JP3458083B2 - Substrate storage jig transport system - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention, photo-reticle (Reticle: circuitry original) substrate, a liquid crystal display panel substrate and Purazumade I spray panel substrate such as a display panel substrate, a substrate for a hard disk, an electronic device such as a semiconductor device FOUP (F is a next-generation substrate storage jig that stores, transports, and stores substrates such as wafers for
ront Opening Unified Pod: front opening unified pod) relates to a technique, substrate storage jig conveying method and group especially to realize the shortening of suppressing and transport time foreign matters generated by the transfer to a low level
The present invention relates to a plate storage jig transfer system .

[0002]

FOUP, a next generation substrate storage jig
(Front Opening Unified Po
d: Front opening unified pod)
When transporting the system, it is necessary to shorten the transport time as much as possible in order to improve the efficiency of the semiconductor manufacturing line. In addition, it is necessary to reduce the adhesion of foreign matter (for example, particles or dust) to the wafer during transportation. On the other hand, in order to shorten the transportation time, it is necessary to increase the transportation speed, and therefore it is necessary to increase the acceleration applied to the FOUP 20. However, increasing the acceleration tends to increase the adhesion of foreign matter to the wafer. Therefore, there has been a demand for a transportation method that suppresses the generation of foreign matter as much as possible.

In such a technical background, the FO has hitherto been known.
UP automatic transport system (AMHS: Automate)
d Material Handling System
There was no proposal about the direction of the FOUP with respect to the transport direction when transporting with m) or the like. Therefore, in order to realize a larger acceleration / deceleration while suppressing the generation of foreign matter on the wafer to a low level, it was not necessary to specify the direction of the FOUP on the carrier device.

First, FOU which is a next-generation substrate storage jig.
P (Front Opening Unified Po)
The structure of d) will be described.

The FOUP shell is the part that holds the wafer. The entire combination of both the FOUP shell and the FOUP door is called a FOUP.

[0006] Information such as dimensions is SEMI Standard
ds E57, E47.1, etc. This wafer carrier is different from the conventional open cassette (SEMI Standards E1.9 other than 8 inches), and holds the wafer in a closed space to protect it from foreign matter and chemical contamination in the atmosphere. To do. To keep the airtightness, the FOUP door has a sealing material (packing), and the FOUP door is fixed to the FOUP shell. Therefore, the FOUP door has a clamping mechanism (stopper mechanism) and the FOUP shell side also has the FOUP shell side.
It has opposite clamped holes for fixing the UP door.
In addition, the FOUP door is called FOU with something called a retainer.
When fixed to the P shell, the wafer is pressed and fixed.
Further, the beam on which the wafer on the FOUP shell side is seated is called a wafer tooth.

Next, regarding an automatic transport system (AMHS) using FOUP, OHT (Overhead H
oist Transport: explaining the overhead hoist transport) as an example.

In the semiconductor factory, the wafer to be processed is F
It is placed in the OUP and moved between processing units. A FOUP containing a 300 mm wafer weighs about 8 kg, and it is difficult to consider manual transportation for safety, and an automatic transportation system such as OHT is used. Hereinafter, as an example of an OHT operation in a semiconductor factory, a series of operations in which a FOUP containing a wafer to be processed is supplied to a processing apparatus, processed and collected there will be described.

The FOUP containing the wafer to be processed is initially stored in the stocker installed in the process. When the upper system instructs the supply of the wafer to the processing apparatus (for example, the etching apparatus), the stocker conveys the FOUP designated by the upper apparatus to the delivery position (loader on the stocker side) to the OHT.

[0010] The OHT comes to a position above the loader on the stocker side and stops, and the lifting and lowering mechanism (Hoist mechanism) causes the robot hand to grab the FOUP mushroom.
Raise FOUP. When pulling up is completed, OHT
FOUP up to the load port on the processor side to be supplied
To transport.

The FOUP is lowered by a lifting mechanism. The elevating mechanism removes the mushrooms and ascends, and the FOUP is left on the load port on the processor side. After that, the load port on the processor side removes the FOUP clamping mechanism and removes the FOUP door from the FOUP shell.

