KR20010049231A - Method for conveying substrate receiving jig and automatic conveying system - Google Patents

Abstract

PURPOSE: To provide a method of transferring a substrate-housing jig and an automatic transfer system, which suppresses the growth of foreign matters due to transfer to a low level and realizes reduction of the transfer time. CONSTITUTION: This automatic transfer system comprises a means for holding and transferring an FOUP 20, such that the BD surface of the FOUP 20 is perpendicular to the transfer direction, while transferring it.

Description

Substrate storage jig conveying method and automatic conveying system {METHOD FOR CONVEYING SUBSTRATE RECEIVING JIG AND AUTOMATIC CONVEYING SYSTEM}

The present invention accommodates substrates such as substrates for photoreticles, display panel substrates such as liquid crystal monitor panel substrates and substrates for plasma display panels, substrates for electronic devices such as hard disk substrates, semiconductor devices, and the like. FOUP (Front Open Unified pod) technology, which is a next-generation substrate storage jig for transporting and storing, in particular, it is possible to reduce the generation of foreign substances due to conveyance at a low level and to shorten the transportation time. A substrate storage jig conveyance method and an automatic conveyance system.

When conveying the FOUP (front opening unit pod) system which is a next-generation board | substrate storage jig, it is necessary to make conveyance time as short as possible in order to improve the efficiency of a semiconductor manufacturing line. Moreover, it is necessary to make it as low as possible to adhere | attach the foreign material (for example, particle | grains, dust, etc.) to the wafer by conveyance. On the other hand, in order to shorten the conveyance time, it is necessary to increase the conveyance speed, and therefore, it is necessary to increase the acceleration with respect to the FOUP 20. However, increasing the acceleration tends to increase the adhesion of foreign matter to the wafer. For this reason, the conveyance method, such as suppressing generation | occurrence | production of a foreign material as much as possible, was calculated | required.

In this technical background, there is no proposal about the direction of the FOUP in the conveying direction when conveying the FOUP to an automated material handling system (AMHS).

For this reason, in order to realize a larger acceleration / deceleration rate while suppressing foreign matter generation on the wafer at a low level, the direction of the FOUP on the conveying device has not been defined.

First, the structure of the FOUP, which is the next-generation substrate storage jig, will be described.

The FOUP shell is the part that holds the wafer. The whole of the FOUP shell and the FOUP door is called FOUP.

Information such as dimensions is described in SEMI Standards E57, E 47.1 and the like. This wafer carrier, unlike the conventionally used open cassette (SEMI Standards E 1.9 or 8 inches or earlier), holds the wafer in a sealed space to protect the wafer from foreign matter and chemical contamination in the atmosphere. In order to maintain the sealing property, the sealing material (packing) is provided on the FOUP door, and the clamping mechanism (stopper mechanism) is provided on the FOUP door side to fix the FOUP door to the FOUP shell. It has a hole to become. In addition, what is called a retainer, when the FOUP door is fixed to the FOUP shell, the wafer is pressed and fixed. In addition, the horizontal beam which mounts the wafer on the FOUP shell side is called a wafer tooth.

Next, an automatic hoist transfer system (AMHS) using FOUP will be described as an example of an overhead hoist transfer (OHT).

Within the semiconductor factory, the wafers to be processed are placed in a FOUP and move between the processing devices. The FOUP containing the 300 mm wafer is about 8 kg in weight, so it is difficult to think of manual conveyance for safety reasons, and an automatic conveyance system such as OHT is used. Hereinafter, as an example of the 0HT operation in the semiconductor factory, a series of operations that are supplied to the processing apparatus with the FOUP in which the wafer to be processed is entered, processed therein and recovered are described.

The FOUP containing the wafer to be processed is first stored in a stocker installed in the process. When the wafer supply to the processing apparatus (for example, the etching apparatus) is instructed by the host system, the stocker conveys the designated FOUP from the host to the delivery position (load port on the stocker side) to the OHT.

The OHT comes to the load port on the stocker side and stops, and the robot hand holds the FOUP's mushroom by the lifting mechanism (Hoist mechanism), and raises the FOUP. When the pulling is completed, the OHT returns the FOUP to the load port on the side of the processing apparatus to be supplied.

The FOUP is lowered by the lifting mechanism. The lifting mechanism lifts off the mushroom and the FOUP is left on the load port on the processing apparatus side. The load port on the processing device side then removes the clamping mechanism of the FOUP to remove the FOUP door from the FOUP shell.

In the state where the FOUP door is removed, the wafer can be taken out from the front surface of the FOUP, and the wafer is transported to the processing unit inside the processing apparatus by a wafer transfer robot in the processing apparatus to perform the necessary processing. After the process is completed, the wafer processed by the wafer transfer robot is returned to the FOUP.

After performing the necessary processing on the wafer present in the FOUP, the load port on the processing apparatus side docks the FOUP door with the FOUP shell to act the clamping mechanism and fixes the FOUP door to the FOUP shell. The FOUP is then retracted and placed in the mobile payload position.

The empty OHT stops on the stocker side load port by the transfer request, and the robot hand holds the mushroom by the lifting mechanism and pulls it up. The OHT then returns the FOUP to the stocker, where the FOUP is temporarily stored there and then transported to the next processing step. In a semiconductor factory, the above-described operation flow is repeated to form a necessary circuit on a wafer.

However, as can be seen from the above-mentioned operation flow, when the conveyance capacity (= upper limit of the number of FOUPs that can be conveyed per unit time) of the automatic conveyance system AMHS is not sufficient, the automatic conveyance system AMHS is operated at the operation rate of the processing apparatus. Will lower. For this reason, there existed a problem that a conveyance capacity needs to be prepared enough to match the process capability of a processing apparatus.

As a prior art aiming at solving such a problem, the technique of increasing the number of trolley | bogies of an automatic conveyance system (AMHS), and the technique of raising the conveyance speed of the trolley | bogie of each automatic conveyance system (AMHS) are disclosed. have. Among these, increasing the balance causes an increase in cost, and therefore, it is considered that a technique of increasing the transfer speed of the balance is preferable. However, if the conveyance speed is increased, the acceleration is also increased, and at the same time, the acceleration with respect to the FOUP is also increased. As a result, there has been a problem that it becomes a factor of increasing the generation of foreign matter on the wafer.

This invention is made | formed in order to solve the above problems, It aims at obtaining the board | substrate accommodation jig conveyance method and automatic conveyance system which suppress the generation | occurrence | production of the foreign material by conveyance at low level, and realize shortening of conveyance time.

The board | substrate storage jig conveyance method which concerns on invention of Claim 1 of the present invention is a board | substrate accommodation jig conveyance method which suppresses the generation | occurrence | production of the foreign material by board | substrate conveyance, and realizes shortening of a board | substrate conveyance time, Comprising: It has a process of conveying the board | substrate accommodation jig | tool to hold | maintain in the state which hold | maintained the said board | substrate accommodation jig so that the bilateral data surface of the said board | substrate accommodation jig may be substantially perpendicular to a conveyance direction.

