JP2514318B2 - IC card - Google Patents

IC card

Info

Publication number
JP2514318B2
JP2514318B2 JP60176449A JP17644985A JP2514318B2 JP 2514318 B2 JP2514318 B2 JP 2514318B2 JP 60176449 A JP60176449 A JP 60176449A JP 17644985 A JP17644985 A JP 17644985A JP 2514318 B2 JP2514318 B2 JP 2514318B2
Authority
JP
Japan
Prior art keywords
card
electrode
electrode terminal
present
module substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP60176449A
Other languages
Japanese (ja)
Other versions
JPS6237196A (en
Inventor
忠信 照井
力夫 杉浦
春夫 小嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP60176449A priority Critical patent/JP2514318B2/en
Publication of JPS6237196A publication Critical patent/JPS6237196A/en
Application granted granted Critical
Publication of JP2514318B2 publication Critical patent/JP2514318B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【発明の詳細な説明】 〔概要〕 電極端子を、外部から直接人の指などによって触れら
れることのないよう、カードの内部に設けた静電気対策
を施したICカードの構造に関する。
DETAILED DESCRIPTION OF THE INVENTION [Outline] The present invention relates to a structure of an IC card provided with an anti-static measure, which is provided inside a card so that an electrode terminal is not directly touched by a person's finger from the outside.

〔産業上の利用分野〕[Industrial applications]

本発明はICカード、さらに詳しく言えば、ICを保護す
るために静電気対策を設けたICカードの構成に関するも
のである。
The present invention relates to an IC card, and more particularly to the structure of an IC card provided with a measure against static electricity in order to protect the IC.

〔従来の技術〕[Conventional technology]

第4図に示されるICカードは知られたものであり、同
図において、21はICカード本体、22は電極端子、23はIC
チップであり、電極端子22とICチップ23のパッド(電
極)とはワイヤで接続されている。従来の磁気カードは
記録容量が限られたものであったが、ICカードは、情報
の記録、読出しが可能であり、記録容量が大であり、安
全性や情報の保存性に優れ、情報の再書込みが可能であ
る、等の利点をもつ。
The IC card shown in FIG. 4 is a known one. In the figure, 21 is an IC card body, 22 is an electrode terminal, and 23 is an IC.
It is a chip, and the electrode terminals 22 and pads (electrodes) of the IC chip 23 are connected by wires. Conventional magnetic cards have a limited recording capacity, but IC cards are capable of recording and reading information, have a large recording capacity, and are excellent in safety and information storability. It has advantages such as rewriting.

〔発明が解決しようとする問題点〕[Problems to be solved by the invention]

前記したICカードの唯一の弱点は、電極端子がカード
表面に露出しているので、そのため人の指が電極端子に
直接触れた場合などに静電気によりICが破壊されるおそ
れがあることである。
The only weak point of the above-mentioned IC card is that the electrode terminals are exposed on the surface of the card, so that static electricity may destroy the IC when a human finger directly touches the electrode terminals.

本発明はこのような点に鑑みて創作されたもので、静
電気によるICの破壊が防止される機構をもったICカード
を提供することを目的とする。
The present invention was created in view of the above circumstances, and an object thereof is to provide an IC card having a mechanism for preventing damage to the IC due to static electricity.

〔問題点を解決するための手段〕[Means for solving problems]

上記課題は、一方の主面にチップが搭載され、かつ、
一端に一端縁部から離れて当該主面上に電極端子が配設
されたモジュール基板とを備え、前記チップの電極と前
記電極端子とは電気的に接続されており、前記モジュー
ル基板は、前記電極端子がカード基体の厚さより開口部
の幅が小なる凹部に収容され、かつ、前記カード基体の
外部装置への接続端縁部から離れて配置されてなること
を特徴とするICカードを提供することによって解決され
る。
The above problem is that the chip is mounted on one main surface, and
A module substrate having electrode terminals arranged on the main surface at a distance from one end edge portion at one end, the electrodes of the chip and the electrode terminals are electrically connected, and the module substrate is Provided is an IC card characterized in that an electrode terminal is housed in a recess having an opening whose width is smaller than the thickness of a card base, and is arranged away from an edge of a connection end of the card base to an external device. Will be solved.

