JPS6216017B2 - - Google Patents
Info
- Publication number
- JPS6216017B2 JPS6216017B2 JP59182619A JP18261984A JPS6216017B2 JP S6216017 B2 JPS6216017 B2 JP S6216017B2 JP 59182619 A JP59182619 A JP 59182619A JP 18261984 A JP18261984 A JP 18261984A JP S6216017 B2 JPS6216017 B2 JP S6216017B2
- Authority
- JP
- Japan
- Prior art keywords
- tool
- bonding
- movement
- arm
- speed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
- H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
Landscapes
- Wire Bonding (AREA)
- Manipulator (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59182619A JPS6074447A (ja) | 1984-09-03 | 1984-09-03 | ワイヤボンデイング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59182619A JPS6074447A (ja) | 1984-09-03 | 1984-09-03 | ワイヤボンデイング装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6002276A Division JPS52143946A (en) | 1976-05-26 | 1976-05-26 | Mechanism for elevationally moving bonding arm |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6074447A JPS6074447A (ja) | 1985-04-26 |
| JPS6216017B2 true JPS6216017B2 (cg-RX-API-DMAC7.html) | 1987-04-10 |
Family
ID=16121453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59182619A Granted JPS6074447A (ja) | 1984-09-03 | 1984-09-03 | ワイヤボンデイング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6074447A (cg-RX-API-DMAC7.html) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0715932B2 (ja) * | 1985-09-05 | 1995-02-22 | 松下電器産業株式会社 | チップ部品移載装着装置 |
| JPS62150838A (ja) * | 1985-12-25 | 1987-07-04 | Hitachi Ltd | 検出方法および装置 |
| JPH0719828B2 (ja) * | 1986-03-14 | 1995-03-06 | 東芝精機株式会社 | ペレット突き上げ方法 |
-
1984
- 1984-09-03 JP JP59182619A patent/JPS6074447A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6074447A (ja) | 1985-04-26 |