JPS62150865A - Electronic device - Google Patents

Abstract

PURPOSE:To improve the heat dissipation efficiency of a semiconductor device by providing a heat sink member in contact with external leads of the device. CONSTITUTION:The leads 2 of a semiconductor device 1 are connected with bonding wirings 4, and composed of inner leads 2B sealed with sealing member 5 and outer leads 2C projected from the member 5. U-shaped heat sink member 6 in contact with the leads 2C is detachably attached to the device 1. The member 6 is composed of a material having a high thermal conductivity and an insulation. Thus, the member 6 in contact with the leads 2C of the device 1 is provided to enhance the heat sink efficiency of the device 1.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to an electronic device, and in particular to a technique that is effective when applied to a technique for dissipating heat generated in a semiconductor device.

[Background Art] In a plastic (resin) sealed semiconductor device, the heat generated by the operation of the semiconductor chip makes the electrical characteristics unstable and reduces its reliability. Therefore, in this type of semiconductor device, the heat of the semiconductor chip is released to the outside of the device through the sealing member and the leads.

More than half of the heat generated is passed through the leads, which have lower thermal resistance than the sealing material, to the board on which the semiconductor device is mounted (mounted board).
Or the heat is radiated to the printed wiring board.

In order to increase heat release efficiency, a technique is generally employed to increase the surface area of the sealing member.

Furthermore, a technique has been adopted in which heat dissipation fins are attached to the sealing member and the heat transferred to the sealing member is efficiently released by the heat dissipation fins.

However, the results of considerations in such technology.

The present inventor found that the above-described technique for increasing heat dissipation efficiency has a problem in that sufficient heat dissipation efficiency cannot be obtained because the sealing member has high thermal resistance.

Regarding the technology for releasing heat generated in semiconductor devices to the outside, see Nikkei Electronics, September 1984, for example.
It is described on pages 279 to 285 of the 24th issue of the month.

[Object of the Invention] An object of the present invention is to provide a technique that can improve the heat dissipation efficiency of a semiconductor device.

Another object of the present invention is to provide a technique that can stabilize the electrical characteristics of a semiconductor device and improve its reliability.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Summary of the Invention] A brief overview of typical inventions disclosed in this application is as follows.

That is, a semiconductor device having external leads.

A heat dissipating member is provided which is in contact with the external lead.

This allows the heat of the semiconductor chip to be transferred to the heat dissipation member through the leads, which have a lower thermal resistance than the sealing member, and allows the heat dissipation member to efficiently dissipate heat, thereby improving the heat dissipation efficiency of the semiconductor device. I can do it. As a result, the electrical characteristics of the semiconductor device can be stabilized and its reliability can be improved.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The structure of the present invention will be described below along with an embodiment in which the present invention is applied to a plastic-sealed semiconductor device.

In addition, in all the figures of the embodiment, parts having the same functions are given the same reference numerals, and repeated explanations thereof will be omitted.

[Example 1] FIG. 1 (perspective view) shows a plastic-sealed semiconductor device as an electronic device, which is Example 2 of the present invention, and FIG. Indicated by Note that, in FIG. 1, a portion of the structure of this embodiment is cut away to make it easier to understand.

The semiconductor device 1 is constructed as shown in FIGS. 1 and 2. In other words, semiconductor device 1f! 1 is a semiconductor chip 3 mounted on a tab lead 2A.

It is comprised of a wire 2 connected to a semiconductor chip 3 via a bonding wire 4, and a sealing member 5 for sealing them.

The lead 2 is connected to a bonding wire 4.

It is composed of an internal lead 2B sealed with a sealing member 5, and an external lead 2C connected to a mounting board or printed wiring board and connected to an external device. The external lead 2C is provided to protrude from the sealing member 5. Lead 2 and double lead 2A are made of, for example, 42 alloy (N
i-Cr alloy), phosphor bronze.

The sealing member 5 is made of a plastic material such as epoxy resin.

A U-shaped heat dissipating member 6 that is in contact with the external lead 2c is detachably attached to this semiconductor device 1. The heat radiating member 6 is held on the semiconductor device 1 by the elasticity of the leads 2 on the U-shaped inner wall. This heat dissipation member 6 is configured to efficiently dissipate heat generated by the operation of the semiconductor chip 3 transferred by the external leads 2C to the outside.

The heat dissipation member 6 is made of a nonmetal 1 having high thermal conductivity and insulating properties, such as silicon carbide, aluminum nitride, and cubic boron nitride. Further, the heat dissipating member 6 may be made of a metal 1 having high thermal conductivity and electrical conductivity, such as aluminum, copper, or silver. In this case.

In order to prevent short circuit between adjacent external leads 20, an insulating material is interposed between each region that contacts the external leads 2C. Further, the heat dissipation member 6 may be made of an alumite-treated metal.

