JPS62164866A - Film forming mask device - Google Patents

Abstract

PURPOSE:To form a sharp and precise pattern on a substrate by pressing the intermediate part of a mask by a set spring to the substrate in tight contact therewith and positioning the set spring in a manner as not to hinder particles for vapor deposition. CONSTITUTION:The substrate 7 fixed to a substrate frame 6 is pressed by means of positioning pins 2 and receiving pins 3 onto the mask 5 for film formation which is fixed to a mask frame 1 and on which a pattern is formed. One end of the set spring 10 is attached to the mask frame 1 by means of a screw 11 and the other end of the set spring 10 is bent to press the intermediate part of the mask 3 to the substrate 7 in tight contact therewith. The space between the transverse side 10a of the set spring 10 and the film forming part of the substrate is so determined as to be made >=4 times the diameter or width of the set spring 10. The sharp and precise pattern is thereby formed onto the substrate 7 even if the incident angle of the film forming material on the substrate 7 increases.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a method for forming a pattern on a substrate such as a semiconductor board, an insulating board, or a metal plate by vapor deposition or the like by applying a mask to the substrate.
0 Related to Film Forming Mask Apparatus [Prior Art] FIG. 7 is a sectional view showing a conventional general film forming mask apparatus, as shown, for example, in "Vacuum Deposition" (published by Adanesha Co., Ltd.). 1 is a mask frame, and a pair of positioning bins 2. A plurality of substrate holders are fixed to the bins 3 and the substrate pressing springs. 05 is a film forming mask passed through these bins 2 and positioned, and is made of stainless steel with a thickness of 0.05 to 0.5 mm,
The mask plate is made of a thin metal plate made of 42 alloy, molybdenum, thin bronze, etc., and a precise pattern is formed by a photolithography process or the like. 6 is a board frame, and positioning bins 2. It is passed through the receiving bottle 3, applied to the substrate 7 positioned on the mask 5, and is coupled to the mask frame 1 by coupling screws, coupling spring means (not shown), and the like.

In the above-mentioned conventional device, the positioning bin 2 and the board holder are processed with high precision to control the relative positional relationship with the bin 3 and the relative positional relationship between the pattern of the mask 5 and the positioning hole. The pattern can be aligned with high precision. In this way, the base VI7 is attached to the film forming mask device, and the material to be filmed is deposited from below the mask frame 1 using a thin film forming means. A thin film pattern according to the pattern of the mask 5 is formed on 7.

When a pattern is formed on the substrate 7 using a film forming apparatus such as a sputtering apparatus, a CVD apparatus, or an evaporation apparatus with a large target area, in which the direction of the evaporation material incident on the substrate 7 is over a wide range, a gap is created between the mask 5 and the substrate 7. The larger the gap, the worse the film formation pattern accuracy becomes. For this reason, the mask 5 and the substrate 7 are
It is necessary to attach it closely.

[Problem that the invention seeks to solve]

In the conventional film-forming mask apparatus as described above, the pattern edge of the mask 4 does not come into close contact with the middle part of the lower surface of the substrate 7, resulting in an empty area. Patterns formed using a film forming apparatus, such as a plasma CVD apparatus, in which film forming material particles are incident on a certain point on a substrate in a wide range of incident angles, have problems such as blurring at the edges of the pattern and making the patterns less clear.

This invention was made in order to solve the above-mentioned problems, and provides a film-forming mask device that can form a clear and precise pattern even if the angle of incidence of the film-forming substance on the f&temporary is wide. The purpose is to

[Failure to solve the problem]

The film forming mask device according to the present invention uses a presser spring attached to a mask frame to press the middle part of the mask so as to bring it into close contact with the substrate, and furthermore, a lateral side part in the middle of the presser spring is moved away from the mask by a predetermined distance. The pressure springs are spaced apart from each other so that they are not shaded by the particles being formed into a film.

[Effect]

In this invention, the mask is in close contact with the substrate, and particles of the film-forming material do not enter between the mask and the substrate, so that no bleeding occurs at the edges of the pattern formed on the substrate.
, [Embodiment] FIG. 1 is a front sectional view showing an embodiment of a film forming mask apparatus according to the present invention, and 1 to 7 are the same as the conventional apparatus described above. 10 has one end attached to the mask frame 1 with the mounting screw H.
This presser spring is attached to a wire spring and attaches the middle part of the mask 3 to the presser board 7 with its bent tip.

The mask 5 is shown in a plan view in FIG. 2, where 5a is a pattern formed in the shape of a hole, 5b is a position and a hole for a bottle, 5C is a hole for a bottle, and M is a board 7 on the inner edge of the mask frame 1. and N indicate a short distance portion where the mask 5 can be pressed, and N indicates an intermediate portion that is far from the inner edge of the mask frame 1 and cannot be pressed.

