JPS62155544A - 混成集積回路 - Google Patents

混成集積回路

Info

Publication number
JPS62155544A
JPS62155544A JP60295704A JP29570485A JPS62155544A JP S62155544 A JPS62155544 A JP S62155544A JP 60295704 A JP60295704 A JP 60295704A JP 29570485 A JP29570485 A JP 29570485A JP S62155544 A JPS62155544 A JP S62155544A
Authority
JP
Japan
Prior art keywords
input
output terminals
conductor pads
mounting
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60295704A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0431186B2 (enExample
Inventor
Yoshitaka Fukuoka
義孝 福岡
Emiko Matsumoto
恵美子 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP60295704A priority Critical patent/JPS62155544A/ja
Publication of JPS62155544A publication Critical patent/JPS62155544A/ja
Publication of JPH0431186B2 publication Critical patent/JPH0431186B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components

Landscapes

  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP60295704A 1985-12-27 1985-12-27 混成集積回路 Granted JPS62155544A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60295704A JPS62155544A (ja) 1985-12-27 1985-12-27 混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60295704A JPS62155544A (ja) 1985-12-27 1985-12-27 混成集積回路

Publications (2)

Publication Number Publication Date
JPS62155544A true JPS62155544A (ja) 1987-07-10
JPH0431186B2 JPH0431186B2 (enExample) 1992-05-25

Family

ID=17824080

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60295704A Granted JPS62155544A (ja) 1985-12-27 1985-12-27 混成集積回路

Country Status (1)

Country Link
JP (1) JPS62155544A (enExample)

Also Published As

Publication number Publication date
JPH0431186B2 (enExample) 1992-05-25

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees