JPS62171186A - Hybrid ic - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] Industrial Application Field This invention relates to a hybrid IC (hybrid integrated circuit) used in various electrical equipment and various control devices for automobiles, etc.
In particular, it relates to a hybrid IC in which a conductive film with a predetermined pattern is formed on a substrate using an ACt/Pd-based conductive paste.

Conventional technology When manufacturing a hybrid IC (hereinafter abbreviated as "HIC"), for example, as shown in Fig. 4, alumina,
After printing a conductive paste according to a predetermined pattern by screen printing or the like on a substrate 1 made of S I C, i or Aj2N, the conductive paste is fired to form a conductive pattern film 2 in a predetermined pattern. After that, a solder paste is printed at a predetermined soldering position, and then the functional component 3 is mounted, and the board 1 is, for example, 200~
The solder paste is melted by heating to about 250'C for about 2 to 10 seconds, and the functional component and the conductive pattern film 2 are bonded using the solder 4.

The conductive paste used to form the conductive pattern film in the manufacture of such HICs is made by dispersing and kneading noble metal or base metal conductive component powder in a dispersion medium in which a resin is dissolved in a fine solvent. Pastes include Ag-based, Ag/Pd-based, Ag/Pt-based, and 〇/Pd/P.
There are t-based, Au-based, etc., and base metal-based conductor pastes include Ni-based, Cu-based, W-based, etc. From these, it is normal to select and use the most suitable conductor paste in terms of usage conditions, manufacturing conditions, cost, etc., but at present, AQ/Pd-based conductor pastes are the most widely used. It is used.

Problems Solved by the Invention In the Ag/Pd-based conductor paste as described above, the component ratio of AQ and Pd as conductive components is AQ90:
From those with a high Ag/Pd ratio of about Pd1O to Ag65:P
Products with a wide range of component ratios are commercially available, including products with Ag/Pd ratios as low as d35.

When using such an Ag/Pd-based conductive paste, there are two extremely important issues: solder wettability and migration resistance.

That is, first of all, solderability indicates the ease with which solder adheres when lead wires and various functional components are soldered onto a conductive pattern film of a predetermined pattern.-1 Solder is easy to solder to Ag. However, since it is difficult to solder to Pd, the less Pd there is in the Ag/Pd-based conductor paste 1~, that is, the higher the Ag/Pd ratio, the more difficult it is to solder the conductive pattern film formed by the AQ/Pd-based conductor paste. This results in excellent wettability. Furthermore, such excellent solderability means that soldering can be performed in a shorter time and with higher reliability. Conversely, if the AQ/Pd-based conductor paste contains a large amount of Pd, that is, if the Ag/Pd ratio is low, it becomes difficult to solder and the reliability decreases. Therefore, from the viewpoint of soldering in HIC manufacturing, it is advantageous to use a conductor paste with a low Pd content, that is, a high AQ/Pd ratio.

On the other hand, migration resistance refers to the migration phenomenon (migration) of conductive metal caused by electrochemical dissolution and precipitation of the conductive metal of the conductive pattern film on the surface of the substrate during use (when voltage is applied). This refers to durability against short-circuit phenomena, and Ag tends to cause migration, while Pd tends to be less likely to cause migration. Therefore Ag/Pd
In a conductive pattern film using a system paste, the more Pd there is, that is, the lower the Ag/Pd ratio, the less migration occurs, and it becomes possible to obtain high reliability as an HIC circuit. On the other hand, the lower the Pd ratio, that is, the higher the AQ/Pd ratio, the more likely migration will occur, resulting in a lack of reliability when using HIC.

As mentioned above, the solderability and migration resistance when using Ag/Pd-based conductor paste are
There is a conflict with the component ratio (△Ω/Pd ratio) of AO and Pd, which are necessary conductive components in the paste of the d-based conductor.
To improve solderability, increasing the Ag/Pd ratio will lower migration resistance, and conversely, lowering the AQ/Pd ratio to improve migration resistance will result in decreased solderability. . Therefore, in the past, one or the other was sacrificed, considering the installation conditions and usage conditions, or
The reality is that we had no choice but to compromise on both performances to some extent.

This invention was made against the background of the above circumstances, and
In HIC using g/Pd-based conductor paste,
By simultaneously resolving the conflicting issues mentioned above, we have made it possible to easily perform highly reliable soldering on conductive pattern films, while at the same time achieving good migration resistance, thereby achieving high productivity and high reliability HIC. The purpose is to provide the following.

Means for Solving the Problems In this invention, two types of l/Pd-based conductor pastes with different component ratios of AO and Pd (AQ/Pd ratio) are used for A to form a conductive pattern film. This method solves the contradictory problems mentioned above at the same time.

