JPS62166588A - Semiconductor laser - Google Patents

Abstract

PURPOSE:To obtain a semiconductor laser which has strong resistance for a surge current and a static electricity, a ready handlement and high reliability by so mounting an element having the same or equivalent to the operation of a capacitor in a heat sink in a package as to be electrically parallel to a semiconductor laser chip. CONSTITUTION:A chip capacitor 5 having high responsiveness is mounted on a heat sink 1 in a package of a semiconductor laser, a wire 6 is connected also with the electrode of the capacitor 5 in parallel with a wire 6 for supplying a current to a semiconductor laser chip 3 to electrically connect the chip 3 in parallel with the capacitor 5. When thus mounted, a static electricity and an excess current such as a surge current which are applied to the chip 3 are also applied to the capacitor 5, the excess current of certain degree is absorbed to the capacitor 5 to eliminate the load to the chip 3.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a semiconductor laser device, and particularly to a protective structure thereof.

<Summary of the Invention> The present invention protects a heat sink in a package in which a semiconductor laser chip is mounted from condensate air, surge current, and the like.

<Prior Art> As shown in FIG. 2, a conventional semiconductor laser device includes a semiconductor laser chip 3 and a photodiode chip 4 for monitoring the optical output from the semiconductor laser chip 3 on a heat sink 1 and a stem 2 in a package. It had a mounted structure.

<Problem to be solved by the invention> However, although the semiconductor laser chip 3 has a high-speed response of 1 (GHz) or more, it conversely requires a current that is even slightly larger than the current required to output the specified optical output. If it flows for even a moment, the end face of the semiconductor laser chip 3 will be destroyed by its own optical output. As described above, the semiconductor laser chip 3 is extremely vulnerable to surge currents including static electricity and external noise, and the semiconductor laser device should be handled by C-MO.
I had to be more careful than with the 8LSI.

The present invention has been made in view of the above points, and an object of the present invention is to protect the semiconductor laser chip 3 from static electricity and surge current.

<Means for solving the problem> The present invention mounts a capacitor or an element having an equivalent function to a heat sink in a package in which a semiconductor laser chip is mounted so that it is electrically parallel to the semiconductor laser chip. The structure is as follows.

Effects> With the above structure, excessive currents such as static electricity and surge currents are absorbed by the capacitor, etc., so that no burden is placed on the semiconductor laser chip.

<Example> An embodiment of the present invention is shown in FIGS. 1(a) and 1(b).

As shown in FIGS. 1(a) and 1(b), a chip capacitor 5 with high-speed response is mounted on a heat sink 1 within the package of the semiconductor laser device, and a wire line that supplies current to the semiconductor laser chip 3 is mounted inside the package of the semiconductor laser device. A wire line 6 is also connected to the electrode of the capacitor 5 in parallel with the semiconductor laser chip 3 and the capacitor 5 so that the semiconductor laser chip 3 and the capacitor 5 are electrically parallel to each other.

When mounted in this manner, excessive current such as static electricity and surge current applied to the semiconductor laser chip 3 is also applied to the capacitor 5, and a certain amount of excessive current is absorbed by the capacitor 5, which places a burden on the semiconductor laser chip 3. It disappears.

The wiring between the semiconductor laser chip 3 and the capacitor 5 is shown in Figure 1 (
Option b) is more effective because the wire 6 acts as a coil and contains an electrically equivalent reactance component.

<Effects of the Invention> As described above, according to the present invention, excessive current is absorbed by the capacitor, making the entire semiconductor laser device resistant to surge currents and static electricity, easier to handle, and more reliable. can be provided.

[Brief explanation of drawings]

FIGS. 1(a) and 1(b) are perspective views showing one embodiment of the present invention, and FIG. 2 is a perspective view showing a conventional example. 1... Heat sink, 3... Semiconductor laser chip, 5
...Capacitor. Figure 2

Claims (1)

[Claims] 1. A semiconductor laser device characterized in that a capacitor or an element having the same function as a capacitor is mounted electrically in parallel with the semiconductor laser chip on a heat sink in a package in which the semiconductor laser chip is mounted.