As described above, by providing the heat dissipating member 6 that contacts the external leads 2C of the semiconductor device [1], the heat of the semiconductor chip 3 is transmitted to the heat dissipating member 6 through the leads 2 having a smaller thermal resistance than the sealing member 5, This heat radiating member 6 can efficiently radiate heat.

The heat dissipation efficiency of the semiconductor device 1 can be improved.

Note that the heat dissipation member 6 may be configured to be detachably attached by sandwiching the upper and lower surfaces of the sealing member 5, or may be fixed to the sealing member 5 with an adhesive or the like.

[Example 2] Example 2 is another example of the present invention in which the present invention is applied to a plurality of plastic type semiconductor devices mounted on a mounting board (mounting board) or a printed wiring board.

FIG. 3 (perspective view) shows a plastic-sealed semiconductor device according to Embodiment (2) of the present invention, and FIG. 4 shows a cross section taken along line rV--(2) in FIG.

A plurality of plastic type semiconductor devices 1 of this embodiment (2) are mounted on a mounting board (or printed wiring board) 7, as shown in FIGS. 3 and 4. The tower mounting board 7 is, for example,
It is made of silicon carbide and ceramic, and its surface is covered with wiring made of aluminum, copper, etc.

A heat dissipating mesh 6 is provided between the semiconductor devices l1ff1 and comes in contact with external leads 2C that regularly protrude from one side end of each. The heat radiation member 6 is configured to increase the heat radiation area. This heat dissipation member 6 is detachably attached to the tower mounting board 7 with screws 8.

In this manner, by providing the heat dissipating member 6 in contact with the external lead 2C between the semiconductor devices 1, substantially the same effect as in Example I can be obtained.

In addition, the heat dissipation member 6 is composed of two heat dissipation members 6A and 6 with one elastic member 6C interposed therebetween, as shown in FIG.
It may be composed of B. Heat dissipation member 6 configured in this way
The heat dissipating members 6A and 6B can be moved in the directions of arrows A and B by the elastic member 6C, thereby ensuring reliable contact with the external lead 2C.

In this embodiment (2), one heat dissipation member 6 is provided for two semiconductor devices 1, but the present invention is not limited to this, and the number of heat dissipation members 6 may be appropriately selected depending on the required amount of heat dissipation.

[Effects] As explained above, according to the novel technology disclosed in the present application, the following effects can be obtained.

(1) By providing a heat dissipation member in contact with the external leads of a semiconductor device having external leads, the heat of the semiconductor chip is transmitted to the heat dissipation member through the leads having a lower thermal resistance than the sealing member, and this heat dissipation member can be used efficiently. Since heat can be effectively radiated, the heat radiating efficiency of the semiconductor device can be improved.

(2) According to (1) above, the electrical characteristics of the semiconductor device can be stabilized and its reliability can be improved.

As above, the invention made by the present inventor has been specifically explained based on the above embodiments, but the present invention is not limited to the above embodiments, and can be modified in various ways without departing from the gist thereof. Of course.

For example, the present invention applies not only to a dual-in-line type plastic-sealed semiconductor device with external leads protruding in two directions, but also to an electronic device including a flat-package type plastic-sealed semiconductor device with external leads protruding in four directions. It can also be applied to

Furthermore, the present invention can be applied not only to plastic-sealed semiconductor devices but also to ceramic-sealed semiconductor devices.

Furthermore, in the present invention, a heat radiating member that contacts the sealing member may be provided in addition to a heat radiating member that contacts the external lead.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a plastic-sealed semiconductor device according to an embodiment (2) of the present invention, and FIG. 2 is a cross-sectional view taken along the line (2)--(2) in FIG. FIG. 3 is a perspective view of a plastic-sealed semiconductor device which is an embodiment of the present invention. FIG. 4 is a cross-sectional view taken along the rV-rV line in FIG.
The figure is a sectional view of a main part of a heat radiating member which is another embodiment of the embodiment (2) of the present invention. In the figure, l: semiconductor device, 2: lead, 2B...
Internal lead, 2C...External lead, 3...Semiconductor chip. 4... bonding wire, 5... sealing member, 6,
6A, 6B... Heat dissipation member, 6C... Elastic member. Agent: Patent Attorney Katsuma Ogawa, 7″ Figure 1 Figure 2 Figure 3 Figure 4 Figure 5

Claims (1)

[Scope of Claims] 1. An electronic device comprising: a semiconductor device having external leads protruding from a sealing member; and a heat dissipating member having a heat dissipating member in contact with the external leads. 2. The electronic device according to claim 1, wherein the heat dissipation member is provided on a semiconductor device body or a substrate on which the semiconductor device is mounted. 3. The electronic device according to claim 1, wherein the heat dissipation member is in contact with some or all of the external leads. 4. The electronic device according to claim 1, wherein the heat radiating member is made of an insulating material with high thermal conductivity. 5. The electronic device according to claim 1, wherein the heat dissipation member is made of a conductive material with high thermal conductivity that is electrically isolated from other external leads.