JPS6215320B2 - - Google Patents

Info

Publication number
JPS6215320B2
JPS6215320B2 JP1049478A JP1049478A JPS6215320B2 JP S6215320 B2 JPS6215320 B2 JP S6215320B2 JP 1049478 A JP1049478 A JP 1049478A JP 1049478 A JP1049478 A JP 1049478A JP S6215320 B2 JPS6215320 B2 JP S6215320B2
Authority
JP
Japan
Prior art keywords
solder
amorphous
soldering
foil
tin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1049478A
Other languages
English (en)
Japanese (ja)
Other versions
JPS54103764A (en
Inventor
Tomiro Yasuda
Takashi Fukumaki
Mamoru Sawahata
Tadao Kushima
Isao Ikuta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1049478A priority Critical patent/JPS54103764A/ja
Publication of JPS54103764A publication Critical patent/JPS54103764A/ja
Publication of JPS6215320B2 publication Critical patent/JPS6215320B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302Cu as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Ceramic Products (AREA)
JP1049478A 1978-02-03 1978-02-03 Brazing material Granted JPS54103764A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1049478A JPS54103764A (en) 1978-02-03 1978-02-03 Brazing material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1049478A JPS54103764A (en) 1978-02-03 1978-02-03 Brazing material

Publications (2)

Publication Number Publication Date
JPS54103764A JPS54103764A (en) 1979-08-15
JPS6215320B2 true JPS6215320B2 (enExample) 1987-04-07

Family

ID=11751732

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1049478A Granted JPS54103764A (en) 1978-02-03 1978-02-03 Brazing material

Country Status (1)

Country Link
JP (1) JPS54103764A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6129486U (ja) * 1984-07-26 1986-02-21 助川電気工業株式会社 シ−ス型ヒ−タのアダプタ接続部
JP4804190B2 (ja) * 2006-03-29 2011-11-02 京セラ株式会社 配線基板
CN104551439A (zh) * 2014-11-17 2015-04-29 刘桂芹 一种无铅铜基非晶钎焊料带材
CN104384750A (zh) * 2014-11-17 2015-03-04 刘桂芹 一种无铅铜基非晶钎焊料

Also Published As

Publication number Publication date
JPS54103764A (en) 1979-08-15

Similar Documents

Publication Publication Date Title
TWI226854B (en) Lead-free tin-silver-copper alloy solder composition
CN101896310B (zh) 钎焊接头
US5817194A (en) Tin base soldering/brazing material
US6613123B2 (en) Variable melting point solders and brazes
EP1088615B1 (en) Sn-Ag-Cu solder and surface treatment and parts mounting methods using the same
JP6188511B2 (ja) フラックスレスろう付け用アルミニウム合金ブレージングシートおよびその製造方法
KR20010112627A (ko) Pb를 함유하지 않은 솔더 조성물 및 솔더링된 물품
CN100364711C (zh) 无铅焊料
KR102242388B1 (ko) 땜납 합금, 땜납 접합 재료 및 전자회로 기판
TWI784761B (zh) 無鉛且無銻之焊料合金、焊球、及焊料接頭
CN109642274A (zh) 铝合金硬钎焊板
US3733687A (en) Method of soldering an aluminum metal to an aluminum or another metal
US20070172381A1 (en) Lead-free solder with low copper dissolution
JPS6215320B2 (enExample)
TW202138576A (zh) 無鉛且無銻之焊料合金、焊球,及焊料接頭
JP3081230B2 (ja) ろう付け充填金属として使用される銅合金
US20100059576A1 (en) Tin alloy solder composition
DE69612258T2 (de) Niedrigschmelzende Weichlotlegierung enthaltende Gegenstände
JPH0535207B2 (enExample)
JPH0150518B2 (enExample)
JPS586793A (ja) ろう材
JPH07284983A (ja) 半田材料及びその製造方法
TW202309305A (zh) 焊料合金及焊料接頭
EP1948388A1 (en) Lead-free solder alloy
JP5051633B2 (ja) はんだ合金