JPS6216558B2 - - Google Patents
Info
- Publication number
- JPS6216558B2 JPS6216558B2 JP55171664A JP17166480A JPS6216558B2 JP S6216558 B2 JPS6216558 B2 JP S6216558B2 JP 55171664 A JP55171664 A JP 55171664A JP 17166480 A JP17166480 A JP 17166480A JP S6216558 B2 JPS6216558 B2 JP S6216558B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- semiconductor
- sealed
- resin
- type silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 102
- 239000010703 silicon Substances 0.000 claims description 70
- 229910052710 silicon Inorganic materials 0.000 claims description 70
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 69
- 239000013078 crystal Substances 0.000 claims description 44
- 229920005989 resin Polymers 0.000 claims description 23
- 239000011347 resin Substances 0.000 claims description 23
- 238000007789 sealing Methods 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 10
- 238000005538 encapsulation Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 238000009826 distribution Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 230000005355 Hall effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N52/00—Hall-effect devices
- H10N52/80—Constructional details
Landscapes
- Hall/Mr Elements (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55171664A JPS5795685A (en) | 1980-12-05 | 1980-12-05 | Resin sealed type semiconductor magnetic sensitive device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55171664A JPS5795685A (en) | 1980-12-05 | 1980-12-05 | Resin sealed type semiconductor magnetic sensitive device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5795685A JPS5795685A (en) | 1982-06-14 |
JPS6216558B2 true JPS6216558B2 (US20040232935A1-20041125-M00001.png) | 1987-04-13 |
Family
ID=15927404
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55171664A Granted JPS5795685A (en) | 1980-12-05 | 1980-12-05 | Resin sealed type semiconductor magnetic sensitive device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5795685A (US20040232935A1-20041125-M00001.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01150190U (US20040232935A1-20041125-M00001.png) * | 1988-04-04 | 1989-10-17 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62208683A (ja) * | 1986-03-07 | 1987-09-12 | Seiko Instr & Electronics Ltd | 磁気センサ |
JP4786986B2 (ja) * | 2005-09-29 | 2011-10-05 | 旭化成エレクトロニクス株式会社 | 電子部品 |
-
1980
- 1980-12-05 JP JP55171664A patent/JPS5795685A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01150190U (US20040232935A1-20041125-M00001.png) * | 1988-04-04 | 1989-10-17 |
Also Published As
Publication number | Publication date |
---|---|
JPS5795685A (en) | 1982-06-14 |
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