Pending JPS62186435U (en) 1986-05-19 1986-05-19

Country Status (1)

Country Link
JP (1) JPS62186435U (en)

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