JPS62170573U - - Google Patents
Info
- Publication number
- JPS62170573U JPS62170573U JP5879686U JP5879686U JPS62170573U JP S62170573 U JPS62170573 U JP S62170573U JP 5879686 U JP5879686 U JP 5879686U JP 5879686 U JP5879686 U JP 5879686U JP S62170573 U JPS62170573 U JP S62170573U
- Authority
- JP
- Japan
- Prior art keywords
- probe
- conductive wires
- flat package
- brush
- detection device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 claims description 8
- 230000007547 defect Effects 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 3
- 238000012856 packing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Description
第１図は本考案の装置の基本形を略示する側面
図、第２図は本考案の装置の具体例を略示する側
面図、第３図は第２図の基体１８の下面図、第４
図はＩＣを例示する平面図、第５図は同上側面図
、第６図は従来の半田付け不良検出装置を略示す
る側面図である。
１：ＩＣ、２：基体、３：端子片、４：プリン
ト基板、５：導線、６：半田、７：導体片、８：
導線、９：第一のプローブピン、１０：第二のプ
ローブピン、１１：導線、１２：第一の切換スイ
ツチ、１３：導線、１４：第二の切換スイツチ、
１５：電源、１６：電流計、１７：プローブブラ
シ、１８：基体、１９：真空箱、２０：ゴムパツ
キング、２１：排気口、２２：昇降杆、２３：絶
縁板、２４：支柱、２５：昇降装置、２６：レバ
ー、２７：フランジ、２８：パツキング、２９：
ピニオン、３０：ラツク、３１：孔。
1 is a side view schematically showing the basic form of the device of the present invention, FIG. 2 is a side view schematically showing a specific example of the device of the present invention, and FIG. 3 is a bottom view of the base body 18 in FIG. 4
The figure is a plan view illustrating an IC, FIG. 5 is a side view of the same, and FIG. 6 is a side view schematically illustrating a conventional soldering defect detection device. 1: IC, 2: Base, 3: Terminal piece, 4: Printed circuit board, 5: Conductor, 6: Solder, 7: Conductor piece, 8:
Conductive wire, 9: first probe pin, 10: second probe pin, 11: conductive wire, 12: first changeover switch, 13: conductor, 14: second changeover switch,
15: Power supply, 16: Ammeter, 17: Probe brush, 18: Substrate, 19: Vacuum box, 20: Rubber packing, 21: Exhaust port, 22: Lifting rod, 23: Insulating plate, 24: Support, 25: Lifting device , 26: Lever, 27: Flange, 28: Packing, 29:
Pinion, 30: rack, 31: hole.
Claims (1)
性の基板４の表面に貼着した導線５に半田付けし
、この表面の導線５を基板４の裏面に貼着した導
線８に導通させたフラツトパツケージＩＣの半田
付け不良検出装置であつて、各端子片３に対応す
る基板裏面の導線８に押当てるプローブピン９と
、基板表面の導線５に接続される端子片３または
半田６に接触する金属細線より成るプローブブラ
シ１７とを有し、プローブピン９とプローブブラ
シ１７との間に電源１５と電流計１６とを挿入し
たフラツトパツケージＩＣの半田付け不良検出装
置。 A large number of terminal pieces 3 are made to protrude from the sides, and these are soldered to conductive wires 5 affixed to the surface of an insulating substrate 4, and the conductive wires 5 on this surface are electrically connected to conductive wires 8 affixed to the back surface of the substrate 4. This is a soldering defect detection device for a flat package IC that has a flat package. This flat package IC soldering defect detection device has a probe brush 17 made of a thin metal wire that contacts a probe pin 9 and a probe brush 17, and a power source 15 and an ammeter 16 are inserted between the probe pin 9 and the probe brush 17.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5879686U JPS62170573U (en) | 1986-04-21 | 1986-04-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5879686U JPS62170573U (en) | 1986-04-21 | 1986-04-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62170573U true JPS62170573U (en) | 1987-10-29 |
Family
ID=30889689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5879686U Pending JPS62170573U (en) | 1986-04-21 | 1986-04-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62170573U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58146866A (en) * | 1982-02-25 | 1983-09-01 | Fujitsu Ltd | Inspecting method of conductive pattern |
-
1986
- 1986-04-21 JP JP5879686U patent/JPS62170573U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58146866A (en) * | 1982-02-25 | 1983-09-01 | Fujitsu Ltd | Inspecting method of conductive pattern |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS62170573U (en) | ||
| JPS61179747U (en) | ||
| JPH0416367U (en) | ||
| JPS6379677U (en) | ||
| JPH0245665U (en) | ||
| JPS62166640U (en) | ||
| JPH01125571U (en) | ||
| JPS5915383B2 (en) | Mounting equipment for semiconductor integrated circuits | |
| JPS63115235U (en) | ||
| JPH0245666U (en) | ||
| JPH0260237U (en) | ||
| JPS6226048U (en) | ||
| JPH02118274U (en) | ||
| JPH0245667U (en) | ||
| JPS6088480U (en) | Ultra high frequency IC socket | |
| JPS63109658U (en) | ||
| JPS61115981U (en) | ||
| JPS6373672U (en) | ||
| JPS6061736U (en) | Hybrid IC | |
| JPS6251277U (en) | ||
| JPS6312198U (en) | ||
| JPH05259367A (en) | Flat ic package | |
| JPS58122450U (en) | Semiconductor element mounting stand | |
| JPS58192492U (en) | IC socket | |
| JPH0270441U (en) |