JPS62166664U - - Google Patents
Info
- Publication number
- JPS62166664U JPS62166664U JP5561386U JP5561386U JPS62166664U JP S62166664 U JPS62166664 U JP S62166664U JP 5561386 U JP5561386 U JP 5561386U JP 5561386 U JP5561386 U JP 5561386U JP S62166664 U JPS62166664 U JP S62166664U
- Authority
- JP
- Japan
- Prior art keywords
- metal
- plating layer
- circuit board
- printed circuit
- peripheral end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 4
- 239000010953 base metal Substances 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Description
第１図は本考案の一実施例を示す平面図、第２
図は第１図のＸ−Ｘ線断面図であつて、Ａは金属
ベースプリント基板、１は金属ベース積層板、２
はベース金属板、３は垂直面、３ａは打ち抜き孔
壁面、３ｂは周端面、４はめつき層である。
Fig. 1 is a plan view showing one embodiment of the present invention;
The figure is a sectional view taken along the line X-X of FIG. 1, in which A is a metal-based printed circuit board, 1 is a metal-based laminate, and 2
3 is a base metal plate, 3 is a vertical surface, 3a is a punched hole wall surface, 3b is a peripheral end surface, and 4 is a plating layer.
Claims (1)
プリント基板であつて、ベース金属板の打ち抜き
孔壁面と周端面を含む垂直面にめつき層を設けて
成る金属ベースプリント基板。 (2) めつき層がニツケルめつき層であることを
特徴とする実用新案登録請求の範囲第１項記載の
金属ベースプリント基板。[Scope of Claim for Utility Model Registration] (1) A metal-based printed circuit board formed from a metal-based laminate, in which a plating layer is provided on the vertical surface of the base metal plate, including the wall surface of the punched hole and the peripheral end surface. Printed board. (2) The metal-based printed circuit board according to claim 1, wherein the plating layer is a nickel plating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5561386U JPS62166664U (en) | 1986-04-14 | 1986-04-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5561386U JPS62166664U (en) | 1986-04-14 | 1986-04-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62166664U true JPS62166664U (en) | 1987-10-22 |
Family
ID=30883667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5561386U Pending JPS62166664U (en) | 1986-04-14 | 1986-04-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62166664U (en) |
-
1986
- 1986-04-14 JP JP5561386U patent/JPS62166664U/ja active Pending
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