JPS62166640U - - Google Patents
Info
- Publication number
- JPS62166640U JPS62166640U JP1987044725U JP4472587U JPS62166640U JP S62166640 U JPS62166640 U JP S62166640U JP 1987044725 U JP1987044725 U JP 1987044725U JP 4472587 U JP4472587 U JP 4472587U JP S62166640 U JPS62166640 U JP S62166640U
- Authority
- JP
- Japan
- Prior art keywords
- metal patterns
- chip carrier
- signal terminal
- electric signal
- external electric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987044725U JPS62166640U (enrdf_load_stackoverflow) | 1987-03-26 | 1987-03-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987044725U JPS62166640U (enrdf_load_stackoverflow) | 1987-03-26 | 1987-03-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62166640U true JPS62166640U (enrdf_load_stackoverflow) | 1987-10-22 |
Family
ID=30862803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987044725U Pending JPS62166640U (enrdf_load_stackoverflow) | 1987-03-26 | 1987-03-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62166640U (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010171114A (ja) * | 2009-01-21 | 2010-08-05 | Renesas Technology Corp | 半導体装置 |
| JP2014116383A (ja) * | 2012-12-07 | 2014-06-26 | Murata Mfg Co Ltd | 電子部品 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5553446A (en) * | 1978-10-16 | 1980-04-18 | Fujitsu Ltd | Container of electronic component |
-
1987
- 1987-03-26 JP JP1987044725U patent/JPS62166640U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5553446A (en) * | 1978-10-16 | 1980-04-18 | Fujitsu Ltd | Container of electronic component |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010171114A (ja) * | 2009-01-21 | 2010-08-05 | Renesas Technology Corp | 半導体装置 |
| JP2014116383A (ja) * | 2012-12-07 | 2014-06-26 | Murata Mfg Co Ltd | 電子部品 |