〔作用〕[Action]

添付の図は本発明実施例を示し、その第1図は同実施
例の一部切欠斜視図、第2図は正面図、第3図は第2図
の表面と裏面とを逆にした平面図であり、これらの図に
おいて、11はカード本体、11aは表面、11bは裏面、12は
モジュールでそれは半導体チップ13を含み、半導体チッ
プのパッドはワイヤ15によって電極端子16に接続されて
いる。
The attached drawings show an embodiment of the present invention, in which FIG. 1 is a partially cutaway perspective view of the same embodiment, FIG. 2 is a front view, and FIG. 3 is a plane in which the front surface and the back surface of FIG. 2 are reversed. In these figures, 11 is a card main body, 11a is a front surface, 11b is a back surface, 12 is a module, which includes a semiconductor chip 13, and pads of the semiconductor chip are connected to electrode terminals 16 by wires 15.

本発明実施例において、半導体チップ13、電極端子1
6、ワイヤ15からなるモジュール12はカード本体11に設
けた凹所内に配設されている。
In the embodiment of the present invention, the semiconductor chip 13, the electrode terminal 1
The module 12 including the wire 15 and the wire 15 is disposed in a recess provided in the card body 11.

前記した本発明実施例においては、電極端子が外部か
ら完全に遮蔽されているので、人の指などが触れること
がなく、静電気の影響を避けることができるのである。
In the above-described embodiments of the present invention, since the electrode terminals are completely shielded from the outside, it is possible to avoid the influence of static electricity without being touched by human fingers.

〔実施例〕〔Example〕

以下、図面によって本発明実施例を詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

本発明実施例においては、例えばガラス繊維を積層し
て作った絶縁性のモジュール基板17上に、集積回路が形
成された半導体チップ13を接着し、半導体チップのパッ
ド14をモジュール基板17上に基板縁部17aから間隔をお
いて形成した一群の電極端子16にワイヤ15で接続するこ
とによって1つのモジュール12を作る。なお、モジュー
ル基板17は前記したもの以外の絶縁性材料で作ることは
可能である。
In the embodiment of the present invention, for example, a semiconductor chip 13 on which an integrated circuit is formed is adhered on an insulating module substrate 17 made by laminating glass fibers, and a semiconductor chip pad 14 is provided on the module substrate 17. One module 12 is made by connecting wires 15 to a group of electrode terminals 16 spaced apart from the edge 17a. The module board 17 can be made of an insulating material other than those described above.

モジュール12は、半導体チップ13を上にし、かつ、モ
ジュール基板縁部17aがカード本体の縁部と一致する如
くに表面11aに貼り付け、次いで裏面11bと表面11aとを
一体化してカード本体11を作る。第1図に見て、モジュ
ール基板17の厚さは0.5mm、裏面11bの厚さを0.5mmに設
定し、電極端子16と接触する例えばICカードリーダ/ラ
イタのプラグ状の電極を挿入するための高さ1mmの凹所1
8を形成し、ICカード全体を2mmの厚さにした。凹所18の
高さは前記の如く1mmであり、また電極端子はモジュー
ル基板縁部17aから離れているので、そこに人の指が入
って電極端子16と接触することは完全に防止される。IC
カード本体11は例えばABS樹脂で作るが、材料はそれに
限定されるものではない。また、電極端子16は通常のプ
リント技術でモジュール基板17上に形成しうるが、その
他の技術例えばエッチングで作ることも可能である。
The module 12 is attached to the front surface 11a so that the semiconductor chip 13 faces upward and the module board edge portion 17a coincides with the edge portion of the card body. create. As shown in FIG. 1, the thickness of the module substrate 17 is set to 0.5 mm, the thickness of the back surface 11b is set to 0.5 mm, and the plug-like electrode of the IC card reader / writer that contacts the electrode terminal 16 is inserted. 1mm height recess 1
8 was formed, and the entire IC card had a thickness of 2 mm. The height of the recess 18 is 1 mm as described above, and since the electrode terminal is separated from the module board edge portion 17a, it is completely prevented that a human finger enters there and comes into contact with the electrode terminal 16. . I c
The card body 11 is made of, for example, ABS resin, but the material is not limited thereto. Further, the electrode terminal 16 can be formed on the module substrate 17 by a normal printing technique, but it can also be formed by another technique such as etching.