The board | substrate storage jig conveyance method which concerns on invention of Claim 2 is a board | substrate accommodation jig conveyance method which suppresses the generation | occurrence | production of the foreign material by board | substrate conveyance, and realizes shortening of a board | substrate conveyance time, The board | substrate which accommodates, conveys, and stores a board | substrate. It has a process of conveying an accommodating jig in the state which hold | maintained the said substrate accommodating jig so that the lateral data surface of the said substrate accommodating jig exists in the range of a predetermined angle with respect to a conveyance direction.

The board | substrate storage jig conveyance method which concerns on invention of Claim 3 is a board | substrate accommodation jig conveyance method which suppresses the generation | occurrence | production of the foreign material by board | substrate conveyance, and realizes shortening of a board | substrate conveyance time, The board | substrate which accommodates, conveys, and stores a board | substrate. It has a process of conveying an accommodating jig | tool in the state which hold | maintained the said substrate accommodating jig so that the lateral data surface of the said board | substrate accommodating jig may be within +/- 30 degrees in a conveyance direction.

The board | substrate storage jig conveyance method which concerns on invention of Claim 4 is a board | substrate accommodation jig conveyance method which suppresses the generation | occurrence | production of the foreign material by board | substrate conveyance, and realizes shortening of a board | substrate conveyance time, The wafer as said board | substrate at the time of semiconductor device manufacture. And a step of conveying the wafer carrier as a substrate storage jig for storing, transporting, and storing the substrate in a state in which the substrate storage jig is held so that the viral data surface of the wafer carrier is substantially perpendicular to the transport direction.

The board | substrate storage jig conveyance method which concerns on invention of Claim 5 is a board | substrate accommodation jig conveyance method which suppresses the generation | occurrence | production of the foreign material by board | substrate conveyance, and realizes shortening of a board | substrate conveyance time, The wafer as said board | substrate at the time of semiconductor device manufacture. And a wafer carrier serving as a substrate storage jig for storing, transporting, and storing the substrate in a state in which the substrate storage jig is held so that the viral data surface of the wafer carrier is within approximately ± 30 ° in the transport direction.

In the substrate storage jig conveyance method which concerns on invention of Claim 6, in the invention of Claim 4 or 5, the said wafer carrier is a front opening unit pod.

An automatic conveyance system according to the invention according to claim 7 is an automatic conveyance system that suppresses foreign matter generation due to substrate conveyance at a low level and realizes shortening of substrate conveyance time, comprising: a substrate accommodating jig for accommodating, transporting, and storing a substrate; A lifting mechanism for moving the substrate storage jig in a state of holding the mushroom of the substrate storage jig, and the substrate storage jig being held by the lifting mechanism to hold the substrate of the substrate storage jig to hold the substrate storage jig. And an overhead hoist transferr for holding the viral data surface of the storage jig substantially perpendicular to the conveying direction, wherein the overhead hoist transferr holds the mushroom of the substrate storage jig by the lifting mechanism. When holding the storage jig, the substrate storage jig is the substrate storage jig The bilateral data surface of the substrate is held to be substantially perpendicular to the conveying direction, and the substrate holding jig is fixed to the overhead hoist transfer body while the elevating mechanism grips the mushroom. The board hoist transferer rotates the lifting mechanism to adjust the positional relationship between the lifting mechanism and the overhead hoist transfer body so that the lateral data surface of the substrate storage jig is approximately perpendicular to the conveying direction. It is configured to hold the jig.

An automatic conveyance system according to the invention according to claim 8 is an automatic conveyance system that suppresses foreign matter generation due to substrate conveyance at a low level and realizes a reduction in substrate conveyance time, comprising: a substrate storage jig for storing, transporting, and storing a substrate; A lifting mechanism for moving the substrate storage jig in a state of holding the mushroom of the substrate storage jig, and the substrate storage jig being held by the lifting mechanism to hold the substrate of the substrate storage jig to hold the substrate storage jig. It is equipped with the overhead hoist transfer which keeps the bilateral data surface of a storage jig in the range of a predetermined angle with respect to a conveyance direction, and the said overhead hoist transferr grasps the mushroom of the said board | substrate storage jig by the said lifting mechanism. When holding the substrate storage jig, the substrate storage jig is The bilateral data surface of the plate storage jig is kept within the range of the conveying direction and the predetermined angle, and the substrate storage jig is fixed to the overhead hoist transfer body while the lifting mechanism grips the mushroom. Subsequently, the overhead hoist transferr rotates the elevating mechanism to adjust the positional relationship between the elevating mechanism and the overhead hoist transfer body to move the viral data surface of the substrate accommodating jig in the conveying direction and the It is comprised so that the said board | substrate accommodation jig may be kept in the range of a predetermined angle.

An automatic conveyance system according to the invention according to claim 9 is an automatic conveyance system that suppresses foreign matter generation due to substrate conveyance at a low level and realizes a shortening of substrate conveyance time, comprising: a substrate storage jig for storing, transporting, and storing a substrate; A lifting mechanism for moving the substrate storage jig in a state of holding the mushroom of the substrate storage jig, and the substrate storage jig being held by the lifting mechanism to hold the substrate of the substrate storage jig to hold the substrate storage jig. An overhead hoist transferr which maintains the bilateral data surface of the storage jig within approximately ± 30 ° with respect to the conveying direction, and the overhead hoist transferr is a mushroom of the substrate storage jig by the lifting mechanism. When holding the substrate holding jig to hold the substrate holding jig, The bilateral data surface of the storage jig is kept within the transport direction and approximately ± 30 °, and the substrate storage jig is fixed to the overhead hoist transfer body while the lifting mechanism grips the mushroom. Subsequently, the overhead hoist transferr rotates the elevating mechanism to adjust the positional relationship between the elevating mechanism and the overhead hoist transfer body to move the viral data surface of the substrate accommodating jig in the conveying direction and the It is comprised so that the said board | substrate accommodation jig may be within about +/- 30 degrees.

The automatic conveyance system according to the invention according to claim 10 is an automatic conveyance system that suppresses the generation of foreign substances due to wafer conveyance as a substrate at the time of semiconductor device manufacture and realizes a shortening of the substrate conveyance time. A wafer carrier serving as a substrate storage jig to be stored, a lifting mechanism for moving the wafer carrier in a state of holding the mushroom of the wafer carrier, and the holding mechanism of the wafer carrier by the lifting mechanism to hold the wafer carrier; An overhead hoist transferr for holding a wafer carrier such that the viral data surface of the wafer carrier is within a range of a predetermined angle with respect to a conveying direction, wherein the overhead hoist transferr is configured to move the wafer carrier by the lifting mechanism. Grab a mushroom When the wafer carrier is held, the wafer carrier is held so that the lateral data surface of the wafer carrier is within a range of a conveying direction and the predetermined angle, and then the overhead mechanism is held by the lifting mechanism holding the mushroom. The wafer carrier is fixed to the hoist transfer body, and then the overhead hoist transferer rotates the lifting mechanism to adjust the positional relationship between the lifting mechanism and the overhead hoist transfer body to adjust the position of the wafer carrier. The wafer carrier is configured to hold the bilateral data surface within a range of a conveying direction and the predetermined angle.

