JPS62146253A - Position aligning device for mask film forming device - Google Patents

Abstract

PURPOSE:To make the edge part of a thin film pattern formed on a substrate extremely clear by forming projections on the surface of a mask confronting the substrate at prescribed positions and by pressing the edge part of the pattern of the mask against the substrate by springs. CONSTITUTION:Plural projections 4b are formed on the surface of a mask 4 confronting a substrate 5 at positions at which the contact of the projections with a thin film pattern formed on the substrate 5 is avoided. The edge part of the pattern 4a of the mask 4 are pressed against the substrate 5 by springs 18 so that no gap is left between the edge part and the substrate 5. Thus, the edge part of a thin film pattern formed on the substrate is made extremely clear.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention is a method for forming a thin film by forming a pattern of a predetermined shape by depositing a thin film while aligning a film-forming mask with a substrate. The present invention relates to an alignment device for a membrane device.

[Conventional technology]

FIG. 5 is a sectional view showing a conventional positioning device for this type of mask film forming apparatus. (1) is a relatively thick mask frame, and a positioning hole (4b) of a mask (4) superimposed on this mask frame (1) is provided at a predetermined position of this mask frame (1).
) for positioning the mask (4), and a plurality of fixing bins (3) for fixing the substrate (5) superimposed on the mask (4) are integrally implanted. It is set up. (6) is a substrate valve attached to a predetermined position of the mask frame (1), and (7) is a mask with a substrate (5) and a mask (4) formed with a pattern (4a) of a predetermined shape. This is a board frame fixed to the frame (1).

Since the positioning device of the conventional mask film forming apparatus is configured as described above, the relative position of the five positioning bins (2) and the fixed bins (3) and the pattern (4a) of the mask (4), By processing the relative position with the positioning hole (4b) with high precision, it is possible to align the pattern (4a) of the mask (4) with respect to the substrate (5) with high precision. When a positioning device configured as shown in FIG. A thin film pattern with the same shape is formed.

[Problem that the invention seeks to solve]

In the above-mentioned alignment device of the conventional mask film forming apparatus, the substrate (5) and the mask (4) that overlap each other do not come into close contact with each other over the entire surface, especially the edge portion of the pattern (4a) and the substrate (5). For example, if the area of the evaporation source is large, a spanner device, or a plasma CVD
A pattern formed by a film forming apparatus such as a vapor deposition apparatus in which the incident angle of the film forming material particles incident on the point of the substrate (5) is wide (ml) is a pattern with gaps (4a).
The disadvantage is that the thin film smears at the edges of the substrate, making it impossible to form a clear thin film pattern on the substrate. One way to deal with this is to attach the mask (4) to the substrate (5) using a leaf spring or the like.
), there is a risk that the thin film pattern already formed on the substrate (5) will be locally strongly pressed and damaged.

This invention focuses on this point and has been devised to provide a mask in which the edges of the thin film pattern formed on the substrate are clear, and the thin film pattern already formed on the substrate is not damaged. [Means for solving the problem] The alignment device for a mask film forming apparatus according to the present invention provides an alignment device for a film forming apparatus.
A plurality of protrusions are provided on the surface of the mask on which a pattern of a predetermined shape is formed, facing the substrate, at positions that do not contact the thin film pattern already formed on this substrate, and the edges of the protrusions and the pattern of the mask are provided. The edge portion of the mask pattern is pressed against the substrate by a spring that is pressed against the substrate at a predetermined pressure.

[Effect]

In this invention, -C has a plurality of protrusions on the surface of the mask facing the substrate at positions that do not contact the thin film pattern already formed on the substrate, and also attaches the edge portion of the pattern of the mask to the substrate using a spring. Since the pressure is applied so that there is no gap between the edge of the mask pattern and the substrate, not only the edge of the thin film pattern formed on the substrate becomes extremely clear, but also the protrusions provided on the mask are formed on the substrate. Since it is provided at a position that does not touch the thin film pattern already formed, there is no possibility of damaging this thin film pattern.