That is, the present invention provides a hybrid IC in which a conductive pattern film of a predetermined pattern is formed on a substrate using an Ag/Pd-based conductive paste, in which the conductive component of the paste A is Ag/Pd
Two types of conductor pastes with different ratios are used, and among the conductive pattern films, the soldering part is formed with an Ag/Pd-based conductor paste with a high Ag/Pq ratio, and the other parts are formed with an Ag/Pd-based conductor paste with a high Ag/Pd ratio. It is characterized by being formed by a low A Cl / P d photoconductor paste.

Function: In the HIC of the present invention, soldering is not performed on the conductive pattern film formed on the substrate, such as the part to which functional components are soldered or the external electrode part to which an external lead wire is soldered. The soldered portion (soldered portion) is formed using an Ag/Pd based conductor paste with a high Ag/Pd ratio. On the other hand, the portion of the conductive pattern film that is not soldered, that is, the so-called circuit pattern portion, is formed using an Ag/Pd based conductive paste with a low AQ/Pd ratio.

As already mentioned, Ag has excellent solderability, whereas Pd has poor solderability. Therefore Ag/Pd
An Ag/Pd based conductor paste with a high ratio has better solderability than one with a low Ag/Pd ratio. Since Ag/Pd conductor paste 1~ with good solderability and a high AQ/Pd ratio is used in the conductive pattern film of the soldering part, it is easy to use when soldering functional parts, external lead wires, etc. can be easily soldered in a short time,
High productivity and reliability can be obtained.

On the other hand, Ag has poor migration resistance, but Pd has excellent migration resistance. Therefore, Ag/Pd-based conductor pastes with a low Ag/Pd ratio have better migration resistance than those with a high Ag/Pd ratio. . Since Ag/Pd-based conductor paste with a low Ag/Pd ratio and good migration resistance is used in the circuit pattern parts other than the soldered parts, the migration resistance of the circuit pattern parts is excellent. .

Here, a conductive paste with a high Ag/Pd ratio and poor migration resistance is used for the soldering part, but since the soldering part is covered with solder,
There are almost no migration problems, so H
Migration resistance as an IC is determined by the performance of the conductive paste in the circuit pattern portions other than the soldered portions.

Therefore, as described above, in the present invention, since the migration resistance of the circuit pattern portion other than the soldered portion is good, the migration resistance of the HIC as a whole is also good. Since the migration resistance is excellent in this way, there is little risk of short circuits occurring between circuits during use, and an HIC with excellent durability can be obtained.

As described above, among the conductive pattern films formed on the substrate, two types of Ag/P with different Ag/Pd ratios are used depending on the soldering part and the other circuit pattern parts.
By using d-type conductor paste separately, it is possible to solve both the soldering problem and the problem caused by microclision at the same time.

Here, two types of A with different Ag/Pd ratios as described above are used.
When using different g/Pd based conductor pastes, it is preferable that the proportions of Pd/(ACl+Pd) in the two types of pastes differ by 5% or more in weight percent. This is because if the difference is less than 5%, the above-mentioned effect of using different pastes cannot be obtained significantly.

Or Ag/Pd with a high Ag/Pd ratio used in the soldering part.
As the Pd-based conductor paste, it is preferable to use one in which the ratio of Pd/(AQ+Pd) is 20% or less by weight. On the other hand, as for Ag/Pd-based conductor paste with a low Ag/Pd ratio used for circuit pattern parts other than soldered parts, the ratio of Pd/(ACl+Pd) is 15% by weight.
It is preferable to use the above.

Example FIG. 1 schematically shows an example of an HIC according to the present invention.

In FIG. 1, the substrate 1 has a thickness of, for example, 0.635 m~
It must be made of 96% alumina of about 1 /al/j, and on this substrate 1, there is a conductive pattern film 21 as a conductive pattern film 2 constituting the soldering part and a circuit pattern part other than the soldering part. A conductive pattern film 22 is formed which constitutes the latter conductive pattern +15!
The end of the conductive pattern film 22 overlaps the end of the former conductive pattern film 21. The conductive pattern film 21 constituting the soldering part of the former is formed using a conductive paste consisting of AQ/Pd-based conductor paste 1 with a high Ag/Pd ratio to conductive components of, for example, 90 parts by weight of Ag and 10 parts by weight of PD; Conductive pattern II that constitutes the circuit pattern part! 2
2 is constructed using an Ag/Pd based conductive paste with a low Ag/Pd ratio, for example a conductive paste consisting of conductive components of 75 parts by weight of Ag and 25 parts by weight of Pd. For example, a functional component 3 is mounted near the conductive pattern film 21 constituting the former soldering portion, and the functional component 3 is soldered to the conductive pattern film 21 with solder 4.

Note that the substrate 1 is made of alumina SiC.

Of course, ceramic such as AJ2N or enamel may also be used.