The automatic conveying system according to the invention according to claim 11 is an automatic conveying system which suppresses the generation of foreign matter due to wafer conveyance as a substrate at the time of semiconductor device manufacture and realizes a shortening of the conveyance time of the wafer. A wafer carrier serving as a substrate storage jig to be stored, a lifting mechanism for moving the wafer carrier in a state in which the mushroom of the wafer carrier is held, and the mushroom holder of the wafer carrier is held by the lifting mechanism to hold the wafer carrier. An overhead hoist transferr for holding the wafer carrier so that the lateral data surface of the wafer carrier is substantially perpendicular to the conveying direction, wherein the overhead hoist transferer is configured to move the mushroom of the wafer carrier by the lifting mechanism. Hold the wafer carry When holding the wafer, the wafer carrier is held so that the lateral data surface of the wafer carrier is substantially perpendicular to the conveying direction, and then, the lifter grips the mushroom to the overhead hoist transfer body. The wafer carrier is fixed, and the overhead hoist transferr then rotates the lifting mechanism to adjust the positional relationship between the lifting mechanism and the overhead hoist transfer body to convey the viral data surface of the wafer carrier. The wafer carrier is configured to be substantially perpendicular to the direction.

The automatic transfer system according to the invention according to claim 12 is an automatic transfer system that suppresses foreign matter generation due to wafer transfer as a substrate at the time of semiconductor device manufacture and realizes a shortening of the substrate transfer time. A wafer carrier serving as a substrate storage jig to be stored, a lifting mechanism for moving the wafer carrier in a state of holding the mushroom of the wafer carrier, and the holding mechanism of the wafer carrier by the lifting mechanism to hold the wafer carrier; An overhead hoist transferr for holding the wafer carrier so that the lateral data surface of the wafer carrier is within approximately ± 30 ° with respect to the conveying direction, and the overhead hoist transferr is moved by the lifting mechanism to the wafer carrier. Hold the mushroom in the wafer When holding the carrier, the wafer carrier is held so that the lateral data surface of the wafer carrier is within approximately ± 30 ° of the conveying direction, and subsequently the overhead hoist with the lifting mechanism holding the mushroom. The wafer carrier is fixed to the transfer body, and then the overhead hoist transferer rotates the lifting mechanism to adjust the positional relationship between the lifting mechanism and the overhead hoist transfer body to bypass the wafer carrier. It is configured to hold the wafer carrier so that the lateral data surface is within the direction of conveyance and approximately ± 30 °.

In the automatic transfer system according to the invention according to claim 13, in the invention according to any one of claims 10 to 12, the wafer carrier is a front opening unit pod.

In the automatic conveyance system according to the invention according to claim 14, in the invention according to claim 11 or 13, the overhead hoist transfer device includes a robot hand provided in the lifting mechanism to hold the mushroom of the substrate storage jig. When the work for pulling up the substrate storage jig is completed, a direction substantially perpendicular to the viral data surface of the substrate storage jig is detected from the direction of the mushroom, and the lifting mechanism is rotated in accordance with the direction of the detected mushroom. Means for conveying the viral data surface of the substrate storage jig substantially perpendicular to the conveying direction, and conveying the viral data surface of the substrate storage jig when conveying the substrate storage jig up onto the load port on the processing apparatus side to be supplied. It is configured to keep approximately perpendicular to the direction.

As for the automatic conveyance system which concerns on invention of Claim 15, in the invention of Claim 11 or 13, the said overhead hoist transfer machine stops itself on the said load port by the side of a stocker by conveyance request, When the robot hand grips the mushroom and lifts the substrate storage jig by the lifting mechanism, the direction substantially perpendicular to the viral data surface of the substrate storage jig is detected from the direction of the mushroom. And a means for rotating the lifting mechanism in the direction of the detected mushroom so that the viral data surface of the substrate storing jig is substantially perpendicular to the conveying direction, and conveying the substrate storing jig up to the load port on the stocker side. The bilateral data surface of the substrate storage jig against the conveyance direction. It is configured to keep it vertical.

As for the automatic conveyance system which concerns on invention of Claim 16, the invention of Claim 10 or 13 WHEREIN: The overhead hoist transfer apparatus is a robot hand provided in the said lifting mechanism grasping the said mushroom of the said board | substrate accommodation jig | tool. When the work for pulling up the substrate storage jig is completed, a direction of a predetermined angle with respect to the viral data surface of the substrate storage jig is detected from the direction of the mushroom, and the lifting mechanism is moved along the direction of the detected mushroom. Means for rotating the viral data surface of the substrate accommodating jig within a range of a predetermined angle with respect to the conveying direction, and when conveying the substrate accommodating jig up to the load port on the processing apparatus side to be supplied, the substrate accommodating jig The bilateral data plane of is given in relation to the conveying direction. It is comprised so that it may remain in the range of an angle.

As for the automatic conveyance system which concerns on invention of Claim 17, in the invention of Claim 10 or 13, the said overhead hoist transfer machine stops itself on the said load port by the side of a stocker by conveyance request, When the robot hand grips the mushroom and lifts the substrate storage jig by the lifting mechanism, the direction of a predetermined angle with respect to the viral data surface of the substrate storage jig is detected from the direction of the mushroom. And means for rotating the lifting mechanism in accordance with the detected mushroom direction so that the bilateral data surface of the substrate accommodating jig is in a range of a predetermined angle with respect to a conveying direction, and up to the load port on the stocker side. Viral day of the substrate storage jig when transporting the storage jig The other surface is comprised so that it may remain in the range of a predetermined angle with respect to a conveyance direction.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view for explaining a relationship between a direction and a conveying direction of a front opening unified pod (FOUP) according to one embodiment of the present invention;

2 is a perspective view for explaining an appearance configuration of a FOUP according to one embodiment of the present invention;

Fig. 3 is a perspective view for explaining the constitution of the inside of the FOUP door of the FOUP of Fig. 1;

Fig. 4 is a front view of the FOUP for explaining the positional relationship between a wafer tooth and a wafer provided inside the FOUP of Fig. 1;

5 is a plan view of a FOUP for explaining the positional relationship between a wafer, a wafer tooth, and a retainer;

Fig. 6 is a graph for explaining an experimental result of foreign matter increase when sine wave vibration perpendicular to the FD plane (face data plane) is applied.