If there is a gap between the middle part N of this mask 5 and the substrate 7,
Although the film formation pattern becomes unclear, the mask 5 is pressed against the substrate 7 by the pressing spring 10 and remains in close contact with the substrate 7. by the way,
This pressing spring 1o blocks the path between the pattern 5a and the target or counter electrode (none of which are shown) of the film forming apparatus, so that the particles to be formed into a film are shaded. The degree of this shadowing varies depending on the type of film forming apparatus, for example, whether it is a sputtering apparatus, a plasma CVD apparatus, or an evaporation apparatus, and also depends on the gas pressure during film forming.

Furthermore, the diameter A of the pressing spring 1o (width A in the case of a leaf spring)
This is related to the distance H between the substrate 7 and the intermediate horizontal side portion 10a of the pressing spring 10.

Figure 3 shows a curve obtained by actually measuring how the film thickness d of the thinnest part of the formed film changes with A/H using a plasma CVD apparatus. From this actual measurement result, d/do=10-0°41
This is the film thickness when A/H, do and 10 times, that is, A=O, and is the unit of d and do.

The units of A and H are the same. How much the d/do can be lower than 1 depends on how the deposited film is used, but when it can be reduced by up to 20%, the A/H
(It is sufficient if the conditions 0 and 24 are satisfied.

In other words, the distance H of the pressing spring 10 from the surface of the substrate 7 may be set to be at least four times the diameter (wire spring) or width (plate spring) A of the pressing spring 10.

In the embodiment shown in FIG. 1, the mask 5 and the substrate 7 are precisely aligned with the positioning pin 2 and the support by the pin 3 and the substrate holder 4, but other embodiments shown in FIG. You can also do this without relying on these alignment pins, as in The board 7 is placed in the housing part 12a provided in the board frame 12.
is inserted. The presser foot 14 is made of a band-shaped leaf spring.
The middle part of the mask 13 is joined to the bent tip, and is attached to the substrate frame 12 with attachment screws U. This pressing spring 14 is connected to the board frame 1 by a pair of positioning pins 15.
It is positioned at 2. The accommodating portion 12a of the substrate frame 12 and the hole for the positioning pin are provided in a precise relationship #, and the mask 13 is joined to the presser spring 14 at an accurate position from the positioning pin. Thereby, the mask 13 is accurately aligned with the substrate 7.

FIGS. 5 and 6 are perspective views of pressing springs showing other different embodiments of the present invention.

In FIG. 5, the pressing spring 16 is made of a wire spring, and the bent intermediate horizontal side portion 16a is sloped so that the distance H from the substrate surface is larger on the tip side portion 161) side to improve the springiness. ing.

In FIG. 6, the pressure spring 17 consists of a narrow leaf spring, with 9.17a being the middle lateral side.

Note that the mask 5 is not limited to a photoetched metal thin plate, and may have a pattern formed by wire cutting, laser processing, punching, etc., and may be made of not only a metal material but also other materials such as a polymer.

〔Effect of the invention〕

As described above, according to the present invention, since the middle part of the mask is brought into close contact with the holding substrate by the pressing spring, a clear and precise pattern can be formed even if the angle of incidence of the film-forming substance on the substrate is wide. Ru.

[Brief explanation of drawings]

FIG. 1 is a front sectional view of a film forming mask device according to the present invention;
Fig. 2 is a plan view of the mask shown in Fig. 1, Fig. 3 is a curve diagram showing the change in film thickness depending on the ratio of the distance between the pressing spring and the substrate to the diameter (width) of the first pressing spring, and Fig. 4 is 2g5 and 6 are perspective views of pressing springs showing other different embodiments of the present invention, and fftN21 is a conventional film forming mask. FIG. 3 is a front sectional view of the device. 1...Mask frame, 5...Mask, 6... Board frame, 7
...Substrate, 10...Press spring, 10a...Tangential part, 12...Substrate frame, 13...Mask,
．． l'? ...If you press it, it's 14a. 16a, 1'7a... Horizontal side portions The same reference numerals in the drawings indicate the same or equivalent parts.

Claims (5)

[Claims] (1) A substrate that is fixed to a substrate frame and has a pattern formed on its surface, a mask on which a pattern is formed and applied to the substrate, and one end of which is attached to the substrate frame or a mask frame that presses the mask, and is A film forming mask device comprising a pressing spring that presses an intermediate portion of the mask against the substrate at a tip of a side bent in a direction. (2) Claim 1 in which the pressing spring is a linear spring
The film-forming mask apparatus described in 1. (3) The film forming mask device according to claim 1, wherein the pressing spring is a band-shaped leaf spring. (4) Claims 1 to 4 are characterized in that the distance between the horizontal side of the presser spring and the part of the substrate where the film is formed is widened to a position where there is less interference with incident film-forming particles. The film forming mask device according to any one of Item 3. (5) A film forming mask according to claim 4, characterized in that the distance between the part of the substrate on which the film is to be formed and the lateral side of the pressing spring is at least four times the diameter or width of the pressing spring. Device.