JPS62169697A - Integrated circuit card - Google Patents
Integrated circuit cardInfo
- Publication number
- JPS62169697A JPS62169697A JP61012708A JP1270886A JPS62169697A JP S62169697 A JPS62169697 A JP S62169697A JP 61012708 A JP61012708 A JP 61012708A JP 1270886 A JP1270886 A JP 1270886A JP S62169697 A JPS62169697 A JP S62169697A
- Authority
- JP
- Japan
- Prior art keywords
- card
- metal plate
- chip
- circuit board
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 19
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 210000000078 claw Anatomy 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明はＩＣカード、より詳しくは、静電気によるＩＣ
の破壊を防止する構造を有するＩＣカードに関する。[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to an IC card, more specifically, an IC card using static electricity.
The present invention relates to an IC card having a structure that prevents destruction of the IC card.
〈従来の技術〉
ＩＣカードは、第３図に示すように、カード本体１′の
表面に露出した８個のピン端子２が形成されている。第
４図はＩＣカードのシステム構成を示し、ピン端子２が
接続されたＣＰＵ３とＲＯＭまたはＲＡＭであるメモリ
４からなる。メモリ４のデータの読み出しと書き込みは
、このＩＣカードが挿入されたリーダライタ（図示せず
）によりピン端子２を経てＣＰＵ３を介して行なわれる
。<Prior Art> As shown in FIG. 3, an IC card has eight pin terminals 2 exposed on the surface of a card body 1'. FIG. 4 shows the system configuration of the IC card, which consists of a CPU 3 to which a pin terminal 2 is connected, and a memory 4 that is a ROM or RAM. Reading and writing of data in the memory 4 is performed via the CPU 3 via the pin terminal 2 by a reader/writer (not shown) into which this IC card is inserted.
第５図はＩＣカードの断面構造を示し、表面にピン端子
２を形成し裏面にＩＣチップ５を搭載した配線回路基板
６が、層化ビニール樹脂板１２に埋め込まれている。上
述のＣＰＵ３とメモリ４を内蔵したＩＣチップ５は、塩
化ビニール樹脂板１２により覆われる。FIG. 5 shows a cross-sectional structure of an IC card, in which a printed circuit board 6 with pin terminals 2 formed on the front surface and an IC chip 5 mounted on the back surface is embedded in a layered vinyl resin board 12. The IC chip 5 containing the above-mentioned CPU 3 and memory 4 is covered with a vinyl chloride resin plate 12.
〈発明が解決しようとする問題点〉
ＩＣカードは、静電気によるＩＣの破壊を防止する対策
が必要である。このため、従来では、第６図に示すよう
にピン端子２の内の接地端子以外の７個の端子の周囲に
接地電位となる金属板１３を配置していたが、静電気対
策としては万全ではなかった。また、従来のＩＣカード
は、ＩＣチップ５が塩化ビニール樹脂板１２で覆われて
いるので、ＩＣチップ５の発熱による塩化ビニール樹脂
板１２の変形という事態が生じ、この場合、ＩＣカード
が使用不可能になるという欠点もあった。<Problems to be Solved by the Invention> IC cards require measures to prevent destruction of the IC due to static electricity. For this reason, conventionally, as shown in Fig. 6, a metal plate 13 that has a ground potential has been placed around seven terminals other than the ground terminal among the pin terminals 2, but this is not a perfect countermeasure against static electricity. There wasn't. Furthermore, in conventional IC cards, the IC chip 5 is covered with a vinyl chloride resin plate 12, so the vinyl chloride resin plate 12 may be deformed due to the heat generated by the IC chip 5, and in this case, the IC card becomes unusable. There was also the downside of being able to do so.
く問題点を解決する為の手段〉
本発明は、配線回路基板に実装されたｒｃチップを内蔵
したＩＣカードにおいて、上記配線回路基板をはさんで
上記ＩＣチップを覆う金属板を内蔵したことを特徴とす
る。Means for Solving the Problems> The present invention provides an IC card with a built-in RC chip mounted on a printed circuit board, which includes a built-in metal plate sandwiching the printed circuit board and covering the IC chip. Features.
〈実施例〉
第２図は本実施例のＩＣカードの外観構成を示し、カー
ド本体１の表面に露出した８個のピン端子２が形成され
ている。このＩＣカードのシステム構成は、第４図に示
す従来の構成と同様であり、ピン端子２が接続されたＣ
ＰＵ３とＲＯＭまたはＲＡＭであるメモリ４からなる。<Example> FIG. 2 shows the external structure of the IC card of this example, in which eight pin terminals 2 exposed on the surface of the card body 1 are formed. The system configuration of this IC card is similar to the conventional configuration shown in FIG.
It consists of a PU 3 and a memory 4 which is ROM or RAM.
第１図は本実施例のＩＣカードの断面構造を示す。カー
ド本体１は、裏面にＩＣチップ５を実装し表面にピン端
子２を形成した配線回路基板６をはさんでＩＣチップ５
を覆う下側金属板７と上側金属板８を内蔵する。下側金
属板７は下側樹脂板９で覆われ、ピン端子２が露出した
部分以外で上側金属板８は上側樹脂板１０で覆われる。FIG. 1 shows the cross-sectional structure of the IC card of this embodiment. The card body 1 has a printed circuit board 6 with an IC chip 5 mounted on the back side and pin terminals 2 formed on the front side.