Fig. 7 is a graph for explaining an experimental result of foreign matter increase when a sinusoidal vibration in the vertical direction is applied to the BD plane (bilateral data plane).

8 is a system configuration schematic diagram of an automatic conveyance system of FOUP using OHT (Overhead Ho1st Transfer).

FIG. 9 is a perspective view for explaining an embodiment of the OHT in FIG. 8; FIG.

<Explanation of symbols for main parts of drawing>

1: FOUP shell

2: FOUP door

3: Mushroom

4: Clamping Mechanism

5: retainer

6: seal material

7: wafer

8: wafer tooth

9: processing unit

10: OHT

11: Load port of stocker side

12 lifting mechanism

13: stalker

14: load port on processing unit side

20: FOUP

When transporting a front opening unified pod (FOUP) system, which is a next-generation substrate storage jig, it is necessary to shorten the transport time in order to increase the efficiency of the semiconductor manufacturing line. In addition, it is necessary to lower the foreign matter (for example, particles, dust, etc.) to the wafer by conveyance as much as possible. On the other hand, in order to shorten a conveyance time, it is necessary to raise conveyance speed, and therefore, it is necessary to enlarge acceleration regarding FOUP. However, increasing the acceleration tends to increase the adhesion of foreign matter to the wafer. For this reason, the conveyance method which suppresses generation | occurrence | production of a foreign material as much as possible was desired.

Based on this technical background, the inventor of the present invention examines the relationship between the direction, magnitude, and foreign matter generation of the acceleration applied to the FOUP. As a result, when the acceleration reaches a certain value (threshold value), the threshold value at which the number of foreign matters is extremely increased. Is present even in the case where acceleration is applied in any direction, and the threshold is obtained with the new knowledge that the acceleration is most likely in the direction perpendicular to the BD plane.

The present invention has been made on the basis of the above-mentioned novel knowledge. When carrying a FOUP, the FOUP 20 is held and conveyed so that the bilateral data plane of the FOUP is perpendicular to the conveying direction, whereby foreign matter generation due to conveyance is brought to a low level. It is characteristic in that it suppresses and shortens a conveyance time. EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described based on drawing.

First, the structure of FOUP (Front Opening Unified Pod), which is a next-generation substrate storage jig, will be described with reference to FIGS. 1, 2, 3, 4, and 5.

1 is a plan view for explaining the relationship between the direction of the FOUP 20 and the conveying direction according to an embodiment of the present invention, Figure 2 is a perspective view for explaining the appearance configuration of the FOUP 20 of Figure 1, Figure 3 Is a perspective view for explaining the configuration of the inside of the FOUP door 2 (substrate storage jig door) of the FOUP 20 of FIG. 1, and FIG. 4 is a wafer tooth 8 provided inside the FOUP 20 of FIG. And a front view of the FOUP 20 for explaining the positional relationship between the wafer 7 and FIG. 5 is a FOUP 20 for explaining the positional relationship between the wafer 7, the wafer teeth 8, and the retainer 5. Top view of the.

1 and 2, 1 is a FOUP shell (substrate storage jig main body), 2 is a FOUP door, 3 is a mushroom, 20 is a FOUP, and an FD plane is a virtual reference plane called a facial data plane, and a BD plane is a bilateral data plane. In Fig. 3, 4 is a clamping mechanism, 5 is a retainer, 6 is a sealing material, and in Fig. 4, 7 is a wafer and 8 is a wafer tooth.

In the FOUP 20 of the present embodiment shown in Figs. 1 and 2, the FOUP shell 1 (substrate storage jig main body) is a portion holding the wafer 7 (see Fig. 4). The whole of the FOUP shell 1 (substrate storage jig main body) and the FOUP door 2 (substrate storage jig door) is called the FOUP 20.

In addition, in the following description, although the term BD surface and FD surface is used, the BD surface is a plane which bisects the FOUP 20 to the left and right, and the FD surface is a plane parallel to the carrier front surface (see Fig. 2). A precise definition of these is given in SEMI Standard E47.1.

Information such as dimensions is described in SEMI Standards E57, E47.1 and the like. The wafer carrier called the FOUP 20 is different from the conventionally used open cassette (an 8-inch open cassette described in the SEC Standards E1.9, etc.). This is to protect the wafer 7 from foreign matter and chemical contamination. In addition, as shown in Fig. 3, in order to maintain hermeticity, a sealing material (packing) 6 is provided around the FOUP door 2 (substrate storage jig door), and the FOUP door 2 (substrate storage jig) is provided. Clamping mechanism 4 (in other words, stopper mechanism) as shown in Fig. 3 on the side of the FOUP door 2 (substrate storage jig door) to fix the door to the FOUP shell 1 (substrate storage jig main body). In addition, the fixing hole of the FOUP door 2 (substrate storage jig door) is provided at the position correlated with the clamping mechanism 4 on the FOUP shell 1 (substrate storage jig main body) side.

Also referred to as retainer 5 (see FIGS. 3 and 5), when the FOUP door 2 (substrate storage jig door) is fixed to the FOUP shell 1 (substrate storage jig main body) as shown in FIG. The wafer 7 is pressed and fixed. In addition, the horizontal beam which mounts the wafer 7 by the side of the FOUP shell 1 (substrate accommodation jig main body) is called the wafer tooth 8 (refer FIG. 4, FIG. 5).

As a result of investigating the relationship between the direction, magnitude of the acceleration applied to the FOUP 20 and the occurrence of foreign matters, the inventors of the present invention show that the threshold value at which the number of occurrences of foreign matters increases in a certain direction is greater than a certain value (threshold value) with acceleration. It is also found that the acceleration is applied, and the threshold is found to be the highest when the direction of acceleration is perpendicular to the BD plane. Therefore, on the basis of the novel knowledge, the present embodiment holds and conveys the FOUP 20 so that the bilateral data plane of the FOUP 20 is perpendicular to the conveying direction when conveying the FOUP 20.

That is, in the present embodiment, the OHT (Overhead Hoist Transfer) 10 holds the mushroom 3 of the FOUP 20 by the lifting mechanism 12 to hold the FOUP 20. As shown in Fig. 1, the FOUP 20 is held such that the BD surface of the FOUP 20 is perpendicular to the conveying direction. Since the lifting mechanism 12 fixes the FOUP 20 to the OHT 10 main body while holding the mushroom 3, the OHT 10 rotates the lifting mechanism 12 to lift the lifting mechanism 12 and the OHT 10. By adjusting the positional relationship of the main body, the FOUP 20 can be held so that the BD surface of the FOUP 20 is perpendicular to the conveying direction in any case.