〔発明の効果〕〔The invention's effect〕

以上述べてきたように、本発明によれば、ICカードの
電極端子を完全にカード本体の凹所内に配置し外部から
遮蔽するので、人の指が触れて静電気でICを破壊するお
それがなくなり、ICカードの利用度と信頼性を高めるに
有効である。
As described above, according to the present invention, since the electrode terminals of the IC card are completely placed in the recess of the card body and shielded from the outside, there is no risk of touching a human finger and destroying the IC by static electricity. , It is effective for improving the usage and reliability of IC cards.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明実施例の表面を下にして見た斜視図、 第2図は本発明実施例の表面を下にして見た正面図、 第3図は本発明実施例の表面を上にして見た平面図、 第4図は従来のICカードの平面図である。 11はカード本体、11aは表面、11bは裏面、12はモジュー
ル、13は半導体チップ、14はパッド、15はワイヤ、16は
電極端子、17はモジュール基板、18は凹所である。
FIG. 1 is a perspective view of the embodiment of the present invention viewed downward, FIG. 2 is a front view of the embodiment of the present invention viewed downward, and FIG. 3 is a surface of the embodiment of the present invention viewed upward. 4 is a plan view of the conventional IC card. 11 is a card body, 11a is a front surface, 11b is a back surface, 12 is a module, 13 is a semiconductor chip, 14 is a pad, 15 is a wire, 16 is an electrode terminal, 17 is a module substrate, and 18 is a recess.

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】一方の主面にチップが搭載され、かつ、一
端に一端縁部から離れて当該主面上に電極端子が配設さ
れたモジュール基板とを備え、 前記チップの電極と前記電極端子とは電気的に接続され
ており、 前記モジュール基板は、前記電極端子がカード基体の厚
さより開口部の幅が小なる凹部に収容され、かつ、前記
カード基体の外部装置への接続端縁部から離れて配置さ
れてなることを特徴とするICカード。
1. A module substrate having a chip mounted on one main surface, and an electrode terminal disposed on the main surface at one end apart from an edge portion at one end, the electrode of the chip and the electrode The module substrate is electrically connected to the terminal, the electrode terminal is housed in a recess having a smaller opening width than the thickness of the card base, and the connection edge of the card base to an external device is connected. IC card characterized by being placed away from the department.
JP60176449A 1985-08-10 1985-08-10 IC card Expired - Fee Related JP2514318B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60176449A JP2514318B2 (en) 1985-08-10 1985-08-10 IC card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60176449A JP2514318B2 (en) 1985-08-10 1985-08-10 IC card

Publications (2)

Publication Number Publication Date
JPS6237196A JPS6237196A (en) 1987-02-18
JP2514318B2 true JP2514318B2 (en) 1996-07-10

Family

ID=16013900

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60176449A Expired - Fee Related JP2514318B2 (en) 1985-08-10 1985-08-10 IC card

Country Status (1)

Country Link
JP (1) JP2514318B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62159679U (en) * 1986-03-31 1987-10-09
JPS63139975U (en) * 1987-03-04 1988-09-14
JPS6458594A (en) * 1987-08-31 1989-03-06 Fanuc Ltd Ic card
JPH01186392A (en) * 1988-01-21 1989-07-25 Nec Corp Information card

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57123556U (en) * 1981-01-26 1982-08-02
JPS6142219Y2 (en) * 1981-01-26 1986-12-01
JPS5819639U (en) * 1981-07-31 1983-02-07 旭東電商株式会社 Shopping basket with calculator
JPS61128758U (en) * 1985-01-28 1986-08-12

Also Published As

Publication number Publication date
JPS6237196A (en) 1987-02-18

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