JPS62169438A - Jig for transporting semiconductor wafer - Google Patents

Abstract

PURPOSE:To transport plural cartridge cases safely and with a little shock by placing the cartridge cases on a bottom plate part and fixing them into one body with two guiding members planted straight on the bottom plate part and a top plate part fitted with said guiding members. CONSTITUTION:Guiding members 3 and 4 are inserted into insertion holes of a cartiridge case 30 from the upper part of a transporting jig 1 and for example, three cases are piled up on a bottom plate part 2. The guiding members 3 and 4 are inserted in larger-diameter holes of fitting holes 8 and 9 on an upper plate part 7 and when the upper plate part 7 is rotated in counter-clockwise direction, smaller-diameter holes are fitted in with fitting grooves 5 and 6. Thus, the transporting jig 1 and the three cartridge cases 30 are put into one body and it becomes possible to carry them by grasping a hand grip 10.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a transport jig suitable for use in transporting semiconductor wafers in the manufacturing process of semiconductor devices (hereinafter referred to as ICs) and the like.

[Conventional technology]

Semiconductor wafers have gradually become larger in diameter for the purpose of reducing costs and increasing the degree of integration, and have recently come to be used in diameters ranging from about 75 mm to about 150 mm.

In the IC manufacturing process, each semiconductor wafer is
Alternatively, a predetermined process is performed on about 25 sheets at a time, but as the diameter increases as mentioned above, the number of 'N times also increases. Also, if dust adheres to the product, the yield of the product will decrease. The cartridge is stored in a cartridge for s, which is further stored in a box called a cartridge case and transported.

Regarding the semiconductor wafers mentioned above, please refer to the "Introductory IC Seminar" (7th edition published on April 1, 1971).

Published by CQ Publishing, 1) p7 i-73).

The present inventors have studied efficient transportation to the semiconductor quay, reducing impact to reduce cracks and chips, and transportation while reducing adhesion of foreign matter.

[Problem that the invention seeks to solve]

When transporting semiconductor wafers, they are stored in cartridges and then in cartridge cases. Then, multiple IJ cases were stacked and transported by one person using baskets or trolleys.

However, with the above transportation method, the cartridge case is not fixed and unstable during transportation, so there is a risk of it falling, and accidents such as foreign matter adhesion and wafer cracking are likely to occur due to incorrect handling of the cartridge case. ,
Through studies conducted by the present inventor, it has become clear that transporting multiple items at the same time poses a safety problem.

SUMMARY OF THE INVENTION An object of the present invention is to provide a transportation jig that can collectively transport a plurality of cartridge cases containing semiconductor wafers safely and with low impact.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means to solve the problem]

A brief overview of typical inventions disclosed in this application is as follows.

In other words, two positioning members for positioning the cartridge case are provided upright on the bottom plate portion on which the IJ case is placed, and two points are attached to the positioning member from the top of the stacked cartridge cases. The cartridge case is provided with a locking top plate part and is carried as one body by a handle formed on the top plate part, such as a cartridge case placed on the bottom plate part.

[For production]

According to the above-mentioned means, the plurality of cartridges fixed by the bottom plate part and the two guide members can be lifted together, so that the object of the present invention of transporting the plurality of cartridge cases safely and with low impact can be achieved. can be achieved.

[Embodiment 1] A first embodiment of the present invention will be described below with reference to FIGS. 1 to 5.

In addition, Fig. 1 is a perspective view showing the overall structure of the transportation jig, Fig. 2 is a plan view showing the shape of the upper plate, Fig. 3 is a perspective view showing the structure of the cartridge case, and Fig. 4 is a perspective view showing the structure of the transport jig. It is a perspective view showing the situation where a cartridge case was placed on a jig.

The feature of this embodiment is that it is configured so that a plurality of cartridge cases can be transported as one unit.

In the transportation jig 1, 2 is a bottom plate portion, and two guide members 3.4 are provided upright.

The spacing between the guide members 3.4 is adjusted to the longitudinal dimension of the cartridge case 11, which will be described later.

The outer surfaces of the guide members 3 and 4 are provided with locking grooves 5 at predetermined heights.
, 6 are formed to lock the locking holes 8 and 9 of the upper plate portion 7. Note that the upper plate portion 7 is provided with a handle 10.

By the way, as shown in FIG. 2, the locking hole 8.9 has a continuous shape of a large diameter hole and a small diameter hole, and is formed in the shape of an arc. Therefore, when the guide member 3.4 is inserted into the large diameter hole and the upper plate portion 7 is rotated counterclockwise in FIG. 2, the small diameter hole will be locked in the locking grooves 5 and 6. .

Next, regarding the cartridge case 30, the seven flange 11.12 is formed with an insertion hole 13.14 through which the guide members 3, 4 can be inserted.

Note that 15 is a cartridge, and 16 is a semiconductor wafer.

Next, the method of using the transportation jig 1 will be described.

The guide members 3.4 are inserted into the insertion holes 13.14 of the cartridge case 30 from the top of the transportation jig 1, and three guide members, for example, are stacked on the bottom plate portion 2.