Next, the relationship between the acceleration and the number of foreign matter increase will be described with reference to FIGS. 6 and 7. Fig. 6 is a graph for explaining the experimental results of the foreign matter increase when the sinusoidal vibration in the vertical direction is applied to the FD plane (the facial data plane), and Fig. 7 shows the sinusoidal vibration in the vertical direction to the BD plane (the bilateral data plane). It is a graph for demonstrating the experimental result of the foreign material increase at the time of addition. In the graphs of Figs. 6 and 7, the horizontal axis represents acceleration (unit: 10-2 kPa), and the vertical axis represents foreign matter increase (unit). In addition, the foreign material increase number of a vertical axis | shaft is made into the logarithm display.

In the case where acceleration is applied perpendicularly to the FD plane, as shown in the graph of Fig. 6, it can be seen that as the acceleration increases, the foreign matter generation amount increases rapidly. On the other hand, when the acceleration is applied to the BD plane vertically, as shown in the graph of Fig. 7, it can be seen that the foreign matter does not increase that much even if the acceleration increases.

That is, in the present embodiment, when the automatic conveying system AMHS holds the FOUP 20, the allowable upper limit of acceleration is maximized by keeping the BD surface of the FOUP 20 perpendicular to the conveying direction. You can do it.

Next, referring to FIG. 5, the reason why the conveyance direction is perpendicular to the BD plane is more preferable than the conveyance direction is perpendicular to the FD plane. 5 is a plan view of the FOUP 20 for explaining the positional relationship between the wafer 7, the wafer teeth 8, and the retainer 5.

1 and 5, in general, the FOUP 20 has a FOUP door 2 because the FOUP door 2 (substrate storage jig door) and the FOUP shell 1 (substrate storage jig main body) are separated. In order to reliably hold the wafer 7 when the substrate storage jig door is closed, the retainer 5 provided in the FOUP door 2 (substrate storage jig door) has elasticity (elasticity), and the FOUP door (2) The shape of the retainer 5 is designed to press the wafer 7 at the time of closing (substrate storage jig door). Since the retainer 5 has elasticity (elasticity) in this manner, if an acceleration of a certain value or more is applied in the direction perpendicular to the FD plane of the FOUP 20, the wafer 7 is in the direction perpendicular to the FD plane. And vibrated between the wafer 7 and the wafer tooth 8, and as a result, it was found that foreign matters were generated.

On the other hand, when the acceleration is applied to the BD plane of the FOUP 20 in the vertical direction, the wafer 7 is held by the wafer tooth 8 in the direction (the direction perpendicular to the BD plane). 8) is fixed to the FOUP shell 1 (substrate housing jig main body), so that the wafer 7 and the wafer tooth 8 do not rub, and no foreign matter is generated.

Of course, even if the acceleration in the vertical direction to the BD plane is too large, the wafer 7 is peeled off from the wafer tooth 8, and as a result, friction of the wafer 7 occurs, and foreign matter is generated.

Therefore, in this embodiment, when the automatic conveyance system AMHS holds the FOUP 20, it is comprised so that the BD surface of the FOUP 20 may be perpendicular to a conveyance direction. As a result, the allowable upper limit of acceleration can be maximized, whereby the transfer speed can be improved, and an efficient semiconductor manufacturing line can be formed.

Next, an automatic transfer system (AMHS) using the FOUP 20 will be described with reference to FIG. 8 as an example of the overhead hoist transfer (OHT).

8 is a system configuration schematic diagram of an automatic conveyance system of the FOUP 20 using the OHT 10, and FIG. 9 is a perspective view for explaining an embodiment of the OHT 10 of FIG. 8 and 9, 3 is a mushroom, 9 is a processing apparatus, 10 is an OHT, 11 is a load port on the stocker side, 12 is a lifting mechanism, 13 is a stocker, 14 is a load port on the processing apparatus side, and 20 is a FOUP. Is shown.

In the semiconductor factory, the wafer 7 subjected to processing is placed in the FOUP 20 and moves between the processing apparatuses 9. Since the FOUP 20 containing the wafer 7 having a 300 mm size has a weight of about 8 kg, manual conveyance is difficult to consider for safety reasons, and an automatic conveyance system such as the OHT 10 is used. Hereinafter, as an example of the operation of the OHT 10 in the semiconductor factory, a series of operations to be supplied to the processing apparatus 9 with the FOUP 20 containing the wafer 7 to be processed and processed therein will be described. do.

The FOUP 20 in which the wafer 7 to be processed is stored is first stored in the stocker 13 provided in the process. When the wafer supply to the processing apparatus 9 (for example, an etching apparatus) is instructed by the host system, the stocker 13 exchanges the designated FOUP 20 from the upper apparatus to the OHT 10 (load on the stocker 13 side). The OHT 10 stops when the OHT 10 comes to the top of the load port 11 on the stocker 13 side, and then the robot hand installed on the lifting mechanism (Hoist mechanism) 12 is FOUP. Hold the mushroom 3 of 20 to raise the FOUP 20.

When the pulling is completed, the OHT 10 detects the direction perpendicular to the BD plane of the FOUP 20 from the direction of the mushroom 3, and if necessary, rotates the lifting mechanism 12 to rotate the BD plane of the FOUP 20. Perpendicular to the conveying direction.

The OHT 10 conveys the FOUP 20 onto the load port 14 on the processing apparatus 9 side to be supplied. At the time of this conveyance, the BD surface of the FOUP 20 is maintained perpendicular to the conveyance direction.

Thereafter, the FOUP 20 is lowered to the lifting mechanism 12. The lifting mechanism 12 rises out of the mushroom 3, and the FOUP 20 is left on the load port 14.

Thereafter, the door of the load port 14 is removed from the FOUP shell 1 (substrate storage jig main body), and the processing apparatus 9 takes out the wafer 7 from the front surface of the FOUP 20 and performs necessary processing. . After the processing is completed, the processing apparatus 9 returns the wafer 7 on which the processing is completed, to the FOUP 20.

The load port 14 fixes the FOUP door 2 (substrate storage jig door) to the FOUP shell 1 (substrate storage jig main body). The OHT 10 of the beam stops on the load port 11 on the stocker 13 side by the transfer request, and the robot hand grasps the mushroom 3 by the lifting mechanism 12 to lift the FOUP 20. do.

When the pulling is completed, the OHT 10 detects the direction perpendicular to the BD surface of the FOUP 20 from the direction of the mushroom 3, and if necessary, rotates the lifting mechanism 12 to thereby rotate the BD surface of the FOUP 20. Is perpendicular to the conveying direction.

Thereafter, the OHT 10 carries the FOUP 20 up to the load port 11 on the stocker 13 side. During this conveyance, the BD surface of the FOUP 20 is held perpendicular to the conveyance direction.

Thereafter, the FOUP 20 is lowered to the lifting mechanism 12. Thereafter, the elevating mechanism 12 rises out of the mushroom 3, and the FOUP 20 is left on the load port 11 on the stocker 13 side.