With the FOUP door removed, the wafer can be taken out from the front surface of the FOUP, and the wafer transfer robot in the processing apparatus carries the wafer to the processing section in the processing apparatus to perform the necessary processing. After the processing is completed, the processed wafer is returned to the FOUP by the wafer transfer robot.

After performing the necessary processing on the wafer existing in the FOUP, the load port on the processing apparatus side docks the FOUP door with the FOUP shell to activate a clamping mechanism to fix the FOUP door to the FOUP shell. After that, the FOUP is retracted to the transfer position.

An empty OHT is stopped on the load port on the stocker side by a transport request, and the robot hand grabs the mushroom by the lifting mechanism and pulls it up. Then OHT
Transports the FOUP to the stocker, and the FOUP is temporarily stored there and then transported to the next processing step. In a semiconductor factory, the above operation flow is repeated to form necessary circuits on a wafer.

[0015]

However, as is clear from the above operation flow, the automatic transfer system (AM
HS) transport capacity (= FOU that can be transported per unit time)
If the upper limit of the number of P is not sufficient, the automatic transport system (AM
HS) reduces the operating rate of the processing device. For this reason, there is a problem in that it is necessary to prepare the transfer capacity as much as the processing capacity of the processing apparatus.

As a prior art aiming at solving such a problem, there is an automatic transfer system (AMHS).
There are two technologies disclosed, namely, a technique for increasing the number of trucks of the vehicle and a technique for increasing the transport speed of the trucks of the individual automatic transport systems (AMHS). Among them, increasing the number of dollies causes an increase in cost, and thus it is considered that a technique for increasing the carrying speed of the dolly is preferable. However, if the transport speed is increased, the acceleration is also increased.
The acceleration applied to UP also increases. As a result, there is a problem in that the generation of foreign matter on the wafer is increased.

The present invention has been made to solve the above problems, and a substrate storage jig transfer method and a substrate storage jig for suppressing the generation of foreign matter to a low level and shortening the transfer time. The purpose is to obtain a transport system .

[0018]

Means for Solving the Problems] substrate housing jig conveying system according to the first aspect of the invention of the present invention, the lifting mechanism holding the gripped member board housing jig to move the substrate housing jig And a substrate storage jig is covered by the lifting mechanism.
Grasp the gripping member, substrate storage jig conveyance and a conveying means for holding and conveying the substrate housing jig as bilateral datum plane of the substrate housing jig is in the transport direction substantially perpendicular
In the system, the transporting means comprises the lifting mechanism.
Gripping the gripped member of the substrate storage jig
When the work to pull up the board storage jig is completed,
Direction almost perpendicular to the bilateral datum surface of the plate storage jig
Is detected from the direction of the gripped member, and
The lifting mechanism is rotated according to the known orientation of the grasped member.
The board storage jig's bilateral
There is a means to make the tom surface almost perpendicular to the transport direction.
Then, carry the bilateral datum surface of the board storage jig.
It is characterized in that it is configured to be held and conveyed substantially perpendicular to the feeding direction .

A substrate storage jig according to the second aspect of the present invention.
The transport system is the system according to claim 1,
The transport means is an overhead hoist transpo
It is characterized in that it is over and.

A substrate storage jig according to the invention of claim 3
The transfer system grips the mushroom of the board storage jig
It has a lifting mechanism that moves the substrate storage jig by
Grab the mushroom of the board storage jig by the mechanism,
The bilateral datum surface of the board storage jig is
Hold the substrate storage jig so that it is almost vertical and transport it.
Base with overhead, hoist and transport
A board storage jig transfer system, wherein the overhead
・ The hoist / transport is operated by the lifting mechanism.
Hold the mushroom of the board storage jig and
When the work to pull up the board storage jig is completed,
Direction almost perpendicular to the bilateral datum surface of the plate storage jig
Is detected from the direction of the mushroom and
The lifting mechanism according to the direction of the detected mushroom
By rotating the substrate storage jig
Hand to make the datum surface almost vertical to the transport direction.
Bilateral datum of the board storage jig with steps
Configured to hold and transport the surface substantially perpendicular to the transport direction
It is characterized by that .

