JPS62165071U - - Google Patents

Info

Publication number
JPS62165071U
JPS62165071U JP1986051750U JP5175086U JPS62165071U JP S62165071 U JPS62165071 U JP S62165071U JP 1986051750 U JP1986051750 U JP 1986051750U JP 5175086 U JP5175086 U JP 5175086U JP S62165071 U JPS62165071 U JP S62165071U
Authority
JP
Japan
Prior art keywords
soldering
laser
solder
irradiation angle
adjustment mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986051750U
Other languages
English (en)
Japanese (ja)
Other versions
JPH037072Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986051750U priority Critical patent/JPH037072Y2/ja
Publication of JPS62165071U publication Critical patent/JPS62165071U/ja
Application granted granted Critical
Publication of JPH037072Y2 publication Critical patent/JPH037072Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP1986051750U 1986-04-07 1986-04-07 Expired JPH037072Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986051750U JPH037072Y2 (enrdf_load_stackoverflow) 1986-04-07 1986-04-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986051750U JPH037072Y2 (enrdf_load_stackoverflow) 1986-04-07 1986-04-07

Publications (2)

Publication Number Publication Date
JPS62165071U true JPS62165071U (enrdf_load_stackoverflow) 1987-10-20
JPH037072Y2 JPH037072Y2 (enrdf_load_stackoverflow) 1991-02-21

Family

ID=30876298

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986051750U Expired JPH037072Y2 (enrdf_load_stackoverflow) 1986-04-07 1986-04-07

Country Status (1)

Country Link
JP (1) JPH037072Y2 (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009128231A1 (ja) * 2008-04-14 2009-10-22 株式会社 東芝 レーザ溶接装置およびレーザ溶接方法
JP2010192570A (ja) * 2009-02-17 2010-09-02 Panasonic Corp レーザはんだ付け装置
JP2021041451A (ja) * 2019-09-13 2021-03-18 株式会社ジャパンユニックス はんだ付けヘッド
JP2023163755A (ja) * 2022-04-28 2023-11-10 パック テック－パッケージング テクノロジーズ ゲーエムベーハー 回路基板に電子部品をはんだ付けするための方法及び装置、コンピュータプログラム製品、並びにコンピュータ可読媒体

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4940261A (enrdf_load_stackoverflow) * 1972-08-25 1974-04-15
JPS54117998A (en) * 1978-03-06 1979-09-13 Toshiba Corp Laser working device
JPS56146831A (en) * 1980-04-14 1981-11-14 Hitachi Ltd Temperature controlling method for continuous heat treatment apparatus
JPS5717369A (en) * 1980-07-04 1982-01-29 Toshiba Corp Method for soldering by laser
JPS57111089A (en) * 1980-12-27 1982-07-10 Omron Tateisi Electronics Co Method of sodering chip part
JPS57193277A (en) * 1981-05-25 1982-11-27 Toshiba Corp Soldering device by laser
JPS58122175A (ja) * 1982-01-18 1983-07-20 Nec Corp ハンダ付け装置
JPS58161396A (ja) * 1982-03-19 1983-09-24 株式会社日立製作所 レ−ザビ−ムを用いた半田付け方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4940261A (enrdf_load_stackoverflow) * 1972-08-25 1974-04-15
JPS54117998A (en) * 1978-03-06 1979-09-13 Toshiba Corp Laser working device
JPS56146831A (en) * 1980-04-14 1981-11-14 Hitachi Ltd Temperature controlling method for continuous heat treatment apparatus
JPS5717369A (en) * 1980-07-04 1982-01-29 Toshiba Corp Method for soldering by laser
JPS57111089A (en) * 1980-12-27 1982-07-10 Omron Tateisi Electronics Co Method of sodering chip part
JPS57193277A (en) * 1981-05-25 1982-11-27 Toshiba Corp Soldering device by laser
JPS58122175A (ja) * 1982-01-18 1983-07-20 Nec Corp ハンダ付け装置
JPS58161396A (ja) * 1982-03-19 1983-09-24 株式会社日立製作所 レ−ザビ−ムを用いた半田付け方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009128231A1 (ja) * 2008-04-14 2009-10-22 株式会社 東芝 レーザ溶接装置およびレーザ溶接方法
US8445810B2 (en) 2008-04-14 2013-05-21 Kabushiki Kaisha Toshiba Laser welding apparatus
JP5306333B2 (ja) * 2008-04-14 2013-10-02 株式会社東芝 レーザ溶接装置およびレーザ溶接方法
JP2010192570A (ja) * 2009-02-17 2010-09-02 Panasonic Corp レーザはんだ付け装置
US8525072B2 (en) 2009-02-17 2013-09-03 Panasonic Corporation Laser soldering apparatus
JP2021041451A (ja) * 2019-09-13 2021-03-18 株式会社ジャパンユニックス はんだ付けヘッド
JP2023163755A (ja) * 2022-04-28 2023-11-10 パック テック－パッケージング テクノロジーズ ゲーエムベーハー 回路基板に電子部品をはんだ付けするための方法及び装置、コンピュータプログラム製品、並びにコンピュータ可読媒体

Also Published As

Publication number Publication date
JPH037072Y2 (enrdf_load_stackoverflow) 1991-02-21

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