Subsequently, the load port 11 on the stocker 13 side conveys the FOUP 20 into the stocker 13, and the stocker 13 stores the FOUP 20. After the FOUP 20 is temporarily stored there, it is transported to the stocker 13 of the next treatment step by conveyance between bays and stored there. In a semiconductor factory, the above-mentioned operation flow is repeated to form necessary circuits on the wafer 7.

As described above, in the present embodiment, since the OHT 10 always holds the FOUP 20 so that the BD surface of the FOUP 20 and the conveying direction are perpendicular to each other, foreign matters caused by acceleration and deceleration during conveyance can be suppressed. have.

In the above embodiment, an example in which the OHT 10 is used as the automatic conveyance has been described. However, the present invention is not limited thereto, and an AGV (Automatic Guided Vehicle), a RGV (Rail Guided Vehicle), or an OHS (Over Head Shuttle) may be used. . AGV, RGV, and OHS are described, for example, in "Optimization of CIM / FA in Next-Gen Pub and Optimization of Standard" (SEMI Japan SEMICON KANSAI '99 June # 1999).

Finally, the technical difference will be described in comparison with the present embodiment and the automatic conveyance system (AMHS) using the conventional FOUP. 8 is an overhead hoist transfer (OHT) which is an example of an automatic transfer system (AMHS) using a conventional FOUP. In addition, although the code | symbol in parentheses of this embodiment is used for the sake of understanding, this invention is not limited to the automatic conveyance system (AMHS) using the conventional FOUP.

Conventionally, in a semiconductor factory, a wafer 7 subjected to processing is placed in a FOUP 20 and moves between the processing apparatuses 9. Since the FOUP 20 containing the wafer 7 having a 300 mm size has a weight of about 8 kg, manual conveyance is difficult to consider for safety reasons, and an automatic conveyance system such as the OHT 10 is used. Hereinafter, as an example of the operation of the OHT 10 in the semiconductor factory, a series of operations to be supplied to the processing apparatus 9 with the FOUP 20 containing the wafer 7 to be processed and processed therein will be described. do.

The FOUP 20 in which the wafer 7 to be processed is stored is first stored in the stocker 13 provided in the process. When the wafer supply to the processing apparatus 9 (for example, an etching apparatus) is instructed from the host system, the stocker 13 exchanges the designated FOUP 20 from the upper apparatus to the OHT 10 (load on the stocker 13 side). The OHT 10 comes to the top of the load port 11 on the stocker 13 side and stops. Then, the robot hand installed in the lifting mechanism (Hoist mechanism) 12 FOUPs. Hold the mushroom 3 of 20 to raise the FOUP 20.

When the pulling is completed, the OHT 10 conveys the FOUP 20 up to the load port 14 on the processing apparatus 9 side to be supplied. Thereafter, the FOUP 20 is lowered to the lifting mechanism 12. The elevating mechanism 12 rises out of the mushroom 3, whereby the FOUP 20 is left on the load port 14 on the processing apparatus 9 side.

The load port 14 on the processing apparatus 9 side then removes the clamping mechanism 4 of the FOUP 20 and removes the FOUP door 2 from the FOUP shell 1. In the state in which the FOUP door 2 is peeled off, the wafer 7 can be taken out from the front surface of the FOUP 20, and the wafer transfer robot in the processing apparatus 9 is operated to move the wafer 7 into the processing apparatus 9. It carries to the processing part of and performs necessary process. After the processing is completed, the wafer 7 whose processing has been completed by the wafer transfer robot is returned to the FOUP 20.

After performing the necessary processing on the wafer 7 present in the FOUP 20, the load port 14 on the processing apparatus 9 side docks the FOUP door 2 with the FOUP shell 1 to clamp the clamping mechanism 4. ) And secure the FOUP door (2) to the FOUP shell (1).

Thereafter, the FOUP is retracted and positioned at the mobile payload position. The OHT 10 of the beam stops on the load port 11 on the stocker 13 side in accordance with the transfer request, and the robot hand grasps the mushroom 3 by the lifting mechanism 12.

Thereafter, the OHT 10 returns the FOUP 20 to the stocker 13, and the FOUP 20 is temporarily stored there and then transferred to the next processing step. In a semiconductor factory, the above-mentioned operation flow is repeated to form necessary circuits on the wafer 7.

As described above, however, there has been no proposal regarding the direction of the FOUP 20 in the conveying direction when conveying the FOUP 20 in an automated conveying system (AMHS). For this reason, the direction of the FOUP 20 on the conveying apparatus has not been defined as a method of realizing a larger acceleration / deceleration while suppressing foreign matter generation on the wafer 7 at a low level.

In addition, as can be seen from the above-mentioned operation flow, when the conveyance capacity (= upper limit of the number of FOUPs that can be conveyed per unit time) of the automatic conveyance system AMHS is not sufficient, the automatic conveyance system AMHS is the processing apparatus 9. There was a problem that the operation rate of the product was lowered. For this reason, the conveyance capacity needs to be prepared so as to match the process capacity of the processing apparatus 9. There are two measures for this purpose: a measure of increasing the number of AMHS trolleys and a measure of increasing the conveyance speed of each AMHS trolley. Among these, increasing the balance causes an increase in cost, and therefore, a method of increasing the conveyance speed of the balance is preferable. However, if the conveyance speed is increased, the acceleration also increases, and at the same time, the acceleration with respect to the FOUP 20 also increases. This has a problem that it becomes a factor of increasing the generation of foreign matter on the wafer 7.

On the other hand, in the present embodiment, as a result of examining the relationship between the direction, magnitude of the acceleration applied to the FOUP 20 and the foreign matter generation, when the threshold value (acceleration value) with the acceleration is equal to or greater than the threshold value at which the number of occurrence of the foreign matter is extremely increased, When the FOUP 20 is conveyed when the FOUP 20 is conveyed on the basis of the novel knowledge that the acceleration direction in the direction is also present and the threshold value is highest when the direction of acceleration is perpendicular to the BD plane. By holding and conveying the FOUP 20 so that the bilateral data plane is perpendicular to the conveying direction, foreign matters caused by conveyance are suppressed to a low level, and the conveyance time is shortened. Accordingly, when the automatic conveying system AMHS holds the FOUP 20, the BD surface of the FOUP 20 is kept perpendicular to the conveying direction, thereby suppressing foreign matters generated by conveying at a low level and further reducing the conveyance time. It has the effect of realizing a shortening and making it possible to comprise a highly efficient semiconductor production line.