Then, if the upper plate part 7 is operated as described in FIG.
As shown in FIG. 4, the carrying jig 1 and the three cartridge cases 30 are integrated, and can be carried by lifting the handle 10. In addition, in the state shown in FIG. 4, the locking grooves 5 and 6 correspond to the positions of the insertion holes 13 and 14, respectively, and by locking both, the cartridge case 3
The positioning of 0 becomes even stronger.

m The bottom plate of the transportation jig and the two parts installed upright on it.
Since the plurality of cartridge cases placed on the bottom plate are positioned and fixed by the guide member of the book,
By eliminating rattling during transportation of the cartridge case, it is possible to reduce cracking and chipping of semiconductor wafers.

(2) According to the above item [1], since a plurality of cartridge cases can be transported in one piece, it is possible to obtain the effect that work efficiency is improved.

(3) According to (11) above, it is possible to carry a plurality of cartridges in one body, thereby improving safety during one operation.

[Embodiment 2] Next, a second embodiment of the present invention will be described with reference to FIGS. 5 and 6.

The feature of this embodiment is that it is constructed so that the work of stacking the car IJ case 30 can be simplified. Note that the upper plate portion 7 of the above embodiment can be used as is.

The transportation jig 21 includes one guide member 22 formed in an L-shape, and a guide member 2 rotatably provided at one end of the guide member 22.
3.

On the other hand, the insertion holes 13 and 14 of the cartridge case 30
The position corresponding to is formed in the recessed portion 24 as shown in Figure 6.

To describe how to use the above-mentioned transportation jig 21, the guide member 23 is tilted down as shown by the imaginary line, and the guide member 22
into the recess 24.

Next, when the guide member 23 is erected as shown by the solid line, the guide member 23 will fit into one of the recesses. By operating the upper plate portion 7 as described above, it becomes possible to transport, for example, three cartridge cases 30 as a unit using the transport jig 21.

The transportation jig shown in this embodiment has the same effect as the first embodiment described above (41). Since K allows a plurality of cartridge cases to be transported in one piece, it is possible to obtain the effect that work efficiency is further improved.

(5) Since the transportation jig itself has a simple structure, the manufacturing cost is low.

(6) Since the main part is constituted by two rod-shaped bodies, it is possible to easily transport the transport tool itself.

(7) According to the above (6), there is an effect that the storage space for the carrier itself can be reduced.

Although the invention made by the present inventor has been specifically explained based on examples above, the present invention is not limited to the above examples, and can be modified in various ways without departing from the gist of the invention. Needless to say.

For example, a plate-like body may be provided at the bottom of the L-shaped guide member described in the second embodiment.

Furthermore, the structure of the cartridge case described in the second embodiment can also be applied to the first embodiment.

In the above explanation, we mainly explained the excitation applied to the transportation of semiconductor wafers, which is the field of application for the invention made by the present inventors, but it is not limited thereto. It can be used for transportation.

The present invention can be used at least for transporting boxes.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

That is, a cartridge case is placed on a bottom plate, and the cartridge case is fixed integrally by two guide members provided upright on the bottom plate and an upper plate that is engaged with the guide members. Therefore, the 'in' cartridge case can be transported in one piece, and since there is no rattling, cracking and chipping of the semiconductor wafer I can be reduced.

[Brief explanation of drawings]

Fig. 1 is an overall perspective view showing a second embodiment of a transportation jig to which the present invention is applied, Fig. 2 is a plan view showing the shape of the upper plate portion, and Fig. 3 is a perspective view showing the structure of the cartridge case. FIG. 4 is a perspective view showing a cartridge case placed on a transportation jig, and FIG. 5 is a perspective view of a transportation jig showing a second embodiment of the present invention. FIG. 6 is a perspective view showing the cartridge case placed on the transport jig. ], 21... Transportation jig, 3.4.22.23...
Guide member, 5, 6...Latching groove, 7...Upper plate part, 8
゜9...Locking hole, 10...Handle, 13.14...
Insertion hole. 15... Wafer cartridge, 16... Semiconductor wafer, 30... Cartridge case. Agent Patent Attorney Katsuo Ogawa Figure 1Mej≧, /do2 7 /qゝZ Figure 270-2Children 3 Figures 7 and 4 Figure 4

Claims (1)

[Claims] 1. (1) a bottom plate portion on which a semiconductor wafer cartridge case is placed, and (2) a plurality of grooves that stand upright on the bottom plate portion, position the cartridge case, and have locking grooves formed therein. and (3) a top plate part that is rotated after being inserted through the guide member and has a locking hole that locks in the locking groove, and is placed on the bottom plate part. A jig for transporting semiconductor wafers, characterized in that the cartridge case is positioned by the guide member and is transported integrally by the upper plate part. 2. The bottom plate portion and one of the guide members are formed like a rod-shaped body formed in an L-shape, and the rod-shaped body rotatably provided at one end serves as the other guide member. A jig for transporting semiconductor wafers according to claim 1.