[0021]

DETAILED DESCRIPTION OF THE INVENTION a substrate storage jig next generation FO
UP (Front Opening Unified)
Pod: When carrying a front opening unified pod) system, it is necessary to shorten the carrying time as much as possible in order to improve the efficiency of the semiconductor manufacturing line.
In addition, it is necessary to minimize the adhesion of foreign matter (eg, particles, dust, etc.) to the wafer during transportation. On the other hand, in order to shorten the transportation time, it is necessary to increase the transportation speed, and therefore it is necessary to increase the acceleration applied to the FOUP. However, increasing the acceleration tends to increase the adhesion of foreign matter to the wafer. For this reason,
There has been a demand for a transportation method that suppresses the generation of foreign matter as much as possible.

Based on the above technical background, the inventor of the present invention has investigated the relationship between the direction and magnitude of the acceleration applied to the FOUP and the generation of foreign matter, and as a result, the foreign matter is detected when the acceleration exceeds a certain value (threshold value). There is a threshold that increases the number of occurrences of
In addition, a new finding was obtained that the threshold value is highest when the acceleration direction is perpendicular to the BD surface.

The present invention is based on the novel knowledge, and when the FOUP is transported, the FOUP Bil is transported.
By holding and carrying the FOUP 20 so that the lateral data plane is perpendicular to the carrying direction, the generation of foreign matter due to the carrying is suppressed to a low level, and the carrying time is shortened. Embodiments of the present invention will be described below with reference to the drawings.

First, FOU which is a next generation substrate storage jig.
P (Front Opening Unified Po)
The structure of d) will be described with reference to FIGS. 1, 2, 3, 4, and 5.

FIG. 1 shows a FOU according to an embodiment of the present invention.
2 is a top view for explaining the relationship between the direction of P20 and the carrying direction, FIG. 2 is a perspective view for explaining the external configuration of the FOUP 20 of FIG. 1, and FIG. 3 is a FOUP door 2 (board storage jig of the FOUP 20 of FIG. 1 is a perspective view for explaining the inner structure of the door, FIG. 4 is a front view of the FOUP 20 for explaining the positional relationship between the wafer teeth 8 and the wafer 7 provided inside the FOUP 20 of FIG. 5 is wafer 7
FIG. 6 is a top view of FOUP 20 for explaining the positional relationship between wafer tooth 8 and retainer 5.

In FIGS. 1 and 2, 1 is a FOUP shell 1
(Main body of substrate storage jig) 2, FOUP door, 3 mushroom, 20 FOUP, FD surface is Facial D
A virtual reference plane called an attum plane and a BD plane show a virtual reference plane called a Bilatal Datum plane. In FIG. 3, 4 is a clamping mechanism, 5 is a retainer, 6 is a sealing material, and 7 is a wafer. , 8 are wafer teeth.

FOUP 2 of the present embodiment shown in FIGS.
At 0, the FOUP shell 1 (substrate storage jig main body) is a portion for holding the wafer 7 (see FIG. 4). FOUP
The whole of the shell 1 (substrate storage jig main body) and the FOUP door 2 (substrate storage jig door) is referred to as a FOUP 20.

In the following description, the terms BD surface and FD surface are used, but the BD surface has two FOUPs 20 to the left and right.
The equally dividing plane, the FD plane, is a plane parallel to the front surface of the carrier (see FIG. 2). See SE for their exact definitions.
MI Standard E47.1.

Information such as dimensions is SEMI Standard
ds E57, E47.1, etc. This F
The wafer carrier called OUP20 is an open cassette (SEMI Standard) that has been used conventionally.
Unlike the open cassette for 8 inches or less) described in s E1.9, etc., the wafer 7 is held in a closed space to protect the wafer 7 from foreign matter in the atmosphere and chemical contamination. . Further, as shown in FIG. 3, a sealing material (packing) 6 is provided around the FOUP door 2 (substrate storage jig door) to keep the airtightness, and the FOUP door 2 (substrate storage jig door) is attached to the FOUP shell. A clamping mechanism 4 (in other words, a stopper mechanism) as shown in FIG. 3 is provided on the FOUP door 2 (substrate storage jig door) side for fixing to 1 (substrate storage jig main body). , F
A hole for fixing the FOUP door 2 (substrate storage jig door) is provided on the OUP shell 1 (substrate storage jig body) side at a position facing the clamping mechanism 4.