Moreover, the said embodiment is not specifically limited to the wafer used for a semiconductor device, For display panel board | substrates, such as boards for port reticles, boards for liquid crystal monitor panels, boards for plasma display panels, and hard disks It is applicable to the board | substrate accommodation jig which accommodates, conveys, and stores various board | substrates, such as a board | substrate and board | substrates for electronic devices, such as a semiconductor device, and an evaluation adjustment jig and jig correction method regarding this board | substrate accommodation jig. In addition, it is clear that this invention is not limited to the said embodiment, and embodiment can be changed suitably within the range of the technical idea of this invention. In addition, the number, position, shape, etc. of the said structural member are not limited to the said embodiment, It can be set as the suitable number, position, shape, etc. in implementing this invention. In addition, in each figure, the same code | symbol is attached | subjected to the same component.

The present invention maintains the BD surface of the FOUP so as to be perpendicular to the conveying direction when the automatic conveying system holds the FOUP, thereby suppressing foreign matters caused by conveyance at a low level, realizing a shortening of the conveying time, and a highly efficient semiconductor. It has the effect of being able to construct a production line. Conventionally, there has been no proposal regarding the direction of the FOUP with respect to the conveyance direction when conveying the FOUP with an automatic conveyance system or the like. For this reason, the direction of FOUP on a conveying apparatus was not prescribed | regulated as a method of realizing a larger acceleration / deceleration while suppressing generation | occurrence | production of the foreign material on a wafer at low level.

Claims (17)

