JPS6217383B2 - - Google Patents
Info
- Publication number
- JPS6217383B2 JPS6217383B2 JP54070646A JP7064679A JPS6217383B2 JP S6217383 B2 JPS6217383 B2 JP S6217383B2 JP 54070646 A JP54070646 A JP 54070646A JP 7064679 A JP7064679 A JP 7064679A JP S6217383 B2 JPS6217383 B2 JP S6217383B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead
- lead frame
- lead terminal
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 23
- 238000005520 cutting process Methods 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 5
- 239000000470 constituent Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 description 16
- 229920005989 resin Polymers 0.000 description 16
- 238000007789 sealing Methods 0.000 description 8
- 238000000465 moulding Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 1
- 238000007730 finishing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7064679A JPS55163867A (en) | 1979-06-07 | 1979-06-07 | Lead frame for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7064679A JPS55163867A (en) | 1979-06-07 | 1979-06-07 | Lead frame for semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55163867A JPS55163867A (en) | 1980-12-20 |
JPS6217383B2 true JPS6217383B2 (ko) | 1987-04-17 |
Family
ID=13437615
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7064679A Granted JPS55163867A (en) | 1979-06-07 | 1979-06-07 | Lead frame for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55163867A (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02205349A (ja) * | 1989-02-03 | 1990-08-15 | Fujitsu Miyagi Electron:Kk | 半導体装置の製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5037362A (ko) * | 1973-08-06 | 1975-04-08 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5277654U (ko) * | 1975-12-09 | 1977-06-09 |
-
1979
- 1979-06-07 JP JP7064679A patent/JPS55163867A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5037362A (ko) * | 1973-08-06 | 1975-04-08 |
Also Published As
Publication number | Publication date |
---|---|
JPS55163867A (en) | 1980-12-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3444410B2 (ja) | リードフレームおよび半導体装置の製造方法 | |
KR0179920B1 (ko) | 칩 사이즈 패키지의 제조방법 | |
KR0141952B1 (ko) | 반도체 패키지 및 그 제조방법 | |
JPS6217383B2 (ko) | ||
JPS60180126A (ja) | 半導体装置の製造方法 | |
JPH08172153A (ja) | 半導体装置のリード加工方法及びリード加工用金型 | |
JPH0574999A (ja) | 半導体装置及びその製造方法 | |
JP3036339B2 (ja) | 半導体装置 | |
JPS63131557A (ja) | レジン封止型半導体装置用リ−ドフレ−ム及びレジン封止型半導体装置 | |
JPS60164345A (ja) | リ−ドフレ−ムの製造方法 | |
JP2661152B2 (ja) | Icカード用モジュールの製造方法 | |
JPH05218508A (ja) | 光半導体装置の製造方法 | |
JPH07153892A (ja) | リードフレーム | |
JP2997182B2 (ja) | 面実装用樹脂封止半導体装置 | |
JP2752803B2 (ja) | 半導体装置の製造方法 | |
JPS6223094Y2 (ko) | ||
KR920006185B1 (ko) | 접합형 리드 프레임을 사용한 ic 제조방법 | |
JPH03175658A (ja) | 樹脂封止型半導体装置及びその製造方法 | |
KR100641512B1 (ko) | 반도체 패키지 공정에서의 리드 프레임 구조 | |
JPS61150246A (ja) | 半導体装置 | |
JP2946775B2 (ja) | 樹脂封止金型 | |
JPS6144435Y2 (ko) | ||
JPH08227961A (ja) | 半導体装置用リードフレームおよびその製造方法 | |
JPH029156A (ja) | 半導体装置の製造方法 | |
JPH03131058A (ja) | 半導体装置用リードフレーム |