JPS62166640U - - Google Patents

Info

Publication number
JPS62166640U
JPS62166640U JP1987044725U JP4472587U JPS62166640U JP S62166640 U JPS62166640 U JP S62166640U JP 1987044725 U JP1987044725 U JP 1987044725U JP 4472587 U JP4472587 U JP 4472587U JP S62166640 U JPS62166640 U JP S62166640U
Authority
JP
Japan
Prior art keywords
metal patterns
chip carrier
signal terminal
electric signal
external electric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987044725U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987044725U priority Critical patent/JPS62166640U/ja
Publication of JPS62166640U publication Critical patent/JPS62166640U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
JP1987044725U 1987-03-26 1987-03-26 Pending JPS62166640U (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987044725U JPS62166640U (de) 1987-03-26 1987-03-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987044725U JPS62166640U (de) 1987-03-26 1987-03-26

Publications (1)

Publication Number Publication Date
JPS62166640U true JPS62166640U (de) 1987-10-22

Family

ID=30862803

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987044725U Pending JPS62166640U (de) 1987-03-26 1987-03-26

Country Status (1)

Country Link
JP (1) JPS62166640U (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010171114A (ja) * 2009-01-21 2010-08-05 Renesas Technology Corp 半導体装置
JP2014116383A (ja) * 2012-12-07 2014-06-26 Murata Mfg Co Ltd 電子部品

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5553446A (en) * 1978-10-16 1980-04-18 Fujitsu Ltd Container of electronic component

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5553446A (en) * 1978-10-16 1980-04-18 Fujitsu Ltd Container of electronic component

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010171114A (ja) * 2009-01-21 2010-08-05 Renesas Technology Corp 半導体装置
JP2014116383A (ja) * 2012-12-07 2014-06-26 Murata Mfg Co Ltd 電子部品

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