A retainer 5 (see FIGS. 3 and 5) is used to connect the FOUP door 2 (substrate storage jig door) to the F
When the wafer 7 is fixed to the OUP shell 1 (body of the substrate housing jig), the wafer 7 is pressed and fixed as shown in FIG. Also, F
The beam on which the wafer 7 on the OUP shell 1 (substrate housing jig main body) side is seated is called a wafer tooth 8 (see FIGS. 4 and 5).

The inventor of the present invention has investigated the relationship between the direction and magnitude of the acceleration applied to the FOUP 20 and the generation of foreign matter. As a result, the number of foreign matter generated is extremely increased when the acceleration exceeds a certain value (threshold value). It has been found that there is a threshold value in any direction in which acceleration is applied, and the threshold value is highest when the acceleration direction is perpendicular to the BD plane. Therefore, in the present embodiment, when the FOUP 20 is transported, the FOUP 20
The FOUP 20 is held and conveyed so that the Bilteral Datum plane of is perpendicular to the conveying direction.

That is, in the present embodiment, referring to FIG. 8 described later, OHT (Overhead Hois)
t Transport : Overhead Hoist
Transport 10 is FOUP by lifting mechanism 12.
When holding the FOUP 20 by grasping the mushroom 3 of 20, the FOUP 20 is held as shown in FIG.
The BD surface of 20 is held so as to be perpendicular to the transport direction. Since the lifting mechanism 12 fixes the FOUP 20 to the OHT 10 main body while holding the mushroom 3 as the gripped member , the OHT 10 rotates the lifting mechanism 12 to adjust the positional relationship between the lifting mechanism 12 and the OHT 10 main body. In any case, the FOUP 20 can be held so that the BD surface of the FOUP 20 is perpendicular to the transport direction.

Next, the relationship between the acceleration and the increased number of foreign matters will be described with reference to FIGS. 6 and 7. FIG. 6 shows the FD surface (Facial)
FIG. 7 is a graph for explaining the experimental results of the increase of foreign matter when a sinusoidal vibration in the vertical direction is applied to the data plane, FIG. 7 is a BD plane (Bilateral Datum).
5 is a graph for explaining an experimental result of an increase in foreign matter when a sine wave vibration in a vertical direction is applied to the (plane). In the graphs of FIGS. 6 and 7, the horizontal axis is acceleration (the unit is [10
^-2 m / s ² ]), the vertical axis is the number of foreign particles increased (unit is [pieces])
Is. In addition, the number of increase in foreign matter on the vertical axis is displayed in logarithm.

When acceleration is applied perpendicularly to the FD surface, as shown in the graph of FIG. 6, it can be seen that the amount of foreign matter generated sharply increases as the acceleration increases. On the other hand, when acceleration is applied perpendicularly to the BD surface, it can be seen from the graph of FIG. 7 that the foreign matter does not increase so much even if the acceleration increases.

That is, in this embodiment, when the automatic transfer system (AMHS) holds the FOUP 20, the FO
By holding the BD surface of the UP 20 so as to be perpendicular to the transport direction, it is possible to maximize the allowable upper limit of acceleration.

Next, the reason why it is more preferable to make the carrying direction perpendicular to the BD surface is more preferable to make the carrying direction perpendicular to the FD surface with reference to FIG. FIG. 5 shows a wafer 7 and a wafer tooth 8.
And FOUP2 for explaining the positional relationship between the retainer 5 and
It is a top view of 0.

Referring to FIGS. 1 and 5, generally, FOUP
20 is a FOUP door 2 (board storage jig door) and FOUP
Since the shell 1 (board storage jig body) is separated, F
Wafer 7 when OUP door 2 (substrate storage jig door) is closed
In order to securely hold the FOUP, the retainer 5 provided on the FOUP door 2 (substrate storage jig door) is given elasticity (elasticity),
Wafer 7 when FOUP door 2 (substrate storage jig door) is closed
The shape of the retainer 5 is designed to press. Since the retainer 5 has elasticity (elasticity) as described above, when acceleration of a certain value or more is applied in the direction perpendicular to the FD surface of the FOUP 20, the wafer 7 vibrates in that direction (direction perpendicular to the FD surface). And wafer 7 and wafer teeth 8
It was found that rubbing between them resulted in the generation of foreign matter.

