JPS62184765U - - Google Patents
Info
- Publication number
- JPS62184765U JPS62184765U JP1986072426U JP7242686U JPS62184765U JP S62184765 U JPS62184765 U JP S62184765U JP 1986072426 U JP1986072426 U JP 1986072426U JP 7242686 U JP7242686 U JP 7242686U JP S62184765 U JPS62184765 U JP S62184765U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- chip
- diode device
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986072426U JPS62184765U (enExample) | 1986-05-13 | 1986-05-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986072426U JPS62184765U (enExample) | 1986-05-13 | 1986-05-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62184765U true JPS62184765U (enExample) | 1987-11-24 |
Family
ID=30915859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986072426U Pending JPS62184765U (enExample) | 1986-05-13 | 1986-05-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62184765U (enExample) |
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1986
- 1986-05-13 JP JP1986072426U patent/JPS62184765U/ja active Pending