As a board | substrate accommodation jig conveyance method which suppresses the generation | occurrence | production of the foreign material by board | substrate conveyance to a low level, and realizes shortening of a board | substrate conveyance time, And carrying the substrate storage jig for storing, transporting, and storing the substrate in a state in which the substrate storage jig is held so that the bilateral data surface of the substrate storage jig is substantially perpendicular to the transport direction. Jig bounce method. As a board | substrate accommodation jig conveyance method which suppresses the generation | occurrence | production of the foreign material by board | substrate conveyance to a low level, and realizes shortening of a board | substrate conveyance time, And carrying a substrate storage jig for storing, transporting, and storing a substrate in a state in which the substrate storage jig is held such that the viral data surface of the substrate storage jig is within a range of a predetermined angle with respect to the transport direction. Substrate storage jig conveyance method As a board | substrate accommodation jig conveyance method which suppresses the generation | occurrence | production of the foreign material by board | substrate conveyance to a low level, and realizes shortening of a board | substrate conveyance time, And transporting the substrate storage jig for accommodating, transporting, and storing the substrate in a state where the substrate storage jig is held so that the bilateral data surface of the substrate storage jig is within approximately ± 30 ° in the transport direction. Substrate storage jig conveyance method As a board | substrate accommodation jig conveyance method which suppresses the generation | occurrence | production of the foreign material by board | substrate conveyance to a low level, and realizes shortening of a board | substrate conveyance time, The wafer carrier as a substrate storage jig for storing, transporting and storing the wafer as the substrate during semiconductor device manufacturing is conveyed with the substrate storage jig held in such a manner that the viral data surface of the wafer carrier is substantially perpendicular to the conveying direction. It has a process to carry out, The board | substrate accommodation jig conveyance method characterized by the above-mentioned. As a board | substrate accommodation jig conveyance method which suppresses the generation | occurrence | production of the foreign material by board | substrate conveyance to a low level, and realizes shortening of a board | substrate conveyance time, A wafer carrier serving as a substrate storage jig for accommodating, transporting, and storing a wafer as the substrate during the manufacture of a semiconductor device, and holding the substrate accommodating jig so that the viral data surface of the wafer carrier is within approximately ± 30 ° in the conveying direction. It has a process to convey in a state, The board | substrate accommodation jig conveyance method characterized by the above-mentioned. The substrate storage jig transfer method according to claim 4 or 5, wherein the wafer carrier is a front opening unit pod. As an automatic conveyance system which suppresses the generation | occurrence | production of the foreign material by substrate conveyance to a low level, and realizes shortening of a substrate conveyance time, A substrate storage jig for storing, transporting, and storing the substrate, A lift mechanism for moving the substrate storage jig in a state of holding the mushroom of the substrate storage jig; An overhead hoist for holding the substrate storage jig by the lifting mechanism to hold the substrate storage jig to hold the substrate storage jig so as to be substantially perpendicular to the conveying direction. With transfer, When the overhead hoist transferr holds the substrate storage jig by the lifting mechanism to hold the substrate storage jig, the substrate storage jig is substantially perpendicular to the conveying direction of the viral data surface of the substrate storage jig. The substrate holding jig is fixed to the overhead hoist transfer body while the lifting mechanism grips the mushroom, and the overhead hoist transferr rotates the lifting mechanism. And adjusting the positional relationship between the elevating mechanism and the overhead hoist transfer body to hold the substrate storage jig so that the bilateral data surface of the substrate storage jig is approximately perpendicular to the conveying direction. Conveying system. As an automatic conveyance system which suppresses the generation | occurrence | production of the foreign material by substrate conveyance to a low level, and realizes shortening of a substrate conveyance time, A substrate storage jig for storing, transporting, and storing the substrate, A lift mechanism for moving the substrate storage jig in a state of holding the mushroom of the substrate storage jig; Overhead for holding the substrate storage jig by the lifting mechanism to hold the substrate storage jig so that the substrate storage jig is in a range of a predetermined angle with respect to the conveying direction when the substrate storage jig is held. · Equipped with hoist and transfer When the overhead hoist transferer holds the substrate storage jig by the lifting mechanism to hold the substrate storage jig, the substrate storage jig moves the lateral data surface of the substrate storage jig to the conveyance direction and the predetermined angle. The substrate holding jig is fixed to the overhead hoist transfer body in a state where the lifting mechanism grips the mushroom, and the overhead hoist transfer is continued. Rotate the device to adjust the positional relationship between the elevating mechanism and the overhead hoist / transfer body so as to hold the substrate storage jig so that the lateral data surface of the substrate storage jig is within a range of a conveying direction and the predetermined angle. Automatic conveyance system, characterized in that the. As an automatic conveyance system which suppresses the generation | occurrence | production of the foreign material by substrate conveyance to a low level, and realizes shortening of a substrate conveyance time, A substrate storage jig for storing, transporting, and storing the substrate, A lift mechanism for moving the substrate storage jig in a state of holding the mushroom of the substrate storage jig; Over holding the substrate storage jig by holding the substrate storage jig by the lifting mechanism to hold the substrate storage jig so that the bilateral data surface of the substrate storage jig is within approximately ± 30 ° with respect to the conveying direction. Equipped with a head, hoist and transfer When the overhead hoist transferer holds the substrate of the substrate storage jig by the lifting mechanism and holds the substrate storage jig, the substrate storage jig moves the lateral data surface of the substrate storage jig in the conveyance direction and approximately ± The substrate holding jig is fixed to the overhead hoist transfer body in a state where the lifting mechanism grips the mushroom, while maintaining the temperature within 30 °, and the overhead hoist transfer is continued. Rotate the mechanism to adjust the positional relationship between the elevating mechanism and the overhead hoist transfer body to hold the substrate storage jig so that the lateral data surface of the substrate storage jig is within the transport direction and approximately ± 30 °. Automated conveying system characterized by the above-mentioned. As an automatic transfer system which suppresses the generation | occurrence | production of the foreign material by the wafer conveyance as a board | substrate at the time of semiconductor device manufacture, and realizes shortening of a board | substrate conveyance time, A wafer carrier as a substrate storage jig for storing, transporting, and storing a wafer; A lift mechanism for moving the wafer carrier while holding the mushroom of the wafer carrier; When hoisting the wafer carrier by the lifting mechanism to hold the wafer carrier, an overhead hoist transferr for holding the wafer carrier so that the lateral data surface of the wafer carrier is within a range of a predetermined angle with respect to the conveying direction. Equipped with When the overhead hoist transferr holds the wafer carrier by the lifting mechanism to hold the wafer carrier, the wafer carrier is placed within the range of the conveying direction and the predetermined angle of the wafer carrier. And the wafer carrier is fixed to the overhead hoist transfer body while the lifting mechanism grips the mushroom. Then, the overhead hoist transferr rotates the lifting mechanism to lift the lifting mechanism. An automatic conveyance configured to adjust the positional relationship between the mechanism and the overhead hoist transfer body so as to hold the wafer carrier so that the bilateral data surface of the wafer carrier falls within a range of the conveying direction and the predetermined angle. system. As an automatic transfer system which suppresses the generation | occurrence | production of the foreign material by the wafer conveyance as a board | substrate at the time of semiconductor device manufacture, and realizes shortening of a board | substrate conveyance time, A wafer carrier as a substrate storage jig for storing, transporting, and storing a wafer; A lift mechanism for moving the wafer carrier while holding the mushroom of the wafer carrier; And an overhead hoist transferr for holding the wafer carrier by the lifting mechanism to hold the wafer carrier and holding the wafer carrier so that the viral data surface of the wafer carrier is substantially perpendicular to the conveying direction. , When the overhead hoist transferer holds the wafer carrier by the lifting mechanism to hold the wafer carrier, the wafer carrier is held so that the viral data surface of the wafer carrier is substantially perpendicular to the conveying direction, Subsequently, the lift carrier fixes the wafer carrier to the overhead hoist transfer body in a state in which the lift mechanism grips the mushroom, and the overhead hoist transferr rotates the lift mechanism to provide the lift mechanism and the lifter. And the wafer carrier so as to hold the wafer carrier so that the bilateral data surface of the wafer carrier is substantially perpendicular to the conveying direction by adjusting the positional relationship of the overhead hoist transfer body. As an automatic transfer system which suppresses the generation | occurrence | production of the foreign material by the wafer conveyance as a board | substrate at the time of semiconductor device manufacture, and realizes shortening of a board | substrate conveyance time, A wafer carrier as a substrate storage jig for storing, transporting, and storing a wafer; A lift mechanism for moving the wafer carrier while holding the mushroom of the wafer carrier; When hoisting the wafer carrier by the lifting mechanism to hold the wafer carrier, an overhead hoist for holding the wafer carrier so that the viral data surface of the wafer carrier is within approximately ± 30 ° with respect to the conveying direction. With transfer, When the overhead hoist transferer holds the wafer carrier by the lifting mechanism to hold the wafer carrier, the wafer carrier is held within the conveying direction and approximately ± 30 ° in the direction of the bilateral data of the wafer carrier. The wafer carrier is fixed to the overhead hoist transfer body while the lifting mechanism grips the mushroom, and the overhead hoist transferr rotates the lifting mechanism to And adjusting the positional relationship between the elevating mechanism and the overhead hoist transfer body so as to hold the wafer carrier so that the bilateral data surface of the wafer carrier is within approximately ± 30 ° of the conveying direction. Automatic return system. The automatic transfer system according to any one of claims 10 to 12, wherein the wafer carrier is a front opening unit pod. The said overhead hoist transfer device is a robot hand installed in the said lifting mechanism, When the robot hand of the said 11th or 13th thing hold | maintains the mushroom of the said board | substrate storage jig, and complete | lifts the said board | substrate storage jig, By detecting the direction substantially perpendicular to the viral data surface of the substrate storage jig from the direction of the mushroom, and rotating the lifting mechanism in accordance with the direction of the detected mushroom, the viral data surface of the substrate storage jig is connected with the conveying direction. And a means to be substantially perpendicular, and configured to hold the viral data surface of the substrate storage jig substantially perpendicular to the conveyance direction when transporting the substrate storage jig up to the load port on the processing apparatus side to be supplied. Automatic bounce system. The overhead hoist transfer device according to claim 11 or 13, wherein the beam hoist stops on the load port on the stocker side by a transfer request, and the robot hand grips the mushroom by the lifting mechanism. When the operation of pulling up the substrate storage jig is completed, the direction substantially perpendicular to the bilateral data surface of the substrate storage jig is detected from the direction of the mushroom, and the lifting mechanism is rotated in accordance with the direction of the detected mushroom. Means for making the viral data surface of the substrate storage jig substantially perpendicular to the conveying direction, and conveys the viral data surface of the substrate storage jig when conveying the substrate storage jig up onto the load port on the stocker side. Automatic conveyance, characterized in that it is configured to hold approximately perpendicular to the direction System. The said overhead hoist transfer device is a robot hand installed in the said lifting mechanism, When the robot hand which grabbed the said mushroom chamber of the said board | substrate accommodation jig | tool and pulled up the said board | substrate storage jig of Claim 10 or Claim 13, A direction of a predetermined angle is detected from the direction of the mushroom relative to the viral data surface of the substrate storage jig, and the viral data surface of the substrate storage jig is conveyed by rotating the lifting mechanism in accordance with the direction of the detected mushroom. Has a means to be in a range of a predetermined angle with respect to the direction, and when carrying the substrate storage jig up to the load port on the side of the processing apparatus to be supplied, the bilateral data surface of the substrate storage jig has a predetermined angle with respect to the conveying direction. Configured to remain within range Transmission system. The overhead hoist transfer device according to claim 10 or 13, wherein the beam hoist stops on the load port on the stocker side by a transfer request, and the robot hand grips the mushroom by the lifting mechanism. When the work for pulling up the substrate storage jig is completed, the direction of the predetermined angle with respect to the viral data surface of the substrate storage jig is detected from the direction of the mushroom, and the lifting mechanism is moved along the direction of the detected mushroom. Means for rotating the viral data surface of the substrate storage jig so as to be in a range of a predetermined angle with respect to the conveying direction, and when carrying the substrate storage jig up to the load port on the stocker side, the viral of the substrate storage jig The data surface is configured to remain within a range of a predetermined angle with respect to the conveying direction. Automatic transport system, characterized in that the.