JPS6216538B2 - - Google Patents
Info
- Publication number
- JPS6216538B2 JPS6216538B2 JP56035023A JP3502381A JPS6216538B2 JP S6216538 B2 JPS6216538 B2 JP S6216538B2 JP 56035023 A JP56035023 A JP 56035023A JP 3502381 A JP3502381 A JP 3502381A JP S6216538 B2 JPS6216538 B2 JP S6216538B2
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- heat treatment
- substrate
- hours
- oxygen concentration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10P95/90—
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
- Recrystallisation Techniques (AREA)
- Formation Of Insulating Films (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56035023A JPS57167636A (en) | 1981-03-11 | 1981-03-11 | Manufacture of semiconductor device |
| EP82301212A EP0060676B1 (en) | 1981-03-11 | 1982-03-10 | A method for the production of a semiconductor device comprising annealing a silicon wafer |
| DE8282301212T DE3280219D1 (de) | 1981-03-11 | 1982-03-10 | Verfahren zur herstellung einer halbleiteranordnung mit ausgluehen eines halbleiterkoerpers. |
| IE559/82A IE55966B1 (en) | 1981-03-11 | 1982-03-11 | A method for the production of a semiconductor device comprising annealing a silicon wafer |
| US06/598,544 US4597804A (en) | 1981-03-11 | 1984-04-12 | Methods of forming denuded zone in wafer by intrinsic gettering and forming bipolar transistor therein |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56035023A JPS57167636A (en) | 1981-03-11 | 1981-03-11 | Manufacture of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57167636A JPS57167636A (en) | 1982-10-15 |
| JPS6216538B2 true JPS6216538B2 (Direct) | 1987-04-13 |
Family
ID=12430454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56035023A Granted JPS57167636A (en) | 1981-03-11 | 1981-03-11 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57167636A (Direct) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4437922A (en) * | 1982-03-26 | 1984-03-20 | International Business Machines Corporation | Method for tailoring oxygen precipitate particle density and distribution silicon wafers |
| JPH01312840A (ja) * | 1988-06-10 | 1989-12-18 | Fujitsu Ltd | 半導体装置の製造方法 |
-
1981
- 1981-03-11 JP JP56035023A patent/JPS57167636A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57167636A (en) | 1982-10-15 |
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