On the other hand, when acceleration is applied in the direction perpendicular to the BD surface of the FOUP 20, the wafer teeth 8 hold the wafer 7 in that direction (direction perpendicular to the BD surface). FOUP shell 1
Since it is fixed to the (substrate housing jig body), the wafer 7 and the wafer teeth 8 do not rub against each other, and no foreign matter is generated.

Of course, even if the acceleration is in the direction perpendicular to the BD surface, if the acceleration is too large, the wafer 7 is disengaged from the wafer teeth 8, and as a result, the wafer 7 is rubbed and foreign matter is generated.

Therefore, in the present embodiment, when the automatic transport system (AMHS) holds the FOUP 20, the FOU
It is configured to hold the BD surface of P20 so as to be perpendicular to the transport direction. As a result, it is possible to maximize the allowable upper limit of the acceleration, thereby improving the transport speed and providing an efficient semiconductor manufacturing line.

Next, regarding the automatic transport system (AMHS) using the FOUP 20, the OHT (Overhead)
The Hoist Transport will be described as an example with reference to FIG. Figure 8 shows FOUP2 using OHT10
0 schematic diagram of the system configuration of the automatic transfer outline system of FIG.
FIG. 9 is a perspective view for explaining one embodiment of OHT 10 in FIG. 8. In FIGS. 8 and 9, 3 is a mushroom, 9 is a processing device, 10 is an OHT, 11 is a load port on the stocker side, 12 is a lifting mechanism, 13 is a stocker, and 14
Indicates a load port on the processing device side, and 20 indicates a FOUP.

In the semiconductor factory, the wafer 7 to be processed is put into the FOUP 20 and moved between the processing devices 9. Thirty
FOUP 20 containing 0 mm size wafer 7 is about 8
Since it has a weight of kg, it is difficult to consider manual transportation for safety, and an automatic transportation system such as OHT10 is used. Hereinafter, as an example of the operation of the OHT 10 in the semiconductor factory, a series of operations in which the FOUP 20 containing the wafer 7 to be processed is supplied to the processing apparatus 9 and is processed and collected there will be described.

FOUP in which the wafers 7 to be processed are stored
20 is initially stored in the stocker 13 installed in the process. When the upper system instructs the supply of the wafer to the processing apparatus 9 (for example, the etching apparatus), the stocker 1
Numeral 3 conveys the FOUP 20 designated by the host to the delivery position (load port 11 on the stocker 13 side) to the OHT 10. The OHT 10 comes to a position above the load port 11 on the side of the stocker 13 and stops, and then the robot hand provided in the lifting mechanism (Hoist mechanism) 12 grabs the mushroom 3 of the FOUP 20 and FOUPs.
Pull up 20.

When the pulling up is completed, the OHT 10
The direction perpendicular to the BD surface of the UP 20 is detected from the direction of the mushroom 3, and if necessary, the lifting mechanism 12 is rotated to make the BD surface of the FOUP 20 perpendicular to the transport direction.

The OHT 10 conveys the FOUP 20 onto the load port 14 on the side of the processing apparatus 9 to be supplied. During this transportation, the BD surface of the FOUP 20 is kept perpendicular to the transportation direction.

Thereafter, the FOUP 20 is lowered by the lifting mechanism 12. The elevating mechanism 12 removes the mushroom 3 and ascends, and the FOUP 20 remains on the load port 14.

Thereafter, the door of the FOUP 14 is removed from the FOUP shell 1 (main body of the substrate storage jig), and the processing device 9
Performs the necessary processing by taking out the wafer 7 from the front surface of the FOUP 20. After the processing is completed, the processing apparatus 9 returns the processed wafer 7 to the FOUP 20.

