JPS62157153U - - Google Patents
Info
- Publication number
- JPS62157153U JPS62157153U JP1986045421U JP4542186U JPS62157153U JP S62157153 U JPS62157153 U JP S62157153U JP 1986045421 U JP1986045421 U JP 1986045421U JP 4542186 U JP4542186 U JP 4542186U JP S62157153 U JPS62157153 U JP S62157153U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- supply section
- bonding
- bonding head
- chip supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/0711—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986045421U JPS62157153U (enExample) | 1986-03-26 | 1986-03-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986045421U JPS62157153U (enExample) | 1986-03-26 | 1986-03-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62157153U true JPS62157153U (enExample) | 1987-10-06 |
Family
ID=30864145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986045421U Pending JPS62157153U (enExample) | 1986-03-26 | 1986-03-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62157153U (enExample) |
-
1986
- 1986-03-26 JP JP1986045421U patent/JPS62157153U/ja active Pending