[Embodiments of the invention]

Fig. 1 is a side view showing an embodiment of the present invention, Fig. 2 is an enlarged sectional view of the construction part, and Fig. 3 is a plan view of the entire device.
) is a stage on which a substrate (5) on which a thin film pattern is to be formed is placed, and a positioning bin α4, a substrate fixing bin, and a holding plate support bin α◆ are installed at predetermined positions on this stage Uυ, respectively. ing. The substrate (5) is not positioned at a predetermined position by the substrate fixing bin u3 and the substrate presser αQ. (4) is superimposed on the substrate (5 pins), and the positioning holes (not shown) drilled therein are inserted into the positioning holes (not shown).
b) with a mask positioned by inserting it into the
As shown in FIGS. 2 and 3, a pattern (4a) of a predetermined shape is formed on this mask (4). Furthermore, the surface of the mask (4) facing the substrate (5) is pressed against the substrate (5) at a position that does not contact the thin film pattern (not shown) already formed on the substrate (5). A plurality of protrusions (4b) are formed. Frame 0 is a spring made of a comb-like leaf spring, etc., which is positioned by inserting a positioning hole (not shown) drilled at a predetermined position into a positioning pin (6). A plurality of retaining bolts (1) having a holding plate (AK) held by a plurality of retaining bolts (1),
The tip (18a) of this spring α→ is pressed with a predetermined pressure between each protrusion (4b) of the mask (4) and the edge of the pattern (4a), and the edge of the mask (4) is pressed against the substrate ( 5
) and press the edges of this mask (4) and the substrate (5).
) so that there is no gap between them.

The materials and processing means of each component in the above-mentioned embodiment will be explained in detail as follows.

First, the mask (4) is 0.1-0.3 thick 5US30
4.

5US430r! Highly accurate patterns can be obtained by processing any stainless steel, 42 alloy molybdenum aluminum, Kovar, etc. by photo etching.
Ru. In addition, if the dimension of one side of the 5th substrate (5) is as large as 10αμ, the mask (4) will also increase in proportion to the kneading process, and the warping of the mask material will reduce processing accuracy and film formation pattern accuracy. For example, if the material is stainless steel, use one that has been made harder by tension annealing.If you want to further improve the precision of the film formation pattern, you can reduce the shadow effect caused by the thickness of the mask. Usually, the thickness of the mask is 50 mm.
After photo-etching a thin sheet with a thickness of μmt, a method of reinforcing it by spot welding a thick piece of 0.2 to 0.5 volts to increase the mechanical strength is used, but this method is expensive. Of course, there are problems such as spot welds coming off when etching deposits attached to the mask, and etchant that has entered between each mask being difficult to remove by cleaning. is formed on the back of the mask (4), and a pattern slightly wider than the kneaded pattern is formed on this mask (9y). This mask (
After this process, the protrusion (4b) formed in 4) is formed by press working.

Next, since the board fixing pin α1 is in constant contact with the side surface of the board (5), it is likely to wear out during repeated use.
This is provided to maintain a predetermined gap between the presser plate α1 and the stage α, along with the I% presser plate support pin α.The reason for forming this gap is mainly for high precision. Furthermore, if the spring 0 frame and the mask (4) come into full contact with each other, unnecessary parts of the mask (4) will come into contact with the substrate (5), causing damage to the substrate (5). This is to prevent damage to the thin film pattern that has already been formed. By increasing the predetermined gap between the presser foot O→ and the stage αυ in this way, the edges of the pattern (4a) and the outside of the protrusion (4b) μ of the mask (4) are prevented from coming into contact with the substrate (5). Since it is possible to
Either form a pattern in advance on the substrate (5) that can be damaged at the contact part between the edge part of a) and the protrusion (4b) of the mask (4), or do not form a pattern. It is sufficient to form a pattern of hard material or a highly hard material.

Furthermore, between the holding plate α field and the stage αυ, that is,
Another reason for forming a gap between the holding plate (1) and the substrate (5) is that the gap is formed between the holding plate (1) and the substrate (5).
5) This is to absorb the warpage caused during processing of the stage (1η and holding plate α), warpage of the material, or warpage due to unbalanced temperature distribution that occurs during film deposition heating. In addition, Narudai, 5US304, which uses stainless steel as the material for the mask (4)
5US43[1], which has a smaller coefficient of linear expansion and higher thermal conductivity than the 5US43[1], has less warpage.Furthermore, the vibration during film formation on the spring α■ substrate (5) causes the mask (4) to warp less.
) is required to be relatively strong to prevent it from shifting, but if it is stronger than the required μ, it will damage the substrate (5). Note that when forming a film at a high temperature of about 00°C, heat-resistant stainless steel 5US631 is suitable. Furthermore, it is necessary to use a heat-resistant alloy for S@ which is formed into a film at a higher temperature.

Further, the stainless steel 5US361 may be produced by processing a precipitation-hardened material, or by processing a solution-treated material and then precipitation-hardening it, but the latter method has better accuracy. Further processing is performed by etching or laser processing, similar to the mask (4).

