JPS62174940A - ウエハとリングの自動貼合せ装置 - Google Patents

ウエハとリングの自動貼合せ装置

Info

Publication number
JPS62174940A
JPS62174940A JP61018699A JP1869986A JPS62174940A JP S62174940 A JPS62174940 A JP S62174940A JP 61018699 A JP61018699 A JP 61018699A JP 1869986 A JP1869986 A JP 1869986A JP S62174940 A JPS62174940 A JP S62174940A
Authority
JP
Japan
Prior art keywords
wafer
ring
tape
stand
adhesive tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61018699A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0137850B2 (enrdf_load_stackoverflow
Inventor
Saburo Miyamoto
三郎 宮本
Hide Izumida
秀 和泉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP61018699A priority Critical patent/JPS62174940A/ja
Publication of JPS62174940A publication Critical patent/JPS62174940A/ja
Publication of JPH0137850B2 publication Critical patent/JPH0137850B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
JP61018699A 1986-01-28 1986-01-28 ウエハとリングの自動貼合せ装置 Granted JPS62174940A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61018699A JPS62174940A (ja) 1986-01-28 1986-01-28 ウエハとリングの自動貼合せ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61018699A JPS62174940A (ja) 1986-01-28 1986-01-28 ウエハとリングの自動貼合せ装置

Publications (2)

Publication Number Publication Date
JPS62174940A true JPS62174940A (ja) 1987-07-31
JPH0137850B2 JPH0137850B2 (enrdf_load_stackoverflow) 1989-08-09

Family

ID=11978878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61018699A Granted JPS62174940A (ja) 1986-01-28 1986-01-28 ウエハとリングの自動貼合せ装置

Country Status (1)

Country Link
JP (1) JPS62174940A (enrdf_load_stackoverflow)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0281456A (ja) * 1988-09-16 1990-03-22 Nitto Denko Corp 保護フィルムの剥離方法
JPH0287546A (ja) * 1988-09-22 1990-03-28 Nitto Denko Corp 保護フイルムの貼付方法
US5688354A (en) * 1993-12-31 1997-11-18 Samsung Electronics Co., Ltd. Method for adhering masking film
US7080675B2 (en) * 2003-11-12 2006-07-25 Nitto Denko Corporation Method and apparatus for joining adhesive tape to back face of semiconductor wafer
US7118645B2 (en) * 2003-10-07 2006-10-10 Nitto Denko Corporation Method and apparatus for joining protective tape to semiconductor wafer
JP2007214496A (ja) * 2006-02-13 2007-08-23 Tokyo Seimitsu Co Ltd ウェーハ処理装置
US7833367B2 (en) 2006-10-20 2010-11-16 Nitto Denko Corporation Adhesive tape cutting method and apparatus using the same
US7984737B2 (en) 2006-09-20 2011-07-26 Nitto Denko Corporation Adhesive tape cutting method and adhesive tape joining apparatus using the same
WO2020066285A1 (ja) * 2018-09-28 2020-04-02 三星ダイヤモンド工業株式会社 ウェーハ分断装置、反転装置、および搬送システム

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0281456A (ja) * 1988-09-16 1990-03-22 Nitto Denko Corp 保護フィルムの剥離方法
JPH0287546A (ja) * 1988-09-22 1990-03-28 Nitto Denko Corp 保護フイルムの貼付方法
US5688354A (en) * 1993-12-31 1997-11-18 Samsung Electronics Co., Ltd. Method for adhering masking film
US7118645B2 (en) * 2003-10-07 2006-10-10 Nitto Denko Corporation Method and apparatus for joining protective tape to semiconductor wafer
US7080675B2 (en) * 2003-11-12 2006-07-25 Nitto Denko Corporation Method and apparatus for joining adhesive tape to back face of semiconductor wafer
JP2007214496A (ja) * 2006-02-13 2007-08-23 Tokyo Seimitsu Co Ltd ウェーハ処理装置
US7984737B2 (en) 2006-09-20 2011-07-26 Nitto Denko Corporation Adhesive tape cutting method and adhesive tape joining apparatus using the same
US7833367B2 (en) 2006-10-20 2010-11-16 Nitto Denko Corporation Adhesive tape cutting method and apparatus using the same
WO2020066285A1 (ja) * 2018-09-28 2020-04-02 三星ダイヤモンド工業株式会社 ウェーハ分断装置、反転装置、および搬送システム
KR20210066759A (ko) * 2018-09-28 2021-06-07 미쓰보시 다이야몬도 고교 가부시키가이샤 웨이퍼 분단 장치, 반전 장치, 및 반송 시스템
JPWO2020066285A1 (ja) * 2018-09-28 2021-08-30 三星ダイヤモンド工業株式会社 ウェーハ分断装置、反転装置、および搬送システム
TWI809155B (zh) * 2018-09-28 2023-07-21 日商三星鑽石工業股份有限公司 晶圓分斷裝置、反轉裝置及搬運系統

Also Published As

Publication number Publication date
JPH0137850B2 (enrdf_load_stackoverflow) 1989-08-09

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