JPS62177166A - レ−ザ溶射法 - Google Patents

レ−ザ溶射法

Info

Publication number
JPS62177166A
JPS62177166A JP61018980A JP1898086A JPS62177166A JP S62177166 A JPS62177166 A JP S62177166A JP 61018980 A JP61018980 A JP 61018980A JP 1898086 A JP1898086 A JP 1898086A JP S62177166 A JPS62177166 A JP S62177166A
Authority
JP
Japan
Prior art keywords
sprayed
laser beam
thermal spraying
spraying method
mirror
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61018980A
Other languages
English (en)
Japanese (ja)
Other versions
JPS642187B2 (enExample
Inventor
Akihiro Uchiumi
内海　明博
Munehide Katsumura
宗英 勝村
Jun Matsuda
純 松田
Shigeyuki Nagata
永田　重幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP61018980A priority Critical patent/JPS62177166A/ja
Publication of JPS62177166A publication Critical patent/JPS62177166A/ja
Publication of JPS642187B2 publication Critical patent/JPS642187B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/34—Laser welding for purposes other than joining

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Coating By Spraying Or Casting (AREA)
JP61018980A 1986-01-30 1986-01-30 レ−ザ溶射法 Granted JPS62177166A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61018980A JPS62177166A (ja) 1986-01-30 1986-01-30 レ−ザ溶射法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61018980A JPS62177166A (ja) 1986-01-30 1986-01-30 レ−ザ溶射法

Publications (2)

Publication Number Publication Date
JPS62177166A true JPS62177166A (ja) 1987-08-04
JPS642187B2 JPS642187B2 (enExample) 1989-01-13

Family

ID=11986760

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61018980A Granted JPS62177166A (ja) 1986-01-30 1986-01-30 レ−ザ溶射法

Country Status (1)

Country Link
JP (1) JPS62177166A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01215961A (ja) * 1988-02-24 1989-08-29 Agency Of Ind Science & Technol レーザ溶射法
FR2642673A1 (fr) * 1989-02-08 1990-08-10 Gen Electric Tuyere de pulverisation a laser a ecoulement transversal et procede correspondant
JPH05271898A (ja) * 1992-02-17 1993-10-19 Ind Technol Res Inst 射出成形機における噴射スクリューの表面処理方法
FR2743819A1 (fr) * 1996-01-19 1997-07-25 Deutsche Forsch Luft Raumfahrt Dispositif d'application d'un revetement de poudre
WO1998032891A1 (en) * 1995-05-23 1998-07-30 Mcdonnell Douglas Corporation Method and apparatus for coating a substrate
US5814152A (en) * 1995-05-23 1998-09-29 Mcdonnell Douglas Corporation Apparatus for coating a substrate
JP2002544387A (ja) * 1999-05-05 2002-12-24 オプトメック・デザイン・カンパニー 高精度スプレーおよびレーザー照射を用いた直接書き込みプロセスでの電子部品製造

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61163258A (ja) * 1985-01-11 1986-07-23 Shinagawa Refract Co Ltd レ−ザ溶射方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61163258A (ja) * 1985-01-11 1986-07-23 Shinagawa Refract Co Ltd レ−ザ溶射方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01215961A (ja) * 1988-02-24 1989-08-29 Agency Of Ind Science & Technol レーザ溶射法
US4947463A (en) * 1988-02-24 1990-08-07 Agency Of Industrial Science & Technology Laser spraying process
FR2642673A1 (fr) * 1989-02-08 1990-08-10 Gen Electric Tuyere de pulverisation a laser a ecoulement transversal et procede correspondant
JPH02247369A (ja) * 1989-02-08 1990-10-03 General Electric Co <Ge> 交差流れレーザ溶射ノズル
JPH05271898A (ja) * 1992-02-17 1993-10-19 Ind Technol Res Inst 射出成形機における噴射スクリューの表面処理方法
WO1998032891A1 (en) * 1995-05-23 1998-07-30 Mcdonnell Douglas Corporation Method and apparatus for coating a substrate
US5814152A (en) * 1995-05-23 1998-09-29 Mcdonnell Douglas Corporation Apparatus for coating a substrate
FR2743819A1 (fr) * 1996-01-19 1997-07-25 Deutsche Forsch Luft Raumfahrt Dispositif d'application d'un revetement de poudre
JP2002544387A (ja) * 1999-05-05 2002-12-24 オプトメック・デザイン・カンパニー 高精度スプレーおよびレーザー照射を用いた直接書き込みプロセスでの電子部品製造

Also Published As

Publication number Publication date
JPS642187B2 (enExample) 1989-01-13

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term