The load port 14 fixes the FOUP door 2 (board housing jig door) to the FOUP shell 1 (board housing jig body). The empty OHT 10 is stopped on the load port 11 on the stocker 13 side by the transport request, and the lifting mechanism 1
The robot hand holds the mushroom 3 by 2 and pulls up the FOUP 20.

When the pulling up is completed, the OHT 10 detects the direction perpendicular to the BD surface of the FOUP 20 from the direction of the mushroom 3, and if necessary, rotates the elevating mechanism 12 to make the BD surface of the FOUP 20 perpendicular to the carrying direction. To do so.

After that, the OHT 10 conveys the FOUP 20 onto the load port 11 on the stocker 13 side. During this transportation, the BD surface of the FOUP 20 is kept perpendicular to the transportation direction.

After that, the FOUP 20 is lowered by the lifting mechanism 12. After that, the lifting mechanism 12 moves to the mushroom 3
The FOUP 20 is left on the load port 11 on the stocker 13 side.

Next, the load port 1 on the stocker 13 side
1 conveys the FOUP 20 into the stocker 13, and the stocker 13 stores the FOUP 20. After being temporarily stored there, the FOUP 20 is transported to the stocker 13 in the next processing step by interbay transport and stored there. In a semiconductor factory,
The above operation flow is repeated to form the necessary circuits on the wafer 7.

As described above, in the present embodiment, O
Since the HT 10 holds the FOUP 20 so that the BD surface of the FOUP 20 is always perpendicular to the carrying direction, the generation of foreign matter due to acceleration / deceleration during carrying can be suppressed.

In the above embodiment, an example in which the OHT 10 is used as the automatic transfer means has been described, but the invention is not particularly limited to this and the AGV (Automatic Gu) is used.
ided Vehicle), RGV (Rail Gu)
ided Vehicle), OHS (Over He)
ad Shuttle) may be used. AGV, RG
Regarding V and OHS, for example, "CIM / FA perspective and standard optimization in next-generation fabs"
(SEMI Japan SEMICON KANSA
I'99 June # 1999).

Finally, the technical difference between this embodiment and the conventional automatic transfer system (AMHS) using FOUP will be described. FIG. 8 is an example of an automatic transport system (AMHS) that uses a conventional FOUP.
T (Overhead Hoist Transport)
t ). It should be noted that although the reference numerals and names in parentheses in this embodiment are used to facilitate understanding, the present invention is not limited to the conventional F
It is not limited to the automatic transfer system (AMHS) using OUP.

Conventionally, in a semiconductor factory, a wafer (7) to be processed is placed in a FOUP (20) and a processing unit (9).
Move between. The FOUP (20) accommodating the 300 mm size wafer (7) has a weight of about 8 kg.
For safety reasons, it is difficult to consider manual transportation, and an automatic transportation system such as OHT (10) is used. Hereinafter, as an example of the OHT (10) operation in the semiconductor factory, a series of FOUPs (20) containing wafers (7) to be processed are supplied to a processing apparatus (9), where they are processed and collected. The operation will be described.

FO containing wafers (7) to be processed
The UP (20) was initially equipped with a stocker (1
It is stored in 3). When the wafer supply to the processing apparatus (9) (for example, etching apparatus) is instructed by the host system, the stocker (13) causes the FOUP designated by the host to be specified.
(20) is conveyed to the delivery position (loader (11) on the stocker (13) side) to the OHT (10). O
The HT (10) is a load port (1) on the stocker (13) side.
1) It comes to the top and stops, then the lifting mechanism (H
The robot hand provided in the (oist mechanism) 12 grabs the mushroom (3) of the FOUP (20) and FOs it.
Pull up the UP (20).

When the pulling up is completed, the OHT (10) conveys the FOUP (20) onto the load port (14) on the side of the processing device (9) to be supplied. Then FOUP
(20) is lowered by the lifting mechanism (12). The elevating mechanism (12) is lifted by removing the mushroom (3), whereby the FOUP (20) is left on the load port (14) on the processor (9) side.

Thereafter, the load port (14) on the side of the processing device (9) is the clamping mechanism (4) of the FOUP (20).
And remove the FOUP door (2) from the FOUP shell (1). FO when the FOUP door (2) is removed
The wafer (7) can be taken out from the front surface of the UP (20), the wafer transfer robot in the processing device (9) is operated, and the wafer (7) is carried to the processing unit in the processing device (9) and necessary processing is performed. I do. After the processing is completed, the processed wafer (7) is transferred to the FOUP (2
Return to 0).