It has a built-in lower metal plate 7 and an upper metal plate 8 that cover it. The lower metal plate 7 is covered with a lower resin plate 9, and the upper metal plate 8 is covered with an upper resin plate 10 except for the portion where the pin terminal 2 is exposed.
金属板７．８の材質は、たとえばステンレス鋼５ＵＳ３
０４が用いられる。The material of the metal plate 7.8 is, for example, stainless steel 5US3.
04 is used.
配線回路基板６は、実装したＩＣチップ５が下側金属板
７の凹部７′にはまり込むように金属板７．８ではさま
れる。下側金属板７と上側金属板８は、導電性のツメ１
１で接続される。このため、上下の金属板８．７により
、ＩＣチップ５に対して良好なシールド効、果が得られ
る。The printed circuit board 6 is sandwiched between metal plates 7.8 such that the mounted IC chip 5 fits into the recess 7' of the lower metal plate 7. The lower metal plate 7 and the upper metal plate 8 have conductive claws 1
Connected with 1. Therefore, the upper and lower metal plates 8.7 provide a good shielding effect for the IC chip 5.
また、ＩＣチップ５は、下側金属板７と接触する。この
ため、ＩＣチップ５の発熱は、熱伝導性の良い下側金属
板７を経て放熱する。Further, the IC chip 5 is in contact with the lower metal plate 7. Therefore, the heat generated by the IC chip 5 is radiated through the lower metal plate 7 which has good thermal conductivity.
〈発明の効果〉
以上説明したように本発明においては、ＩＣチップを実
装した配線回路基板をはさんでＩＣチップを覆う金属板
を内蔵したので、良好なシールド効果が得られ、静電気
によるＩＣの破壊を確実に防止することができるととも
に、金属板の放熱効果によりＩＣの発熱によるカードの
変形を防止することができる。<Effects of the Invention> As explained above, in the present invention, since a metal plate is built in to sandwich the printed circuit board on which the IC chip is mounted and cover the IC chip, a good shielding effect is obtained, and the IC chip is prevented from being damaged by static electricity. Destruction can be reliably prevented, and the card can be prevented from being deformed due to heat generation by the heat dissipation effect of the metal plate.
第１図は本発明実施例のＩＣカードの断面構造を示す図
、第２図は本発明実施例のＩＣカードの外観構成を示す
平面図、第３図は従来例のＩＣカードの外観構成を示す
平面図、第４図はＩＣカードのシステム構成を示すブロ
ック図、第５図は従来例のＩＣカードの断面構造を示す
図、第６図は従来例のＩＣカードの部分構成を示す平面
図である。
１−・・カード本体 ５・−４Ｃチヮプ６−・−
配線回路基板 ７−・下側金属板８・−・上側金属
板FIG. 1 is a diagram showing a cross-sectional structure of an IC card according to an embodiment of the present invention, FIG. 2 is a plan view showing an external configuration of an IC card according to an embodiment of the present invention, and FIG. 3 is a diagram showing an external configuration of a conventional IC card. 4 is a block diagram showing the system configuration of an IC card, FIG. 5 is a diagram showing a cross-sectional structure of a conventional IC card, and FIG. 6 is a plan view showing a partial configuration of a conventional IC card. It is. 1-...Card body 5--4C tip 6--
Wired circuit board 7-・Lower metal plate 8・-・Upper metal plate
Claims (1)
カードにおいて、上記配線回路基板をはさんで上記ＩＣ
チップを覆う金属板を内蔵したことを特徴とするＩＣカ
ード。An IC with a built-in IC chip mounted on a printed circuit board
In the card, the above-mentioned IC is sandwiched between the above-mentioned printed circuit board.
An IC card characterized by having a built-in metal plate that covers the chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61012708A JPS62169697A (en) | 1986-01-22 | 1986-01-22 | Integrated circuit card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61012708A JPS62169697A (en) | 1986-01-22 | 1986-01-22 | Integrated circuit card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62169697A true JPS62169697A (en) | 1987-07-25 |
Family
ID=11812911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61012708A Pending JPS62169697A (en) | 1986-01-22 | 1986-01-22 | Integrated circuit card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62169697A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01175881U (en) * | 1988-06-03 | 1989-12-14 | ||
| JPH06203225A (en) * | 1992-12-29 | 1994-07-22 | Casio Comput Co Ltd | Memory device |
| JPH1035164A (en) * | 1996-04-25 | 1998-02-10 | Samsung Aerospace Ind Ltd | Ic card and manufacture thereof |
-
1986
- 1986-01-22 JP JP61012708A patent/JPS62169697A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01175881U (en) * | 1988-06-03 | 1989-12-14 | ||
| JPH06203225A (en) * | 1992-12-29 | 1994-07-22 | Casio Comput Co Ltd | Memory device |
| JPH1035164A (en) * | 1996-04-25 | 1998-02-10 | Samsung Aerospace Ind Ltd | Ic card and manufacture thereof |
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