Next, an example of a method for manufacturing the HIC shown in FIG. 1 will be described with reference to FIGS. 2(A) to 2(E).

First, alumina, SiC, Al as shown in Figure 2 (A>
A substrate 1 made of N1 or a hollow plate is prepared. Next, apply Ag/Pd based conductor paste to the upper surface of the board 1 where the functional components are to be soldered.
A paste with a high /Pd ratio is screen printed and fired,
A soldering portion conductor pattern film 21 is formed as shown in FIG. 2(B). After that, Ag/Pd
A system conductor paste having a low Ag/Pd ratio is screen printed and fired to form a circuit pattern part conductor pattern film 22 as shown in FIG. 2(C). Next, as shown in FIG. 2<D>, a solder paste 4a is screen printed on the portion of the soldering portion conductor pattern film 21 to be soldered. After that, after mounting the functional component 3 as shown in FIG. be attached.

In addition to the above-mentioned steps, the actual manufacturing of HICs involves forming a thick film resistor by printing and baking a resistor paste, forming an over glass, a crossover glass,
Although sealing with a sealing resin is performed, these steps can be carried out in the same manner as those using conventional techniques.

- Furthermore, in the above-mentioned manufacturing method example, an Ag/Pd-based conductor paste with a high AQ/Pd ratio for the soldering part is printed, baked, and then the Ag/Pd-based conductor paste for the circuit pattern part is printed.
Although Ag/Pd-based conductor paste with a low d ratio is printed and fired, the soldering part has a high Ag/Pd ratio.
After printing g/Pd based conductor paste, 120°c-c-i
After drying for approximately 0 minutes, an Ag/Pd based conductive paste with a low Ag/Pd ratio for the circuit pattern portion may be printed before firing the conductive paste.

FIG. 3 shows another example of the HIC according to the present invention.

In this example, a soldering part made of an Ag/Pd based conductive paste with a high Ag/Pd ratio is placed on the edge of a circuit pattern part conductive pattern film 22 made of an Ag/Pd based conductive paste with a low Ag/Pd ratio. The ends of the pattern film 21 overlap.

In this case, contrary to the above-mentioned manufacturing method example, A
Printing/printing Ac+/Pd based conductor paste with low g/Pd ratio
After baking to form the circuit pattern portion conductor pattern film 22, an Ag/Pd based conductor paste with a high Ag/Pd ratio is printed and baked to form the soldering portion conductor pattern 11*21.

Note that when manufacturing a HIC as shown in Figure 3, after printing an Ag/Pd-based conductor paste with a low Ag/Pd ratio for the circuit pattern portion, only drying is performed without baking, and then soldering is performed. Ag/P with high Ag/Pd ratio for attachment parts
A d-type conductor paste may be printed.

In manufacturing the HIC of this invention, the printing process of conductor paste is increased by one step compared to the conventional technology, but normally in the entire manufacturing process of HIC, conductor paste 1~
, resistor paste 1-, glass paste, dielectric paste, solder paste 1-, etc., are required to be printed 5 to 20 times, so the increase in the number of printing processes by this invention improves overall productivity. It has very little effect on the decrease in

Effects of the Invention In the HIC of the present invention, the part of the conductive pattern film on the substrate that is soldered to components, external lead wires, etc. is made of Ag/Pd-based conductive paste, especially A.
Since a conductive paste with excellent solderability and high g/Pd ratio is used, it has good solderability and can perform highly reliable soldering in a short time. Circuit pattern parts etc. are made of Ag/Pd.
Among the system conductor pastes, a conductor paste with particularly low Ag/Pd ratio and excellent migration resistance is used, so that the HIC has excellent migration resistance.

Therefore, the HIC of the present invention can achieve high productivity in manufacturing, as well as high reliability and durability in product use.

[Brief explanation of drawings]

FIG. 1 is a schematic cross-sectional view showing an example of the method for manufacturing the hybrid IC of the present invention, and FIGS. FIG. 3 is a schematic cross-sectional view showing another example of the hybrid IC of the present invention, and FIG. 4 is a schematic cross-sectional view showing an example of a conventional hybrid IC. 1... Substrate, 2... Conductive pattern film, 21...
・Soldering part conductive pattern film, 22... Circuit pattern part conductive pattern film, 3... Functional parts, 4...
・Solder.

Claims (1)

[Claims] Hybrid I in which a conductive pattern film with a predetermined pattern is formed on a substrate using an Ag/Pd-based conductive paste.
In C, two types of conductor pastes having different Ag/Pd ratios of conductive components in the paste are used as the Ag/Pd-based conductor paste, and the soldering portion of the conductive pattern film is Ag/Pd. Formed with Ag/Pd based conductor paste with a high ratio, other parts are made of Ag with a low Ag/Pd ratio.
/A hybrid IC characterized in that it is formed of a Pd-based conductor paste.