After performing the necessary processing on the wafer (7) existing in the FOUP (20), the load port (14) on the processing apparatus (9) side opens the FOUP door (2) through the FOUP.
Clamping mechanism (4) docked with shell (1)
To fix the FOUP door (2) to the FOUP shell (1).

After that, the FOUP is retracted to the transfer position. Empty OHT (10) in response to transport request
Is stopped on the load port (11) on the side of the stocker (13), and the robot hand holds the mushroom (3) by the lifting mechanism (12) and pulls it up.

After that, the OHT (10) is replaced by the FOUP (2
0) is transported to the stocker (13), and the FOUP (20) is temporarily stored there and then transported to the next processing step. In the semiconductor factory, the above operation flow is repeated to form the necessary circuits on the wafer (7).

However, as described above, the conventional F
Automatic transfer system (AMHS: Aut) for OUP (20)
animated Material Handling
F) in the transport direction when transporting with (System) etc.
There was no suggestion for the orientation of OUP (20). Therefore, while suppressing the generation of foreign matter on the wafer 7 to a low level,
As a method of realizing a larger acceleration / deceleration, the direction of the FOUP (20) on the carrier device has not been specified.

Further, as is clear from the above operation flow, when the transfer capacity of the automatic transfer system (AMHS) (= upper limit of the number of FOUPs that can be transferred per unit time) is not sufficient, the automatic transfer system (AMHS) performs processing. There is a problem that the operating rate of the device 9 is reduced. For this reason, it is necessary to prepare the transfer capacity so as to match the processing capacity of the processing device 9. There are two measures for this purpose, one is to increase the number of automatic transfer system (AMHS) carriages and the other is to increase the transfer speed of each automatic transfer system (AMHS) carriage. Of these, increasing the number of dollies causes an increase in cost, so it is desirable to take measures to increase the carrying speed of the dolly. However, if the conveyance speed is increased, the acceleration also increases, and at the same time, the acceleration applied to the FOUP (20) also increases. This causes a problem of increasing the generation of foreign matter on the wafer 7.

On the other hand, in the present embodiment, the FOU
As a result of investigating the relationship between the direction and magnitude of the acceleration applied to P20 and the generation of foreign matter, when the acceleration exceeds a certain value (threshold value), the threshold value is such that the number of foreign matter generation increases extremely. When the FOUP 20 is transported, the threshold value is the highest when the acceleration direction is the direction perpendicular to the BD surface.
FOUP so that the m plane is perpendicular to the transport direction
By holding 20 and carrying, the generation of foreign matter due to the carrying is suppressed to a low level, and the carrying time is shortened. As a result, the automatic transport system (AMHS) is FO
When the UP20 is held, the BD surface of the FOUP20 is held so as to be perpendicular to the carrying direction, so that the generation of foreign matter due to the carrying can be suppressed to a low level, and the carrying time can be shortened, thereby realizing a highly efficient semiconductor production line. It has an effect that it can be configured.

[0066] Incidentally, the above embodiment is not particularly limited to a wafer used in a semiconductor device, the photo reticle (Reticle: circuitry original) substrate, a liquid crystal display panel substrate and Purazumade I spray panel such as a substrate for Contains various substrates such as display panel substrate, hard disk substrate, electronic device substrate such as semiconductor device,
The present invention can be applied to a board storage jig to be transported and stored, an evaluation adjustment jig and a jig calibration method for such a board storage jig. Further, it is obvious that the present invention is not limited to the above-mentioned embodiment, and the embodiment can be appropriately changed within the scope of the technical idea of the present invention. Further, the number, position, shape, etc. of the constituent members are not limited to those in the above-mentioned embodiment,
The number, position, shape, and the like suitable for implementing the present invention can be adopted. Moreover, in each figure, the same components are denoted by the same reference numerals.

