JPS62160553U - - Google Patents
Info
- Publication number
- JPS62160553U JPS62160553U JP4948086U JP4948086U JPS62160553U JP S62160553 U JPS62160553 U JP S62160553U JP 4948086 U JP4948086 U JP 4948086U JP 4948086 U JP4948086 U JP 4948086U JP S62160553 U JPS62160553 U JP S62160553U
- Authority
- JP
- Japan
- Prior art keywords
- opening
- tie bar
- side edge
- lead
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4948086U JPS62160553U (pt-PT) | 1986-04-02 | 1986-04-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4948086U JPS62160553U (pt-PT) | 1986-04-02 | 1986-04-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62160553U true JPS62160553U (pt-PT) | 1987-10-13 |
Family
ID=30871967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4948086U Pending JPS62160553U (pt-PT) | 1986-04-02 | 1986-04-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62160553U (pt-PT) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023536011A (ja) * | 2021-06-28 | 2023-08-23 | ヘソン・ディーエス・カンパニー・リミテッド | 溝が形成されたリードを含むリードフレーム |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57197844A (en) * | 1981-05-29 | 1982-12-04 | Nec Corp | Semiconductor device |
| JPS58127356A (ja) * | 1982-01-26 | 1983-07-29 | Nippon Texas Instr Kk | 半導体集積回路の樹脂封止法およびそのために用いるリ−ドフレ−ム |
| JPS5936955A (ja) * | 1982-08-25 | 1984-02-29 | Shinko Electric Ind Co Ltd | リ−ドフレ−ム |
-
1986
- 1986-04-02 JP JP4948086U patent/JPS62160553U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57197844A (en) * | 1981-05-29 | 1982-12-04 | Nec Corp | Semiconductor device |
| JPS58127356A (ja) * | 1982-01-26 | 1983-07-29 | Nippon Texas Instr Kk | 半導体集積回路の樹脂封止法およびそのために用いるリ−ドフレ−ム |
| JPS5936955A (ja) * | 1982-08-25 | 1984-02-29 | Shinko Electric Ind Co Ltd | リ−ドフレ−ム |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023536011A (ja) * | 2021-06-28 | 2023-08-23 | ヘソン・ディーエス・カンパニー・リミテッド | 溝が形成されたリードを含むリードフレーム |