Next, in order to accurately align the substrate (5) and the mask (4) described above, it is necessary to contact the mask (4) in order to reduce the friction between the spring α and the mask (4) when holding the mask. While making the end of spring 0→ smooth, this spring α
It is necessary to reduce the strain before and after the frame with the presser plate (to), and to reduce the angle between the spring 0→ and the mask (4).To do this, It is more effective to make the length of the spring (lF!J as long as possible).

Furthermore, the alignment accuracy between the edge part of the pattern (4a) of the mask (4) and the base (5), It goes without saying that it is determined by the processing accuracy of α], α, the processing accuracy of the mask (4), and the straightness of the side surface of the substrate (5) that comes into contact with the substrate fixing bin (2).

μIf the alignment device assembled according to the above-mentioned procedure is incorporated into a film forming device and vapor deposition is performed from the holding plate (6) side, a highly accurate thin film pattern can be formed on the substrate (5). However, when the distance between the evaporation source and the substrate is long and the area of the evaporation source is small, such as in resistance heating evaporation or electron beam evaporation, the mask (4) is used.
There is no need to bring the edges of the pattern (4a) into contact with the substrate (5), and the thin film pattern can be formed on the substrate with high precision even if they are a little apart. In a film forming apparatus where the pressure during film forming is 10 TorrlH, such as a reactive evaporation method that introduces If the mask (4) is separated from the substrate (5), particles incident on the back side of the mask (4) may enter the mask (4), and the mask (4) becomes a shadow, making the formed thin film pattern unclear. Furthermore, if the edges of the pattern (4a) of the mask (4) are not formed vertically, they will similarly form shadows and the thin film pattern will become unclear.

Note that it is also possible to make the area of the mask (4) larger than the area of the substrate (5) and to slightly lift the protruding portion of the mask (4) so that it does not come into contact with the substrate (G). (4) becomes large and the number of substrates arranged in the film forming apparatus decreases, which is undesirable because the throughput decreases.

In addition, in the above-mentioned embodiment, the board fixing bin (6
) and the holding plate support bin (l14) are fixed at the stage (1η), but as in another embodiment shown in FIG.
A similar effect can be obtained by fixing it to (to).

Further, the plurality of protrusions (4b) provided on the mask (4) may be formed by press working as described above, or may be attached to separate small pieces by welding or the like.

〔Effect of the invention〕

As described above, the alignment device of the mask film forming apparatus of the present invention does not contact the thin film pattern already formed on the substrate (5) on the surface of the mask (4) facing the substrate (5). A plurality of protrusions (4b) are provided at the positions, and the edge part of the pattern (4a) of the mask (4) is pressed against the substrate (5) by the spring part 0→. Since there is no gap between the substrate (5) and the substrate (51K), not only the edges of the thin film pattern to be formed on the substrate (51K) become extremely clear, but also the protrusions (4b) provided on the mask (4) Amabuha l L-If
Since it is provided at a position where it does not come into contact with the 9-pattern E and the 1-hanshin wa ζ curly, it has an excellent effect of not damaging the thin film pattern.

[Brief explanation of drawings]

Figures 1 to 3 all show one embodiment of the present invention, with Figure 1 being a side view, Figure 2 being an enlarged sectional view of the firefly, and Figure 3 being an enlarged sectional view of the firefly.
The figure is a plan view. FIG. 4 is a sectional view showing another embodiment of the present invention, and FIG. 5 is a sectional view showing a conventional positioning device for a film forming apparatus. In the figure, (4) is a mask, (4a) is a pattern of the mask, (4b) is a protrusion, (5) is a substrate, (l→ is a spring,
This is an αI press plate. Note that the same group numbers in Figure 1 indicate the same or equivalent parts. Agent Patent Attorney Tadashi Sato Figure 1 18. 19, Misaki Flood

Claims (4)

[Claims] (1) A plurality of protrusions are provided on the surface of the mask facing the substrate at positions that do not contact thin film patterns already formed on the substrate, and the edge portions of the mask pattern are pressed against the substrate by springs. 1. A positioning device for a mask film forming apparatus, characterized in that no gap is created between an edge portion of a mask pattern and a substrate. (2) The positioning device for a mask film forming apparatus according to claim 1, wherein the spring is a leaf spring. (3) The protrusions formed on the mask are formed by extruding the mask itself by press working, or by attaching other small pieces by welding, Claim 1 A positioning device for the mask film forming device described above. (4) The positioning device for a mask film forming apparatus according to claim 1, wherein the material of the mask is stainless steel.