[0067]

According to the present invention, when the substrate storage jig transfer system holds the FOUP, the BD surface of the FOUP is held so as to be perpendicular to the transfer direction, so that the generation of foreign matter due to the transfer is suppressed to a low level. In addition, the transport time has been shortened,
It is possible to construct a highly efficient semiconductor production line. Conventionally, when the FOUP is transported by an automatic transport system or the like, the FOU in the transport direction is used.
There was no suggestion about P's orientation. Therefore, the direction of FOUP on the carrier device has not been defined as a method for realizing a larger acceleration / deceleration while suppressing the generation of foreign matter on the wafer to a low level.

[Brief description of drawings]

FIG. 1 shows a FOUP (Fr according to an embodiment of the present invention.
FIG. 9 is a top view for explaining the relationship between the direction of the on-opening unified Pod) and the transport direction.

FIG. 2 is a perspective view for explaining an external configuration of a FOUP according to one embodiment of the present invention.

FIG. 3 is a perspective view for explaining the internal structure of the FOUP door of the FOUP of FIG.

4 is an FO for explaining the positional relationship between the wafer teeth and the wafer provided inside the FOUP of FIG.
It is a front view of UP.

FIG. 5 is a top view of the FOUP for explaining the positional relationship among the wafer, the wafer teeth, and the retainer.

[Fig. 6] FD surface (Facial Data pla
6 is a graph for explaining an experimental result of foreign matter increase in the case where a vertical sine wave vibration is applied to (ne).

FIG. 7: BD surface (Bilateral Datum)
5 is a graph for explaining an experimental result of an increase in foreign matter when a sine wave vibration in a vertical direction is applied to the (plane).

FIG. 8: OHT (Overhead Hoist T
Ransport) is a system configuration schematic schematic representation of an automatic transportable Okushi stearyl <br/> arm of the FOUP with.

9 is a perspective view for explaining one embodiment of the OHT of FIG.

[Explanation of symbols]

1 FOUP shell, 2 FOUP door, 3 mushroom, 4 clamping mechanism, 5 retainer, 6 sealing material, 7 wafers, 8 wafer teeth, 9 processing equipment, 10 OHT, 11 stocker side load port, 12 lifting mechanism, 13 stocker , 14 load port on the processor side, 20
FOUP.

Claims (3)

(57) [Claims] 1. A gripping the gripped member board housing jig having an elevation mechanism for moving the substrate housing jig, by grabbing the gripped member substrate storage jig the elevating mechanism, the substrate storage Osamu a substrate storage jig conveying system with a conveying means for bilateral datum plane of the ingredients are holding and conveying the substrate housing jig so that the conveying direction substantially perpendicular, said conveying means, said lifting mechanism By the board storage
Hold the member to be gripped and pull the board storage jig.
When the lifting work is completed,
The direction of the vertical direction of the surface of the tether datum is
While detecting from the direction, the detected gripped member
By rotating the lifting mechanism according to the direction,
Set the bilateral datum surface of the board storage jig as the transport direction.
A substrate storage jig having means for making the substrate substantially vertical
Holds the bilateral datum surface of the
Substrate configured to be transported
Storage jig transfer system . 2. The above-mentioned conveying means is an overhead whistle.
Substrate storage jig transfer system according to claim 1, characterized in that the preparative transport. 3. Holding the mushroom of the substrate storage jig
And a lift mechanism for moving the substrate storage jig.
Hold the mushroom of the board storage jig by
The bilateral datum surface of the plate storage jig is approximately
Auto-hold to hold the substrate storage jig so that it is vertical
Board with bar head hoist transport
A storage jig transfer system, wherein the overhead hoist transport is
By the lifting mechanism, the mashle of the substrate storage jig is
Complete the work of holding the board and pulling up the board storage jig.
When completed, the bilateral data of the board storage jig
The direction substantially perpendicular to the surface of the mushroom is detected from the direction of the mushroom.
In addition to knowing the direction of the detected mushroom
By rotating the elevating mechanism accordingly, the board
The bilateral datum surface of the storage jig is approximately perpendicular to the transport direction
And means to be a, the person substrate housing jig by
The lateral datum surface is held almost perpendicular to the transfer direction for transfer
The substrate storage jig transfer system is characterized by being configured as follows .